IC,LOGIC GATE,QUAD 2-INPUT NAND,LS-TTL,LLCC,20PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown |
| JESD-30 代码 | S-XQCC-N20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | NAND GATE |
| 最大I（ol） | 0.012 A |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-COLLECTOR |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 最大电源电流（ICC） | 12 mA |
| Prop。Delay @ Nom-Sup | 32 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 54LS38/B2AJC | SN54LS38J | SN74LS38J | SN74LS38JD | SN54LS38W | 54LS38/BDAJC | |
|---|---|---|---|---|---|---|
| 描述 | IC,LOGIC GATE,QUAD 2-INPUT NAND,LS-TTL,LLCC,20PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,LS-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,LS-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,LS-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,LS-TTL,FP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,LS-TTL,FP,14PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DFP, FL14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | S-XQCC-N20 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDFP-F14 | R-XDFP-F14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 端子数量 | 20 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | - | - | -55 °C | -55 °C |
| 输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | QCCN | DIP | DIP | DIP | DFP | DFP |
| 封装等效代码 | LCC20,.35SQ | DIP14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 | FL14,.3 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 施密特触发器 | NO | NO | NO | NO | NO | NO |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
| 最大I（ol） | 0.012 A | 0.012 A | 0.024 A | - | - | 0.012 A |
| Prop。Delay @ Nom-Sup | 32 ns | 32 ns | 32 ns | - | - | 56 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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