AC SERIES, 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, CDFP24, CERAMIC, FP-24
| 参数名称 | 属性值 |
| 包装说明 | DFP, FL24,.4 |
| Reach Compliance Code | unknown |
| 其他特性 | WITH DIRECTION CONTROL |
| 控制类型 | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL |
| 系列 | AC |
| JESD-30 代码 | R-GDFP-F24 |
| 长度 | 15.4305 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER |
| 最大I（ol） | 0.024 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 15 ns |
| 传播延迟（tpd） | 20 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.286 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 翻译 | N/A |
| 触发器类型 | POSITIVE EDGE |
| Base Number Matches | 1 |
| 54AC646FM | 54AC646SDM | 54AC646LM | |
|---|---|---|---|
| 描述 | AC SERIES, 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, CDFP24, CERAMIC, FP-24 | AC SERIES, 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | AC SERIES, 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, CQCC28, CERAMIC, LCC-28 |
| 包装说明 | DFP, FL24,.4 | DIP, DIP24,.3 | QCCN, |
| Reach Compliance Code | unknown | unknow | unknown |
| 其他特性 | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL |
| 系列 | AC | AC | AC |
| JESD-30 代码 | R-GDFP-F24 | R-GDIP-T24 | S-CQCC-N28 |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER |
| 位数 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DIP | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | IN-LINE | CHIP CARRIER |
| 传播延迟（tpd） | 20 ns | 20 ns | 20 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.286 mm | 5.715 mm | 1.905 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 |
| 控制类型 | INDEPENDENT CONTROL | INDEPENDENT CONTROL | - |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | - |
| 长度 | 15.4305 mm | - | 11.43 mm |
| 负载电容（CL） | 50 pF | - | 50 pF |
| 最大I（ol） | 0.024 A | 0.024 A | - |
| 封装等效代码 | FL24,.4 | DIP24,.3 | - |
| 电源 | 3.3/5 V | 3.3/5 V | - |
| 翻译 | N/A | N/A | - |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | - |
| 宽度 | - | 7.62 mm | 11.43 mm |
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