PGA Sockets
Table of Models
Low Insertion Force PGA Sockets
.100” (2.54mm) Standard Grid
Description:
Peel-A-Way
®
(KIS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
Description:
FR-4 (FIS)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Features:
• Low insertion force (1 oz. average
per pin)
• Screw-machined terminals with
multiple finger contacts for
reliability
• Closed bottom terminal for 100%
anti-wicking of solder
• Tapered entry for ease of insertion
• Custom designs available
Description:
Molded (RIS)
Material: High Temp. Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
RIS replaces HCIS, HCS, CIS, and CS.
?
?
.005
(.13)
PC Board
PC Board
Polyimide
Film
.062
(1.57)
.100
(2.54)
Options
Tape Sealant - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
• Spray flux without contaminating contact area
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per MIL-G-45204
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
How To Order
1 RIS
Footprint Dash #
If Applicable
*
Body Type
RoHS Compliant Insulators:
KIS - Peel-A-Way
®
068 - 04 M G
Contact Plating
RoHS Compliant:
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
FIS - FR-4
RIS - New Hi-Temp Molded
Number of Pins
004 to 484
*Footprints available online or
in separate booklet.
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Cat. 16 Rev. 1
1 ESX 503 - 234
Footprint Dash #
Body Type
M
G
RoHS Compliant:
Contact
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Plating
If Applicable
*
inch/(mm)
G - Gold
Low Insertion Force PGA Sockets
.100” (2.54mm) Standard Grid
Standard Quick-Turn Terminals
Type -04
.157/(3.99) Hole Depth
.072 Dia.
(1.83)
.072 Dia.
(1.83)
PGA Sockets
Type -01
Molded or FR-4 only
.072 Dia.
(1.83)
Additional standard and custom terminals available.
See Terminals section online or consult factory.
Type -29
Molded or FR-4 only
.072 Dia.
(1.83)
Type -51
.120
(3.05)
.130
(3.30)
.165
(4.19)
.165
(4.19)
.110
(2.79)
.028 Dia.
(.71)
.020 Dia.
(.51)
.110
(2.79)
.125
(3.18)
.020 Dia.
(.51)
.020 Dia.
(.51)
.170
(4.32)
Type -33
Peel-A-Way
®
only
.072 Dia.
(1.83)
.072 Dia.
(1.83)
Type -50
Peel-A-Way
®
only
.058 Dia.
(1.47)
Type -85
Peel-A-Way
®
only
Type -176
Peel-A-Way
®
only
.058 Dia.
(1.47)
.165
(4.19)
.031
(.79)
.155
(3.94)
.031
(.79)
.155
(3.94)
.031
(.79)
.155
(3.95)
Footprints:
200 Pins
Footprint Number 200-1
1.600 Sq.
(40.64)
.125
(3.18)
.020 Dia.
(.51)
.053 Dia.
(1.35)
.038 Dia.
(.97)
.034 Dia.
(.86)
Type -210
Peel-A-Way
®
only
.058 Dia.
(1.47)
.015
(.38)
.155
(3.94)
.034 Dia.
(.86)
.100/(2.54) Typ.
Solder Preform Terminals
Tin/Lead: Type -150
Lead-free: Type -811
.072 Dia.
(1.83)
Tin/Lead: Type -151
Lead-free: Type -812
.072 Dia.
(1.83)
.130
(3.30)
Tin/Lead: Type -111
Lead-free: Type -810
Peel-A-Way
®
only
.058 Dia.
(1.47)
16 x 16 rows
.165
(4.19)
Solder
Preform
.125
(3.18)
.020 Dia.
(.51)
Solder
Preform
Solder
Preform
.031
(.79)
.155
(3.94)
• Full grid insulators loaded to your
specific footprint
• Open centers available upon
request (consult factory)
• Hundreds of footprints available
online
• Use our online Build-A-Part
feature or download a Footprints
Booklet in PDF format
.110
(2.79)
.020 Dia.
(.51)
.038 Dia.
(.97)
Intrusive Reflow Application
• Combines the labor of socket loading and solder
application into one operation.
• Eliminates the use of solder paste and screening
operation.
• Eliminates solder bridges and/or solder shorts
due to excess solder.
• Ensures a reliable solder joint with controlled
solder volume.
Solder Preform
Available Online:
• Extraction Tools
• RoHS Qualification Test Report
• Ideal for surface mount and mixed technology
applications.
• For custom solder preform terminal applications
consult factory.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Cat. 16 Rev. 1
PC Board
Preform After
Solder Flow
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
