IC bus buff dvr tri-ST 5tssop
参数名称 | 属性值 |
Source Url Status Check Date | 2013-06-14 00:00:00 |
Brand Name | NXP Semiconductor |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | TSSOP |
包装说明 | 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5 |
针数 | 5 |
制造商包装代码 | SOT353-1 |
Reach Compliance Code | unknown |
系列 | HCT |
JESD-30 代码 | R-PDSO-G5 |
JESD-609代码 | e3 |
长度 | 2.05 mm |
逻辑集成电路类型 | BUS DRIVER |
湿度敏感等级 | 1 |
位数 | 1 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 5 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 36 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.1 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | TIN |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 1.25 mm |
74HCT1G125GW,165 | 74HC1G125GW-R | 74HC1G125GW,165 | 74HC1G125GW-G | 74HC1G125GW | 74HCT1G125GW | |
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描述 | IC bus buff dvr tri-ST 5tssop | 缓冲器和线路驱动器 bus buf/line 3-state | IC bus buff dvr tri-ST 5tssop | IC HC/UH SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5, 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5, Bus Driver/Transceiver | HC/UH SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5, 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5 | IC HCT SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5, 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5, Bus Driver/Transceiver |
是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | - | NXP(恩智浦) |
零件包装代码 | TSSOP | - | TSSOP | TSSOT | TSSOT | TSSOT |
包装说明 | 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5 | - | 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5 | 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5 | 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5 | 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5 |
针数 | 5 | - | 5 | 5 | 5 | 5 |
Reach Compliance Code | unknown | - | unknown | unknown | compliant | compliant |
系列 | HCT | - | HC/UH | HC/UH | HC/UH | HCT |
JESD-30 代码 | R-PDSO-G5 | - | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 |
JESD-609代码 | e3 | - | e3 | e3 | e3 | e3 |
长度 | 2.05 mm | - | 2.05 mm | 2.05 mm | 2.05 mm | 2.05 mm |
逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 |
位数 | 1 | - | 1 | 1 | 1 | 1 |
功能数量 | 1 | - | 1 | 1 | 1 | 1 |
端口数量 | 2 | - | 2 | 2 | 2 | 2 |
端子数量 | 5 | - | 5 | 5 | 5 | 5 |
最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | - | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | - | TSSOP | TSSOP | TSSOP | TSSOP |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | - | 260 | 260 | 260 | 260 |
传播延迟(tpd) | 36 ns | - | 150 ns | 150 ns | 150 ns | 36 ns |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.1 mm | - | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
最大供电电压 (Vsup) | 5.5 V | - | 6 V | 6 V | 6 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | - | 2 V | 2 V | 2 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | - | YES | YES | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | TIN | - | TIN | TIN | Tin (Sn) | Tin (Sn) |
端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | - | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | - | 30 | 40 | 30 | 30 |
宽度 | 1.25 mm | - | 1.25 mm | 1.25 mm | 1.25 mm | 1.25 mm |
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