IC reg ldo 1.2V 0.3A mlp33-5
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 包装说明 | DFP, FL8,.12,25 |
| Reach Compliance Code | unknown |
| 可调性 | FIXED |
| 标称回动电压 1 | 0.4 V |
| 最大绝对输入电压 | 6.5 V |
| JESD-30 代码 | R-PDFP-F8 |
| 输出次数 | 1 |
| 端子数量 | 8 |
| 工作温度TJ-Max | 125 °C |
| 工作温度TJ-Min | -40 °C |
| 最大输出电流 1 | 0.3 A |
| 标称输出电压 1 | 1.2 V |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DFP |
| 封装等效代码 | FL8,.12,25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子形式 | FLAT |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 最大电压容差 | 3.5% |
| Base Number Matches | 1 |
| SI91871DMP-12-E3 | SI91871DMP-18-E3 | SI91871DMP-25-E3 | SI91871DMP-30-E3 | SI91871DMP-28-E3 | SI91871DMP-26-E3 | SI91871DMP-33-E3 | SI91871DMP-50-E3 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC reg ldo 1.2V 0.3A mlp33-5 | IC reg ldo 1.8V 0.3A mlp33-5 | IC reg ldo 2.5V 0.3A mlp33-5 | IC reg ldo 3V 0.3A mlp33-5 | IC reg ldo 2.8V 0.3A mlp33-5 | IC reg ldo 2.6V 0.3A mlp33-5 | IC reg ldo 3.3V 0.3A mlp33-5 | IC reg ldo 5V 0.3A mlp33-5 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | DFP, FL8,.12,25 | DFP, FL8,.12,25 | DFP, FL8,.12,25 | - | DFP, FL8,.12,25 | DFP, FL8,.12,25 | DFP, FL8,.12,25 | DFP, FL8,.12,25 |
| Reach Compliance Code | unknown | unknown | unknown | - | unknown | unknown | unknown | unknown |
| 可调性 | FIXED | FIXED | FIXED | - | FIXED | FIXED | FIXED | FIXED |
| 标称回动电压 1 | 0.4 V | 0.4 V | 0.4 V | - | 0.3 V | 0.3 V | 0.3 V | 0.3 V |
| 最大绝对输入电压 | 6.5 V | 6.5 V | 6.5 V | - | 6.5 V | 6.5 V | 6.5 V | 6.5 V |
| JESD-30 代码 | R-PDFP-F8 | R-PDFP-F8 | R-PDFP-F8 | - | R-PDFP-F8 | R-PDFP-F8 | R-PDFP-F8 | R-PDFP-F8 |
| 输出次数 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 |
| 工作温度TJ-Max | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C |
| 工作温度TJ-Min | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 最大输出电流 1 | 0.3 A | 0.3 A | 0.3 A | - | 0.3 A | 0.3 A | 0.3 A | 0.3 A |
| 标称输出电压 1 | 1.2 V | 1.8 V | 2.5 V | - | 2.8 V | 2.6 V | 3.3 V | 5 V |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DFP | DFP | DFP | - | DFP | DFP | DFP | DFP |
| 封装等效代码 | FL8,.12,25 | FL8,.12,25 | FL8,.12,25 | - | FL8,.12,25 | FL8,.12,25 | FL8,.12,25 | FL8,.12,25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | - | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | - | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | FLAT | FLAT | FLAT | - | FLAT | FLAT | FLAT | FLAT |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | - | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| 最大电压容差 | 3.5% | 3% | 3% | - | 3% | 3% | 3% | 3% |
| Base Number Matches | 1 | 1 | 1 | - | 1 | 1 | - | 1 |
| 最大电网调整率 | - | 0.00324% | 0.0045% | - | 0.00504% | 0.0047% | 0.0099% | 0.01% |
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