电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

SEAF-40-01-L-10-2-RA-GP

产品描述Board Connector, 400 Contact(s), 10 Row(s), Male, Right Angle, 0.05 inch Pitch, Surface Mount Terminal, Locking, Black Insulator
产品类别连接器    连接器   
文件大小1MB,共5页
制造商SAMTEC
官网地址http://www.samtec.com/
下载文档 详细参数 全文预览

SEAF-40-01-L-10-2-RA-GP概述

Board Connector, 400 Contact(s), 10 Row(s), Male, Right Angle, 0.05 inch Pitch, Surface Mount Terminal, Locking, Black Insulator

SEAF-40-01-L-10-2-RA-GP规格参数

参数名称属性值
Reach Compliance Codecompliant
主体宽度0.312 inch
主体深度0.592 inch
连接器类型BOARD CONNECTOR
联系完成配合AU ON NI
联系完成终止TIN OVER NICKEL
触点性别MALE
触点材料PHOSPHOR BRONZE
触点模式RECTANGULAR
触点电阻17.1 mΩ
耐用性100 Cycles
绝缘体颜色BLACK
绝缘体材料LIQUID CRYSTAL POLYMER (LCP)
制造商序列号SEAF
插接触点节距0.05 inch
安装选项1LOCKING
安装方式RIGHT ANGLE
安装类型BOARD
连接器数ONE
PCB行数10
装载的行数10
最高工作温度125 °C
最低工作温度-55 °C
PCB接触模式RECTANGULAR
电镀厚度10u inch
极化密钥POLARIZED HOUSING
额定电流(信号)2.1 A
参考标准UL
可靠性COMMERCIAL
端子节距1.27 mm
端接类型SURFACE MOUNT
触点总数400
Base Number Matches1

文档预览

下载PDF文档
REVISION Y
"H" REF (SEE TABLE 3)
"M" REF
SEAF-XX-XX-X-XX-X-RA-XX-TR
No OF POSITIONS
-20,-30,-40,-50
(PER ROW)
LEAD STYLE
-01
"A"
DO NOT
SCALE FROM
THIS PRINT
PACKAGING
-TR: TAPE & REEL
(STANDARD PACKAGING)
(SEE NOTE 4 & 7)
.522 13.26 (TYP)
TO WAFER
C
PLATING SPECIFICATION
-S: SELECTIVE GOLD,
30µ GOLD, MATTE TIN ON TAILS
(USE SUB-IM-C-242-XX-S-X)
-L: LIGHT SELECTIVE GOLD,
10µ GOLD, MATTE TIN ON TAILS
(USE SUB-IM-C-242-XX-L-X)
No OF ROWS
-04,-06,*-08,*-10
(* = SEE NOTE 8)
"A"
.592 15.04
REF
"F" REF
C
L
.060 1.52
REF
OPTIONS
-GP: GUIDE POST HOLE
-LP: LATCH POST
(USE WITH SEAC ONLY)
(-06 ROW ONLY)
(NOT AVAILABLE WITH -GP OPTION)
-K: KAPTON PAD
RIGHT ANGLE
-RA
SOLDER COMPOSITION
C
& STYLE
-1: 63% TIN / 37% LEAD CHARGE TAIL
(USE SUB-IM-C-242-XX-XX-X-1)
-2: 95.5% TIN / 3.8 SILVER / 0.7% COPPER
LEAD FREE CHARGE TAIL
(USE SUB-IM-C-242-XX-XX-X-2)
"G" REF
"B" REF
"A"
C
.0500 1.270 (TYP)
(TOL NON-ACCUM)
C
"G"
PIN 04
.050 1.27 REF
.241 6.12
REF
.035 0.89 REF
.100 2.54 REF
.140±.007 3.55±0.18
C
C
C
L
.0500 1.270 (TYP)
"N"±.007 (SEE SECTION E-E)
(SEE NOTE 9)
"D"
C
L
C
C
PIN 01
"G"
(SEE SHT. 2)
.025 0.64
REF. (TYP)
"E" (REF)(ALIGNMENT PIN CENTERS)
PIN 01
.044 1.12
REF
.315 7.99
REF
(A-PIN C )
L
'J'
.044 1.12
NOTES:
"E"
"E"
PIN 04
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. MINIMUM PUSH-OUT FORCE: .50 LBS[2.2N].
3. INSPECT DIMENSION AT FIRST POSITION WAFER LOCATION ONLY, FIRST AND LAST PIN.
4. ONLY FULL REEL QUANTITIES ARE SHIPPED ON A REEL WITH LEADER AND TRAILER.
5. NOTE DELETED
6. NOTE DELETED
7. ATTACH LABEL "SEAX-0001" TO EACH TAPE & REEL PACKAGE.
8. ON -08 & -10 ROW ASSEMBLIES, SEE FIG 10, SHEET 5 FOR CAT FIXTURE VIEW.
9. CHECK DIMENSION ON FIRST AND LAST ROW OF TAILS.
10. A 20~30°C TEMPERATURE DIFFERENCE MAY EXIST BETWEEN THIS HIGH-DENSITY
COMPONENT AND THE BOARD SURFACE DURING REFLOW. SAMTEC RECOMMENDS
A THERMAL STUDY BE PERFORMED TO UNDERSTAND THE TEMPERATURE GRADIENTS YOU
MAY EXPERIENCE.
11. SOME RELAXATION/WARPING OF THE BACK STRAP IS ACCEPTABLE AFTER PROCESSING.
12. SEE SHEET 5 FOR PROCESSING INFORMATION.
13. VOID PATTERN MAY VARY BY ROW AND END OPTION.
(SEAF-20-01-X-04-X-RA-GP)
(SOME DETAIL OMITTED FOR CLARITY)
FIG 1
.034 0.86 REF
SEE NOTE 13
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01 [.3]
2
.XXX: .005 [.13]
.XXXX: .0020 [.051]
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
INSULATOR: LCP COLOR: BLACK
CONTACT: PHOS BRONZE .006 THICK
SEAF-RA ASSEMBLY
DWG. NO.
DESCRIPTION:
SEAF-XX-XX-X-XX-X-RA-XX-TR
12/15/2007
SHEET
1
OF
5
BY:
C. PIERCE
F:\DWG\MISC\MKTG\SEAF-XX-XX-X-XX-X-RA-XX-TR-MKT.SLDDRW
EEWORLD大学堂----直播回放:ADI MEMS 传感器开启条件状态监测的新纪元
直播回放:ADI MEMS 传感器开启条件状态监测的新纪元:https://training.eeworld.com.cn/course/5137...
hi5 综合技术交流
RS485接口图及其与PIC单片机通信源程序
RS485接口图及其与PIC单片机通信源程序...
芝锐 Microchip MCU
你无道,我讥嘲
昨天(8月11日)去拍的照片。 https://bbs.eeworld.com.cn/attachments/month_1308/20130812zihihcdgq4jvnjwc.jpg 照片中的牌子上写的是: 服务宗旨 你粗暴,我礼貌 你冷漠,我热 ......
wangfuchong 聊聊、笑笑、闹闹
导致你的敏捷开发项目失败的 5 个原因(转)
太多的敏捷开发项目失败。这很难甚至精确地测量这么多的软件开发项目失败的次数,因为最终“完成”和发布,即便: 他们花了足够长的时间来构建 构建的质量很差 构建的产品不是 ......
gina 工作这点儿事
硬件工程师必读攻略
硬件工程师必读攻略...
zjw50001 嵌入式系统
我的多核性能需要多少搬家公司?
用类比能解释多核性能: 假设您要搬家,叫了一家搬家公司来帮忙。搬家公司派了一辆卡车和几个壮汉来搬东西。假设这些搬运工人把家里所有东西打包装箱、装车花了 8 个小时。那么问题是,要是 ......
德仪DSP新天地 DSP 与 ARM 处理器

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 59  2267  2153  2505  647  27  29  54  33  21 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved