IC adc 16bit 130msps 64-qfn
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC64,.35SQ,20 |
| 针数 | 64 |
| 制造商包装代码 | UP |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.5.A.5 |
| 最大模拟输入电压 | 2.25 V |
| 最小模拟输入电压 | |
| 转换器类型 | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PQCC-N64 |
| JESD-609代码 | e3 |
| 长度 | 9 mm |
| 最大线性误差 (EL) | 0.0069% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 1 |
| 位数 | 16 |
| 功能数量 | 1 |
| 端子数量 | 64 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC64,.35SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 采样速率 | 130 MHz |
| 采样并保持/跟踪并保持 | SAMPLE |
| 座面最大高度 | 0.8 mm |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 9 mm |
| Base Number Matches | 1 |
| LTC2208CUP#TRPBF | LTC2208CUP#TR | LTC2208IUP#TRPBF | LTC2208IUP#TR | LTC2208IUP#PBF | LTC2208CUP#PBF | DC996B-A | DC996B-B | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC adc 16bit 130msps 64-qfn | IC adc 16bit 130msps 64-qfn | IC adc 16bit 130msps 64-qfn | IC adc 16bit 130msps 64-qfn | IC adc 16bit 130msps 64-qfn | IC adc 16bit 130msps 64-qfn | board demo 16bit 130msps ltc2208 | board demo 16bit 130msps ltc2208 |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | - | - |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 符合 | - | - |
| 零件包装代码 | QFN | QFN | QFN | QFN | QFN | QFN | - | - |
| 包装说明 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | - | - |
| 针数 | 64 | 64 | 64 | 64 | 64 | 64 | - | - |
| 制造商包装代码 | UP | UP | UP | UP | UP | UP | - | - |
| Reach Compliance Code | compliant | not_compliant | compliant | not_compliant | compliant | compliant | - | - |
| ECCN代码 | 3A001.A.5.A.5 | 3A001.A.5.A.5 | 3A001.A.5.A.5 | 3A001.A.5.A.5 | 3A001.A.5.A.5 | 3A001.A.5.A.5 | - | - |
| 最大模拟输入电压 | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V | - | - |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | - | - |
| JESD-30 代码 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | - | - |
| JESD-609代码 | e3 | e0 | e3 | e0 | e3 | e3 | - | - |
| 长度 | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm | - | - |
| 最大线性误差 (EL) | 0.0069% | 0.0061% | 0.0069% | 0.0061% | 0.0069% | 0.0069% | - | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 位数 | 16 | 16 | 16 | 16 | 16 | 16 | - | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | - | - |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | - | - |
| 输出位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | - | - |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | - | - |
| 封装等效代码 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | - | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | - | - |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | - |
| 峰值回流温度（摄氏度） | 260 | 235 | 260 | 235 | 260 | 260 | - | - |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 采样速率 | 130 MHz | 130 MHz | 130 MHz | 130 MHz | 130 MHz | 130 MHz | - | - |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | - | - |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - | - |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - |
| 表面贴装 | YES | YES | YES | YES | YES | YES | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | - | - |
| 端子面层 | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | - | - |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - | - |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - | - |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | - | - |
| 处于峰值回流温度下的最长时间 | 30 | 20 | 30 | 20 | 30 | 30 | - | - |
| 宽度 | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm | - | - |
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