512KX8 OTPROM, 150ns, PQCC32, PLASTIC, LCC-32
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | QFJ |
| 包装说明 | PLASTIC, LCC-32 |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 150 ns |
| JESD-30 代码 | R-PQCC-J32 |
| JESD-609代码 | e0 |
| 长度 | 13.995 mm |
| 内存密度 | 4194304 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | NOT SPECIFIED |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 512KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | COMMERCIAL |
| 座面最大高度 | 3.56 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 11.455 mm |
| Base Number Matches | 1 |
| FM27C040V150 | FM27C040V120 | FM27C040Q90 | FM27C040QE120 | FM27C040QE150 | FM27C040VE120 | FM27C040Q150 | FM27C040Q120 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 512KX8 OTPROM, 150ns, PQCC32, PLASTIC, LCC-32 | 512KX8 OTPROM, 120ns, PQCC32, PLASTIC, LCC-32 | 512KX8 UVPROM, 90ns, CDIP32, WINDOWED, CERDIP-32 | 512KX8 UVPROM, 120ns, CDIP32, WINDOWED, CERDIP-32 | 512KX8 UVPROM, 150ns, CDIP32, WINDOWED, CERDIP-32 | 512KX8 OTPROM, 120ns, PQCC32, PLASTIC, LCC-32 | 512KX8 UVPROM, 150ns, CDIP32, WINDOWED, CERDIP-32 | 512KX8 UVPROM, 120ns, CDIP32, WINDOWED, CERDIP-32 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | QFJ | QFJ | DIP | DIP | DIP | QFJ | DIP | DIP |
| 包装说明 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | WDIP, | WINDOWED, CERDIP-32 | WINDOWED, CERDIP-32 | PLASTIC, LCC-32 | WINDOWED, CERDIP-32 | WINDOWED, CERDIP-32 |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 150 ns | 120 ns | 90 ns | 120 ns | 150 ns | 120 ns | 150 ns | 120 ns |
| JESD-30 代码 | R-PQCC-J32 | R-PQCC-J32 | R-CDIP-T32 | R-CDIP-T32 | R-CDIP-T32 | R-PQCC-J32 | R-CDIP-T32 | R-CDIP-T32 |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | UVPROM | UVPROM | UVPROM | OTP ROM | UVPROM | UVPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C |
| 组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ | QCCJ | WDIP | WDIP | WDIP | QCCJ | WDIP | WDIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | CHIP CARRIER | IN-LINE, WINDOW | IN-LINE, WINDOW |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 座面最大高度 | 3.56 mm | 3.56 mm | 5.969 mm | 5.969 mm | 5.969 mm | 3.56 mm | 5.969 mm | 5.969 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | NOT SPECIFIED | TIN LEAD |
| 端子形式 | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 11.455 mm | 11.455 mm | 15.24 mm | 15.24 mm | 15.24 mm | 11.455 mm | 15.24 mm | 15.24 mm |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 |
| 湿度敏感等级 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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