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HIP2100EIBT

产品描述IC driver half bridge 100v 8soic
产品类别半导体    电源管理   
文件大小374KB,共12页
制造商Intersil ( Renesas )
官网地址http://www.intersil.com/cda/home/
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HIP2100EIBT概述

IC driver half bridge 100v 8soic

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®
HIP2100
Data Sheet
April 2, 2010
FN4022.14
100V/2A Peak, Low Cost, High Frequency
Half Bridge Driver
The HIP2100 is a high frequency, 100V Half Bridge
N-Channel power MOSFET driver IC. The low-side and
high-side gate drivers are independently controlled and
matched to 8ns. This gives the user maximum flexibility in
dead-time selection and driver protocol. Undervoltage
protection on both the low-side and high-side supplies force
the outputs low. An on-chip diode eliminates the discrete
diode required with other driver ICs. A new level-shifter
topology yields the low-power benefits of pulsed operation
with the safety of DC operation. Unlike some competitors,
the high-side output returns to its correct state after a
momentary undervoltage of the high-side supply.
Features
• Drives N-Channel MOSFET Half Bridge
• SOIC, EPSOIC, QFN and DFN Package Options
• SOIC, EPSOIC and DFN Packages Compliant with 100V
Conductor Spacing Guidelines of IPC-2221
• Pb-Free Product Available (RoHS Compliant)
• Bootstrap Supply Max Voltage to 114VDC
• On-Chip 1Ω Bootstrap Diode
• Fast Propagation Times for Multi-MHz Circuits
• Drives 1000pF Load with Rise and Fall Times Typ. 10ns
• CMOS Input Thresholds for Improved Noise Immunity
• Independent Inputs for Non-Half Bridge Topologies
• No Start-Up Problems
Ordering Information
PART
NUMBER
(Note 1)
HIP2100IB
HIP2100IBZ
(Note 2)
PART
MARKING
2100 IB
2100 IBZ
TEMP.
RANGE
(°C)
PACKAGE
PKG.
DWG. #
M8.15
M8.15
M8.15C
• Outputs Unaffected by Supply Glitches, HS Ringing Below
Ground, or HS Slewing at High dv/dt
• Low Power Consumption
• Wide Supply Range
• Supply Undervoltage Protection
• 3Ω Driver Output Resistance
• QFN/DFN Package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package Outline
- Near Chip Scale Package Footprint, which Improves
PCB Efficiency and has a Thinner Profile
-40 to +125 8 Ld SOIC
-40 to +125 8 Ld SOIC
(Pb-free)
-40 to +125 8 Ld EPSOIC
(Pb-free)
HIP2100EIBZ 2100 EIBZ
(Note 2)
HIP2100IRZ
(Note 2)
HIP 2100IRZ
-40 to +125 16 Ld 5x5 QFN L16.5x5
(Pb-free)
-40 to +125 12 Ld 4x4 DFN L12.4x4A
(Pb-free)
HIP2100IR4Z 21 00IR4Z
(Note 2)
NOTES:
1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on
reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-
free material sets, molding compounds/die attach materials, and
100% matte tin plate plus anneal (e3 termination finish, which is
RoHS compliant and compatible with both SnPb and Pb-free
soldering operations). Intersil Pb-free products are MSL classified
at Pb-free peak reflow temperatures that meet or exceed the Pb-
free requirements of IPC/JEDEC J STD-020.
Applications
• Telecom Half Bridge Power Supplies
• Avionics DC/DC Converters
• Two-Switch Forward Converters
• Active Clamp Forward Converters
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004, 2010. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.

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