Flash Card, 8GX8, ROHS COMPLIANT, PACAKGE-52
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 包装说明 | ROHS COMPLIANT, PACAKGE-52 |
| Reach Compliance Code | unknow |
| ECCN代码 | 3A991.B.1.A |
| JESD-30 代码 | R-XUUC-N52 |
| 长度 | 29.85 mm |
| 内存密度 | 68719476736 bi |
| 内存集成电路类型 | FLASH CARD |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 52 |
| 字数 | 8589934592 words |
| 字数代码 | 8000000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8GX8 |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | RECTANGULAR |
| 封装形式 | UNCASED CHIP |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 编程电压 | 3.3 V |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.8 mm |
| 端子位置 | UPPER |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 类型 | NAND TYPE |
| 宽度 | 26.8 mm |
| Base Number Matches | 1 |
| APM008GN1AN-GTW | APM002GN1AN-FTW | APM016GN1AN-FTW | APM008GN1AN-FTW | APM032GN1AN-FTW | APM004GN1AN-FTW | APM001GN1AN-FTW | APM001GN1AN-GT | APM001GN1AN-GTW | APM001GN1AN-FT | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Flash Card, 8GX8, ROHS COMPLIANT, PACAKGE-52 | Flash Card, 2GX8, ROHS COMPLIANT, PACAKGE-52 | Flash Card, 16GX8, ROHS COMPLIANT, PACAKGE-52 | Flash Card, 8GX8, ROHS COMPLIANT, PACAKGE-52 | Flash Card, 32GX8, ROHS COMPLIANT, PACAKGE-52 | Flash Card, 4GX8, ROHS COMPLIANT, PACAKGE-52 | Flash Card, 1GX8, ROHS COMPLIANT, PACAKGE-52 | Flash Card, 1GX8, ROHS COMPLIANT, PACAKGE-52 | Flash Card, 1GX8, ROHS COMPLIANT, PACAKGE-52 | Flash Card, 1GX8, ROHS COMPLIANT, PACAKGE-52 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | ROHS COMPLIANT, PACAKGE-52 | DIE, | DIE, | DIE, | DIE, | DIE, | DIE, | ROHS COMPLIANT, PACAKGE-52 | ROHS COMPLIANT, PACAKGE-52 | ROHS COMPLIANT, PACAKGE-52 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
| JESD-30 代码 | R-XUUC-N52 | R-XUUC-N52 | R-XUUC-N52 | R-XUUC-N52 | R-XUUC-N52 | R-XUUC-N52 | R-XUUC-N52 | R-XUUC-N52 | R-XUUC-N52 | R-XUUC-N52 |
| 长度 | 29.85 mm | 29.85 mm | 29.85 mm | 29.85 mm | 29.85 mm | 29.85 mm | 29.85 mm | 29.85 mm | 29.85 mm | 29.85 mm |
| 内存密度 | 68719476736 bi | 17179869184 bit | 137438953472 bit | 68719476736 bit | 274877906944 bit | 34359738368 bit | 8589934592 bit | 8589934592 bit | 8589934592 bit | 8589934592 bit |
| 内存集成电路类型 | FLASH CARD | FLASH CARD | FLASH CARD | FLASH CARD | FLASH CARD | FLASH CARD | FLASH CARD | FLASH CARD | FLASH CARD | FLASH CARD |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 52 | 52 | 52 | 52 | 52 | 52 | 52 | 52 | 52 | 52 |
| 字数 | 8589934592 words | 2147483648 words | 17179869184 words | 8589934592 words | 34359738368 words | 4294967296 words | 1073741824 words | 1073741824 words | 1073741824 words | 1073741824 words |
| 字数代码 | 8000000000 | 2000000000 | 16000000000 | 8000000000 | 32000000000 | 4000000000 | 1000000000 | 1000000000 | 1000000000 | 1000000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | - |
| 组织 | 8GX8 | 2GX8 | 16GX8 | 8GX8 | 32GX8 | 4GX8 | 1GX8 | 1GX8 | 1GX8 | 1GX8 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIE | DIE | DIE | DIE | DIE | DIE | DIE | DIE | DIE | DIE |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 编程电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 类型 | NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | NAND TYPE | NAND TYPE | NAND TYPE |
| 宽度 | 26.8 mm | 26.8 mm | 26.8 mm | 26.8 mm | 26.8 mm | 26.8 mm | 26.8 mm | 26.8 mm | 26.8 mm | 26.8 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | - | Apacer | Apacer | Apacer | Apacer | Apacer | Apacer | Apacer | Apacer | Apacer |
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