电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

060332000681FXT

产品描述Ceramic Capacitor, Multilayer, Ceramic, 200V, 1% +Tol, 1% -Tol, X7R, 15% TC, 0.00068uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小197KB,共2页
制造商Knowles
官网地址http://www.knowles.com
标准
下载文档 详细参数 全文预览

060332000681FXT概述

Ceramic Capacitor, Multilayer, Ceramic, 200V, 1% +Tol, 1% -Tol, X7R, 15% TC, 0.00068uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT

060332000681FXT规格参数

参数名称属性值
是否Rohs认证符合
Objectid1673948669
包装说明, 0603
Reach Compliance Codecompliant
Country Of OriginMainland China
ECCN代码EAR99
YTEOL8.12
电容0.00068 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
JESD-609代码e3
制造商序列号0603
安装特点SURFACE MOUNT
多层Yes
负容差1%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TR, 7 INCH
正容差1%
额定(直流)电压(URdc)200 V
尺寸代码0603
表面贴装YES
温度特性代码X7R
温度系数15% ppm/°C
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状WRAPAROUND

文档预览

下载PDF文档
MLCCs
for Non-
magnetic
applications
C0G/NP0, High Q and X7R
Copper Barrier MLCCs
Multilayer ceramic capacitors
with silver/palladium (Ag/Pd)
terminations have often been
used in medical applications
where non-magnetic
components are required, for
example in MRI equipment.
The use of conventional nickel
barrier terminations is not
suitable due to nickel exhibiting
magnetic properties.
However, RoHS requirements
have dictated the use of
lead-free solders, and the
composition of these solders
has resulted in an increase in
soldering temperatures. This
has caused solder leaching
problems for the Ag/Pd
termination, and meant
alternative terminations have
had to be found.
Specification
Capacitance Values
C0G/NP0 & High Q
0.1pF - 15nF
X7R
47pF - 6.8µF
See overleaf for full list of values
Mechanical
Termination Material
See ordering information below
Solderability
IEC 60068-2-58. Passed 3 times reflow
profile defined in J-STD-020
Printing
Consult sales office
Lead Free Soldering
Termination codes 2 and 3 ranges are
fully compliant with the RoHS and WEEE
directives and parts are compatible with lead
free solders.
Climatic Category
55/125/56
Reeled Quantities
See Capacitance tables overleaf
Electrical
C0G/NP0
-55°C to
+125°C
High Q
-55°C to
+125°C
X7R
-55°C to
+125°C
Operating Temperature
Temperature Coefficient
(Typical)
0 ± 30
ppm/°C
0 ± 30
ppm/°C
±15%
Insulation Resistance
Time constant (Ri xCr) (whichever is the least)
100GΩ or
1000s
Ageing Rate
None
None
Typical 1% per
time decade
100GΩ or
1000s
100GΩ or
1000s
Ordering Information
1210
Chip
size
0402
0603
0505
0805
1206
1111
1210
1808
1812
2220
2225
3
Termination
2
(for C0G/NP0
& High Q only)
= Sintered
silver base with
copper barrier
(100% matte tin
plating). RoHS
compliant.
100
Voltage
0103
Capacitance in
picofarads (pF)
J
Capacitance
tolerance
X
Dielectric
T
Packaging
___
Suffix
As copper is non-magnetic,
one solution is to use a copper
barrier instead of a nickel
barrier, with a tin finish on top,
and this is the solution Syfer
has developed.
This copper barrier termination
is offered with selected non-
magnetic C0G/NP0, High Q
and X7R dielectrics, providing a
fully non-magnetic component.
To meet high temperature
260ºC soldering reflow profiles
as detailed in J-STD-020, C0G/
NP0 dielectrics are supplied
with sintered termination and
X7R dielectrics are supplied
with Syfer’s award winning
FlexiCap™ termination.
41/09
016 = 16V <10pF Insert a P for
C
= C0G/
T
= 178mm Used for
<4.7pF
the decimal point, H = ±0.05pF NP0 (1B)
025 = 25V
(7”) reel
specific
050 = 50V
eg P300 = 0.3pF,
customer
B = ±0.1pF
X
= X7R
R
= 330mm
8P20 = 8.2pF.
063 = 63V
C = ±0.25pF
(2R1)
(13”) reel requirements
100 = 100V
D = ±0.5pF
10pF 1st digit
Q
= High Q
B
= Bulk
150 = 150V
is 0. 2nd and
4.7pF &
pack - tubs
200 = 200V
3rd digits are
<10pF
250 = 250V significant figures
B = ±0.1pF
3
= FlexiCap™ 500 = 500V
of capacitance
C = ±0.25pF
630 = 630V code. The 4th digit D = ±0.5pF
base with
1K0 = 1000V is number of 0’s
copper barrier
10pF
(100% matte 1K2 = 1200V
following
F = ±1%
1K5 = 1500V
tin plating).
eg. 0103 =
G = ±2%
RoHS compliant. 2K0 = 2000V
10000pF
J = ±5%
3K0 = 3000V
K = ±10%
Values <1pF in
0.1pF steps, above
this values are E24
series
2407的IO口
请问高手: 关于2407的IO口,是不是可以用下面两种方式读写? 1.LACCPnDATAIR;读 SACLPnDATAIR ;写 SPLK#m,PnDATAIR ;或者这样写 2.IN dam,PnDATAIR ;读 OUT dam,PnDATAIR ; ......
grace811226 微控制器 MCU
CAN总线在纯电动汽车电机控制系统中的应用.caj
谁能打开CAJ格式的文件啊?...
安_然 DSP 与 ARM 处理器
请帮助上传一个关于USB型MSP430仿真器的驱动
仿真器的第一行写着 USB型MSP430仿真器 , 第二行写着 LSD-FETD430UIF , 最近刚买了一个新本本X61,怎么也安装不了驱动,怀疑原来备份的驱动坏了, 请哥哥们能上传一个这种型号仿真器的驱动. 谢 ......
ypyp0431 微控制器 MCU
全网首映:TI嵌入式产品研讨会,下载有好礼!(已颁奖)
>>点击查看颁奖链接 >>2016 TI嵌入式产品研讨会全网首映 TI技术纯干货,EE精心编辑成册 下载电子书,文末藏惊喜! 即刻关注! 258311 ...
EEWORLD社区 TI技术论坛
问个小白的问题,EEPROM一般应用在什么场合
单片机里面通常有ROM/RAM和EEPROM三种存储器,前两种我知道,但EEPROM到目前为止我的没有用到过,一直不大清楚有什么用,怎么用,各位大虾帮忙解释下,感激不尽!...
Cheney_Xu Microchip MCU
为什么大多数蓝牙耳机充电时需要关机
目前市场上大多数蓝牙耳机都是充电复位的,这是为什么? 这样带来很多不方便。如果把蓝牙耳机放在车上,那么两天就没电需要充电了,如果可以充电开机,那么平时开车时就插着充电,接听电话时拔 ......
hong7817 电源技术

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2093  2843  2662  943  2541  43  58  54  19  52 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved