IC batt chrgr liion/poly 8dfn
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DFN |
| 包装说明 | HVSON, SOLCC8,.08,20 |
| 针数 | 8 |
| 制造商包装代码 | DDB |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC8,.08,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.1 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电流 (Isup) | 0.00104 mA |
| 标称供电电压 (Vsup) | 3.1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 2 mm |
| LTC4070EDDB#TRPBF | DC1584A | LTC4070EMS8E#TRPBF | LTC4070EMS8E#PBF | LTC4070IDDB#TRMPBF | LTC4070IDDB#TRPBF | LTC4070EDDB#TRMPBF | LTC4070IMS8E#PBF | LTC4070IMS8E#TRPBF | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC batt chrgr liion/poly 8dfn | board evaluation for ltc4070 | IC BATT CHRGR LIION/POLY 8MSOP | IC LIION/POLY BATT CHARGER 8MSOP | IC BATT CHRGR LIION/POLY 8DFN | IC BATT CHRGR LIION/POLY 8DFN | IC LI-ION/POLY BATT CHARGER 8DFN | IC BATT CHRGR LIION/POLY 8MSOP | IC BATT CHRGR LIION/POLY 8MSOP |
| Brand Name | Linear Technology | - | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | DFN | - | MSOP | MSOP | DFN | DFN | DFN | MSOP | MSOP |
| 包装说明 | HVSON, SOLCC8,.08,20 | - | HTSSOP, TSSOP8,.19 | HTSSOP, TSSOP8,.19 | HVSON, SOLCC8,.08,20 | HVSON, SOLCC8,.08,20 | HVSON, SOLCC8,.08,20 | HTSSOP, TSSOP8,.19 | HTSSOP, TSSOP8,.19 |
| 针数 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 制造商包装代码 | DDB | - | MS8E | MS8E | DDB | DDB | DDB | MS8E | MS8E |
| Reach Compliance Code | compliant | - | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | - | YES | YES | YES | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-N8 | - | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | S-PDSO-G8 | S-PDSO-G8 |
| JESD-609代码 | e3 | - | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | - | HTSSOP | HTSSOP | HVSON | HVSON | HVSON | HTSSOP | HTSSOP |
| 封装等效代码 | SOLCC8,.08,20 | - | TSSOP8,.19 | TSSOP8,.19 | SOLCC8,.08,20 | SOLCC8,.08,20 | SOLCC8,.08,20 | TSSOP8,.19 | TSSOP8,.19 |
| 封装形状 | RECTANGULAR | - | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 3.1 V | - | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | - | 1.1 mm | 1.1 mm | 0.8 mm | 0.8 mm | 0.8 mm | 1.1 mm | 1.1 mm |
| 最大供电电流 (Isup) | 0.00104 mA | - | 0.00104 mA | 0.00104 mA | 0.00104 mA | 0.00104 mA | 0.00104 mA | 0.00104 mA | 0.00104 mA |
| 标称供电电压 (Vsup) | 3.1 V | - | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | - | OTHER | OTHER | AUTOMOTIVE | AUTOMOTIVE | OTHER | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | - | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | - | 0.65 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 2 mm | - | 3 mm | 3 mm | 2 mm | 2 mm | 2 mm | 3 mm | 3 mm |
RF/无线
嵌入式系统
玄铁RISC-V活动专区
模拟电子
嵌入式系统
模拟电子
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
