CERAMIC CHIP/CAPACITORS
Tin Lead L Termination
FEATURES
KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the
commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead elec-
troplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the
electronics industry marches to RoHS compliance it is important that KEMET provide the Tin/Lead terminated products for
our valued high reliability and military customers.
KEMET Tin/Lead MLCC surface mount capacitors are available in standard EIA case sizes from 0402 to 2225 and standard
KEMET Tiin/Lead MLCC surface mount capacitors are available
range from 6.3V to 200V. To order the Tin/Lead
and standard
capacitance values in X7R and C0G dielectrics. Voltage ratings
in standard EIA case sizes from 0402 to 2225
terminations
capacitance values in X7R, X5R,
the part number.
Voltage ratings
L Series termination
200V. To order the Tin/Lead termina-
(Open
indicate an “L” in the 14
th
digit
th
of
C0G dielectrics.
To request the
range from 6.3V to
for other surface mount product lines
tions indicate an “L” in the 14 digit of the part number. For additional dielectrics and voltage ratings please contact
local Sales
Mode, High Voltage, Arrays, etc.) or for additional dielectrics and higher voltage ratings, please contact the factory or
the fac-
tory or local Sales personnel.
representative.
CAPACITOR OUTLINE DRAWINGS
W
T
S
ELECTRODES
L
B
NICKEL PLATE
CONDUCTIVE METALLIZATION
Sn/Pb
PLATE
DIMENSIONS—MILLIMETERS AND (INCHES)
EIA SIZE
CODE
0201*
0402*
0603
0805*
1206*
1210*
1808
1812
1825*
2220
2225
METRIC
SIZE CODE
0603
1005
1608
2012
3216
3225
4520
4532
4564
5650
5664
L - LENGTH
0.6 (.024) ± .03 (.001)
1.0 (.04) ± .05 (.002)
1.6 (.063) ± .15 (.006)
2.0 (.079) ± .20 (.008)
3.2 (.126) ± .20 (.008)
3.2 (.126) ± .20 (.008)
4.5 (.177) ± .30 (.012)
4.5 (.177) ± .30 (.012)
4.5 (.177) ± .30 (.012)
5.6 (.220) ± .40 (.016)
5.6 (.220) ± .40 (.016)
W - WIDTH
0.3 ± (.012) ± .03 (.001)
0.5 (.02) ± .05 (.002)
0.8 (.032) ± .15 (.006)
1.25 (.049) ± .20 (.008)
1.6 (.063) ± .20 (.008)
2.5 (.098) ± .20 (.008)
2.0 (.079) ± .20 (.008)
3.2 (.126) ± .30 (.012)
6.4 (.252) ± .40 (.016)
5.0 (.197) ± .40 (.016)
6.3 (.248) ± .40 (.016)
See page 78
for thickness
dimensions.
T
THICKNESS
B - BANDWIDTH
0.15 (.006) ± .05 (.002)
0.20 (.008) -.40 (.016)
0.35 (.014) ± .15 (.006)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
S
SEPARATION
minimum
N/A
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
Solder Reflow
N/A
Solder Wave +
or
Solder Reflow
MOUNTING
TECHNIQUE
Solder Reflow
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 96.)
† For extended value 1210 case size – solder reflow only.
CAPACITOR ORDERING INFORMATION
(Standard Chips - For
C 0805 C 103 K 5 R A L*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF J – ±5%
C – ±0.25pF K – ±10%
D – ±0.5pF
M – ±20%
F – ±1%
G – ±2%
* Part Number Example: C0805C103K5RAL
Military see page 87)
END METALLIZATION
L - SnPb plated nickel barrier
(SnPb 5% minimum)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P – X5R (±15%) (-55°C + 85°C)
VOLTAGE
1 - 100V
3 - 25V
2 - 200V
4 - 16V
5 - 50V
8 - 10V
9 - 6.3V
6 - 35V
77
(14 digits - no spaces)
Refer to pages
73-76
for NP0/C0G, X7R and X5R dielectric capacitance ranges available.
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Ceramic Surface Mount
CERAMIC CHIP CAPACITORS
Thickness Code Reference Chart
Packaging Quantity Based on Finished Chip Thickness Specifications
Thickness
Code
AA
BB
CB
CC
CD
DB
DC
DD
DE
DF
DG
DH
DJ
DK
DL
EB
EC
ED
EE
EF
EG
EH
EJ
EK
EL
EM
EN
FB
FC
FD
FE
FF
FG
FH
FJ
FK
FL
FM
FN
FO
FP
FQ
FR
FS
FT
LD
GB
GC
GD
GE
GF
GG
GH
GJ
GK
GL
GM
GN
GO
HB
HC
HD
HE
HF
JB
JC
JD
JE
JF
JG
JH
JO
KB
KC
KD
KE
Chip
Size
0201
0402
0603
0603
0603
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
1206
1206
1206
1206
1206
1206
1206
1206
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1808
1812
1812
1812
1812
1812
1812
1812
1812
1812
1812
1812
1812
1812
1825
1825
1825
1825
1825
2220
2220
2220
2220
2220
2220
2220
2220
2225
2225
2225
2225
Chip Thickness
Range (mm)
0.30 ± 0.03
0.50 ± 0.05
0.80 ± 0.07
0.80 ± 0.10
0.80 ± 0.15
0.60 ± 0.10
0.78 ± 0.10
0.90 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.25 ± 0.20
1.25 ± 0.20
1.25 ± 0.15
0.95 ± 0.10
0.78 ± 0.10
0.90 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
1.20 ± 0.15
1.60 ± 0.15
1.60 ± 0.20
1.70 ± 0.20
0.80 ± 0.10
1.15 ± 0.15
1.25 ± 0.15
0.95 ± 0.10
0.78 ± 0.10
0.90 ± 0.10
0.95 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.55 ± 0.15
1.85 ± 0.20
2.10 ± 0.20
1.40 ± 0.15
1.70 ± 0.20
1.85 ± 0.20
1.50 ± 0.20
1.60 ± 0.20
2.50 ± 0.22
2.25 ± 0.20
2.50 ± 0.20
1.90 ± 0.20
0.90 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.30 ± 0.10
1.50 ± 0.10
1.55 ± 0.10
1.40 ± 0.15
1.70 ± 0.15
1.60 ± 0.20
1.90 ± 0.20
2.00 ± 0.20
1.70 ± 0.20
2.50 ± 0.20
1.10 ± 0.15
1.15 ± 0.15
1.30 ± 0.15
1.40 ± 0.15
1.50 ± 0.15
1.00 ± 0.15
1.10 ± 0.15
1.30 ± 0.15
1.40 ± 0.15
1.50 ± 0.15
1.70 ± 0.15
1.80 ± 0.15
2.40 ± 0.15
1.00 ± 0.15
1.10 ± 0.15
1.30 ± 0.15
1.40 ± 0.15
Qty per Reel
7" Plastic
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
2,500
2,500
2,500
2,500
3,000
3,000
4,000
4,000
4,000
2,500
2,500
2,500
2,000
2,000
2,000
2,000
2,000
2,500
4,000
4,000
4,000
4,000
2,500
2,500
2,500
2,000
2,000
2,000
2,000
2,000
2,000
2,000
2,000
1,500
2,000
1,000
1,500
4,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
1,000
1,000
1,000
1,000
Qty per Reel
13" Plastic
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
10,000
10,000
10,000
10,000
N/A
N/A
10,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
8,000
8,000
8,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
8,000
8,000
8,000
8,000
8,000
8,000
N/A
8,000
4,000
4,000
10,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
N/A
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
4,000
4,000
4,000
4,000
Qty per Reel
7" Paper
15,000
10,000
4,000
4,000
4,000
4,000
4,000
4,000
N/A
N/A
N/A
N/A
N/A
N/A
N/A
4,000
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Qty per Reel
13" Paper
N/A
50,000
10,000
10,000
10,000
10,000
10,000
10,000
N/A
N/A
N/A
N/A
N/A
N/A
N/A
10,000
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Qty per Bulk
Cassette
N/A
50,000
15,000
N/A
N/A
10,000
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
This chart refers to ceramic chip thickness codes on pages 73 – 76.
Note: TU suffix represents tape and reel packaging of unmarked components.
Note: TM suffix represents tape and reel packaging of marked components.
Thisart refers to ceramic chip
8mm tape with 4mm pitch and Case Sizes >1210 are 12mm tape and 8mm pitch.
ch
Cases sizes 1210 are
thickness codes on pages
73-76.
78
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
for details on reeling quantities for commercial chips
and page 87 for MIL-PRF-55681 chips.
g
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
Anti-Static Reel
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
®
T
ME
KE
Embossment
8mm
±.30
(.315
±.012")
or
12mm
±.30
(.472
±.012")
178mm (7.00")
or
330mm (13.00")
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
* Punched paper carrier used for 0402 and 0603 case size.
Case Sizes
≤
1210 are 8 mm tape with 4 mm pitch.
Case Sizes
>1210
are 12 mm tape with 8 mm pitch.
Note:
TU suffix represents tape and reel packaging of unmarked components.
TM suffix represents tape and reel packaging of marked components.
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
Grid
Grid
placement
courtyard
Placement
Reflow Solder
Dimension
0402
0603
0805
1206
1210
1812
1825
2220
2225
Z
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
G
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
X Y(ref) C(ref)
0.74 0.93 1.21
1.08 1.05 1.73
1.60 1.30 2.00
2.00 1.50 3.00
2.90 1.50 3.00
3.70 1.80 4.10
6.90 1.80 4.10
5.50 1.85 5.15
6.80 1.85 5.15
Z
3.18
3.70
4.90
4.90
G
Wave Solder
X
0.80
1.10
1.40
2.00
Y(ref) Smin
1.25
1.50
1.70
1.70
1.93
2.20
3.20
3.20
Not Recommended
Courtyard
C
C
0.68
0.70
1.50
1.50
X
X
Not Recommended
G
G
Y
Z
Z
Y
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
93
Packaging
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Performance Notes
1. Cover Tape Break Force:
1.0 Kg Minimum.
2. Cover Tape Peel Strength:
The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 Newton to 1.0 Newton (10g to 100g)
12 mm
0.1 Newton to 1.3 Newton (10g to 130g)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier
tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape
shall be pulled at a velocity of 300 ±10 mm/minute.
3. Reel Sizes:
Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")
reels (with C-7280). Note that 13” reels are preferred.
4. Labeling:
Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.
Refer to EIA-556.
Embossed Carrier Tape Configuration:
Figure 1
Table 1 — EMBOSSED TAPE DIMENSIONS
(Metric will govern)
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
and
12 mm
D
0
E
P
0
4.0 ±0.10
(0.157 ±0.004)
P
2
2.0 ±0.05
(0.079 ±0.002)
T Max
0.600
(0.024)
T
1
Max
0.100
(0.004)
1.5
1.75 ±0.10
+0.10 -0.0
(0.059
(0.069 ±0.004)
+0.004, -0.0)
Pitch
Single
(4 mm)
B
1
Max.
Note 1
4.4
(0.173)
12 mm
Double
(8 mm)
8.2
(0.323)
D
1
Min.
Note 2
1.0
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
F
3.5 ±0.05
P
1
4.0 ±0.10
R Min.
Note 3
25.0
T
2
Max
2.5
(0.098)
W
8.0 ±0.30
(.315 ±0.012)
A
0
B
0
K
0
Note 4
(0.039) (0.138 ±0.002)
1.5
5.5 ±0.05
(0.059) (0.217 ±0.002)
(0.157 ±0.004) (0.984)
8.0 ±0.10
30.0
(0.315 ±0.004) (1.181)
4.6
12.0 ±0.30
(0.181) (0.472 ±0.012)
NOTES
1. B1 dimension is a reference dimension for tape feeder clearance only.
2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location and hole location shall be applied independent of each other.
3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require
additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)
4. The cavity defined by A
0
,
B
0
,
and K
0
shall be configured to surround the part with sufficient clearance such that the chip does not pro-
trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical
restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm
maximum in the pocket (not applicable to vertical clearance.)
94
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Embossed Carrier Tape Configuration (cont.)
20°
Sketch D:
Tape Camber (Top View)
1mm (0.039) Max.
250mm (9.843)
Allowable camber to be 1 mm/250 mm.
1mm (0.039) Max.
400mm (15.75) Min.
Figure 2:
Tape Leader
& Trailer
Dimensions
(Metric
Dimensions
Will Govern)
Figure 3:
Reel Dimensions (Metric Dimensions will govern)
Table 2 – REEL DIMENSIONS (Metric will govern)
Tape Size
8 mm
A Max
330.0
(12.992)
B* Min
1.5
(0.059)
C
13.0 ± 0.20
(0.512 ± 0.008)
D* Min
20.2
(0.795)
N Min
50.0
(1.969)
See
Note 3
Table 1
W
1
8.4
+1.5, -0.0
(0.331
+0.059, -0.0)
12.4
+2.0, -0.0
(0.488
+0.078, -0.0)
W
2
Max
14.4
(0.567)
W
3
7.9 Min
(0.311)
10.9 Max
(0.429)
11.9 Min
(0.469)
15.4 Max
(0.606)
12 mm
330.0
(12.992)
1.5
(0.059)
13.0 ± 0.20
(0.512 ± 0.008)
20.2
(0.795)
18.4
(0.724)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
95
Packaging
FPGA/CPLD
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