ATC RF/Microwave Capacitors QPL Approved to MIL-PRF-55681 / 4 and 5
CDR
DESIGNATION: Identifies
established reliability, ceramic
dielectric, fixed, chip capacitors.
12
B
ATC PART NUMBER CODE:
G
101 A
F
W
S
FAILURE RATE LEVEL
(Established at 90% confidence):
M - - 1% per 1000 hours
P - - 0.1% per 1000 hours
R - - 0.01% per 1000 hours
S - - 0.001% per 1000 hours
STYLE: Identifies dimensions of the
capacitor and lead type, where applicable.
RATED TEMP: -55°C to +125°C
VOLTAGE TEMP. (TCC) LIMITS:
G = +90 ±20 PPM/°C; P = 0 ±30 PPM/°C
CAPACITANCE CODE: The first two digits represent
significant figures and the last digit specifies the number
of zeros to follow. When fractional values of pF are required,
the letter R shall be used to indicate the decimal point.
RATED DC VOLTAGE @ 125°C:
A - - 50 VDC, B - - 100 VDC, C - - 200 VDC,
D - - 300 VDC, E - - 500 VDC, K - - 150 VDC
TERMINATION FINISH:
N - Gold over Nickel over Silver (CDR11, CDR13)
S - Solder Coated, Final (CDR12, CDR14, CDR23, CDR25)
T - Silver (CDR21, CDR22, CDR24)
U - Solder Coated, Nickel Barrier (CDR12, CDR14)
N and U - Terminations preferred for best solder-
ability, thermocompression bonding, leach and mig-
ration resistance, and shelf life for chips and pellets.
W - Solder plated, nickel barrier (CDR12, CDR14, not
for new designs)
Z - Solder plated, nickel barrier (CDR12, CDR14)
CAPACITANCE TOLERANCE:
B (±0.1 pF), C (±0.25 pF), D (±0.5 pF), F (±1%),
G (±2%), J (+5%), K (±10%), M (±20%)
TYPE DESIGNATION*
TABLE I - STYLES CDR11 AND CDR12 CAPACITOR CHARACTERISTICS
CAPACITANCE
RANGE (pF)
CAPACITANCE
TOLERANCE
AVAILABLE
B
B, C
B, C, D
B, C, D
B, C, J, K, M
F, G, J, K, M
F, G, J, K, M
F, G, J, K, M
RATED TEMP. AND
VOLTAGE-TEMP.
LIMITS
Characteristic BG
(+90 ±20 PPM/°C)
and
Characteristic BP
(0 ±30 PPM/°C)
BP
RATED DC
VOLTAGE
CDR1-B-0R1KB-- to CDR1-B-0R2---B--
CDR1-B-0R3K--- to CDR1-B-0R4---
CDR1-B-0R5K--- to CDR1-B-2R2---**
CDR1-B-2R4K--- to CDR1-B-6R2---***
CDR1-B-6R8K--- to CDR1-B-9R1---***
CDR1-B-100K--- to CDR1-B-101K---***
CDR1-BP111K--- to CDR1-BP621---***
CDR1-BP681A--- to CDR1-BP102---***
0.1 pF to 0.2 pF
0.3 pF to 0.4 pF
0.5 pF to 2.2 pF
2.4 pF to 6.2 pF
6.8 pF to 9.1 pF
10 pF to 100 pF
110 pF to 620 pF
680 pF to 1000 pF
A = 50
K = 150
A = 50
B = 100
TABLE II - STYLES CDR13 AND CDR14 CAPACITOR CHARACTERISTICS
TYPE DESIGNATION*
CAPACITANCE
RANGE (pF)
0.1 pF to 0.2 pF
0.3 pF to 0.4 pF
0.5 pF to 2.2 pF
2.4 pF to 6.2 pF
6.8 pF to 9.1 pF
10 pF to 100 pF
110 pF to 200 pF
220 pF to 470 pF
510 pF to 620 pF
680 pF to 1000 pF
1100 pF to 5100 pF
CAPACITANCE
TOLERANCE
AVAILABLE
B
B, C
B, C, D
B, C, D
B, C, J, K, M
RATED TEMP. AND
VOLTAGE-TEMP.
LIMITS
RATED DC
VOLTAGE
CDR1-B-0R1EB-- to CDR1-B-0R2---B--
CDR1-B-0R3E--- to CDR1-B-0R4---
CDR1-B--0R5E--- to CDR1-B-2R2---**
CDR1-B-2R4E--- to CDR1-B-6R2---***
CDR1-B-6R8E--- to CDR1-B-9R1---***
CDR1-B-100E--- to CDR1-B-101---***
CDR1-B-111D--- to CDR1-B-201---***
CDR1-B-221C--- to CDR1-B-471C---***
CDR1-B-511B--- to CDR1-B-621---***
CDR1-B-681A--- to CDR1-B-102A---***
CDR1-BP112A--- to CDR1-BP512A---***
*
Characteristic BG
(+90 ±20 PPM/°C)
and
Characteristic BP
(0 ±30 PPM/°C)
C = 200
E = 500
F, G, J, K, M
BP
C = 200 D = 300
C = 200
A = 50 B = 100
A = 50
Complete type designation will include additional symbols to indicate style, voltage-temperature limits, capacitance tolerance
(where applicable), termination finish, and failure rate level.
** Intermediate values in this category are in 0.1 pF steps.
*** Intermediate values in each category are given by the RETMA 5% Table.
A M E R I C A N
T E C H N I C A L
ATC Europe
saleseur@atceramics.com
C E R A M I C S
ATC Asia
sales@atceramics-asia.com
2
ATC North America
sales@atceramics.com
w w w.a tc e r a m ics .c o m
ATC RF/Microwave Capacitors QPL Approved to MIL-PRF-55681 / 4 and 5
TABLE III - STYLES CDR21 TO CDR25 CAPACITOR CHARACTERISTICS
TYPE DESIGNATION*
CAPACITANCE
RANGE (pF)
0.1 pF to 0.2 pF
0.3 pF to 0.4 pF
0.5 pF to 2.2 pF
2.4 pF to 6.2 pF
6.8 pF to 9.1 pF
10 pF to 100 pF
110 pF to 200 pF
220 pF to 470 pF
510 pF to 620 pF
680 pF to 1000 pF
1100 pF to 5100 pF
CAPACITANCE
TOLERANCE
AVAILABLE
B
B, C
B, C, D
B, C, D
B, C, J, K, M
RATED TEMP. AND
VOLTAGE-TEMP.
LIMITS
RATED DC
VOLTAGE
CDR2-B-0R1EB-- to CDR2-B-0R2EB--
CDR2-B-0R3E--- to CDR2-B-0R4E---
CDR2-B--0R5E--- to CDR2-B-2R2E---**
CDR2-B-2R4E--- to CDR2-B-6R2E---***
CDR2-B-6R8E--- to CDR2-B-9R1E---***
CDR21-B-100E--- to CDR2-B-101E---***
CDR2-B-111D--- to CDR2-B-201D---***
CDR2-B-221C--- to CDR2-B-471C---***
CDR2-B-511B--- to CDR2-B-621B---***
CDR2-B-681A--- to CDR2-B-102A---***
CDR2-BP112A--- to CDR2-BP512A---***
*
Characteristic BG
(+90 ±20 PPM/°C)
and
Characteristic BP
(0 ±30 PPM/°C)
500 = E
F, G, J, K, M
BP
300 = D
200 = C
100 = B
50 = A
Complete type designation will include additional symbols to indicate style, voltage-temperature limits, capacitance tolerance
(where applicable), termination finish (T for styles CDR21, CDR22 and CDR24, and S for styles CDR23 and CDR25), and failure rate level.
Please note:
Leaded devices CDR 21 through CDR 25 are available to the R Failure Rate Level only.
** Intermediate values in this category are in 0.1 pF steps.
*** Intermediate values in each category are given by the RETMA 5% Table as follows: 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, 91.
MECHANICAL CONFIGURATIONS
MIL-
PRF-55681
STYLES
CDR 11
CDR 13
CDR 12
CDR 14
CDR 12
CDR 14
CASE
SIZE
A
B
A
B
A
B
B
TYPE
Chip
L
OUTLINES
BODY DIMENSIONS
LENGTH
WIDTH
THICKNESS
LEAD AND TERMINATION
DIMENSIONS
AND MATERIALS
N - Gold Over Nickel
Over Silver
N is ATC’s UNI-TERM
®
CA
W
T
.055 ±.015
(1.4 ±0.38)
.110 ±.020
(2.79 ±0.51)
.055 ±.025
(1.4 ±0.63)
T
.020/.057
(0.51/1.45)
.030/.102
(0.76/2.59)
.020/.057
(0.51/1.45)
.030/.102
(0.76/2.59)
.020/.057
(0.51/1.45)
.030/.102
(0.76/2.59)
CA
Chip
Pellet
Pellet
W/T IS A
TERMINATION SURFACE
P
W
L
.055 ±.015
(1.4 ±0.38)
.110 ±.020
(2.79 ±0.51)
P
W/T IS A
TERMINATION SURFACE
.110 +.035 -.020
(2.79 +0.89 -0.51)
S - Solder Coated, Final
U - Solder Coated,
Nickel Barrier
U is ATC’s BARRIER//CAP
®
Solder Plate
W
W
L
WL
TL
LL
.055 ±.015
(1.4 ±0.38)
T
Solder Plate
W
W/T IS A
TERMINATION SURFACE
L
T
W
.110 ±.020
(2.79 ±0.51)
W - Nickel Barrier,
Solder Plate.
CDR 21
Microstrip
MS
WL
TL
LL
LENGTH
WIDTH
W
L
T
TL
LL
THICK-
NESS
CDR 22
B
AR
Axial
Ribbon
Radial
Ribbon
WL
W
L
LL
T
.250 (6.35)
min.
WL
.093
±.005
(2.36
±0.13)
.004
±.001
(0.10
±0.03)
CDR 24
B
RR
W
L
LL
T
TL
WL
.135 ±.015
(3.43 ±0.38)
.110 ±.015
(2.79 ±0.38)
.060/.100
(1.52/2.54)
(Termination T - Silver)
CDR 23
B
Radial
RW
Wire
Axial
Wire
W
L
T
• •
L
W
L
LL
T
W
LL
WL
CDR 25
B
AW
• •
L
LL
T
.50 (12.7)
min.
•
T
W
• •
L
LL
#26 AWG
.016 (.375)
dia. nom.
(Termination S - Solder Coated)
All leads and ribbon are silver and are attached with high temperature solder.
T
W
All dimensions are in inches, except those in parentheses which are in millimeters.
STYLE
CDR11
CDR12
CDR13
CDR14
EQUIV. ATC PART NO.
CHARACTERISTICS
• •
BG
BP
LL
STYLE
CDR21
CDR22
CDR23
CDR24
CDR25
W
•
L
T
EQUIV. ATC PART NO.
CHARACTERISTICS
BG
BP
100B ------ MS
100B ------ AR
100B ------ RW
100B ------ RR
100B ------ AW
700B ------ MS
700B ------ AR
700B ------ RW
700B ------ RR
700B ------ AW
100A
100A
100B
100B
700A
700A
700B
700B
A M E R I C A N
ATC North America
sales@atceramics.com
T E C H N I C A L
ATC Europe
saleseur@atceramics.com
C E R A M I C S
ATC Asia
sales@atceramics-asia.com
w w w.a t c e r am ic s .c o m
3
Sales of ATC products are subject to the terms and conditions contained in American Technical Ceramics Corp. Terms and Conditions of Sale(ATC document #001-992). Copies of these terms
and conditions will be provided upon request. They may also be viewed on ATC’s website at www.atceramics.com/productfinder/default.asp. Click on the link for Terms and Conditions of Sale.
ATC has made every effort to have this information as accurate as possible. However, no responsibility is assumed by ATC for its use, nor for any infringements of rights of third parties which
may result from its use. ATC reserves the right to revise the content or modify its product without prior notice.
复杂 IC 不仅吸引了更多系统，而且还吞食着设计者用于建立、评估与校准芯片的测试设备。 芯片设计者正开始在自己的复杂 IC上设计测试与测量仪器。在IC中设计测试仪器的潮流开始于CPU核心与总线的数字调试硬件。现在，设计者也在高速I/O块中建立分析仪器。设计者正在高频芯片的内部作业中集成更复杂的模拟与RF测试仪器，如读取通道IC。 这只是尺度问题。随着系统级 IC 越来越大而复杂...[详细]
无线连接
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
