PD-94764L
RADIATION HARDENED
LOGIC LEVEL POWER MOSFET
SURFACE MOUNT (UB)
Product Summary
IRHLUB7970Z4
JANSR2N7626UB
60V, P-CHANNEL
REF: MIL-PRF-19500/745
TECHNOLOGY
Part Number
Radiation Level R
DS(on)
I
D
QPL Part Number
IRHLUB7970Z4 100K Rads (Si) 1.4Ω -0.53A JANSR2N7626UB
IRHLUB7930Z4 300K Rads (Si) 1.4Ω -0.53A JANSF2N7626UB
Refer to Page 11 for 3 Additional Part Numbers -
IRHLUBN7970Z4, IRHLUBC7970Z4, IRHLUBCN7970Z4
UB
(SHIELDED METAL LID)
Features
:
International Rectifier’s R7 Logic Level Power MOSFETs
provide simple solution to interfacing CMOS and TTL control
circuits to power devices in space and other radiation
environments. The threshold voltage remains within acceptable
operating limits over the full operating temperature and post
radiation. This is achieved while maintaining single event
gate rupture and single event burnout immunity.
These devices are used in applications such as current boost
low signal source in PWM, voltage comparator and operational
amplifiers.
TM
n
n
n
n
n
n
n
n
n
5V CMOS and TTL Compatible
Fast Switching
Single Event Effect (SEE) Hardened
Low Total Gate Charge
Simple Drive Requirements
Ease of Paralleling
Hermetically Sealed
Light Weight
Complimentary P-Channel Available -
IRHLUB770Z4, IRHLUBN770Z4
IRHLUBC770Z4 & IRHLUBCN770Z4
Absolute Maximum Ratings
Parameter
ID @ VGS = -4.5V, TC = 25°C
ID @ VGS = -4.5V, TC = 100°C
IDM
PD @ TC = 25°C
VGS
EAS
IAR
EAR
dv/dt
TJ
T STG
Continuous Drain Current
Continuous Drain Current
Pulsed Drain Current
Max. Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction
Storage Temperature Range
Lead Temperature
Weight
For footnotes refer to the last page
-0.53
-0.33
-2.12
0.57
0.0045
±10
33.5
-0.53
0.06
-4.4
-55 to 150
300 (for 5s)
43 (Typical)
Pre-Irradiation
Units
A
W
W/°C
V
mJ
A
mJ
V/ns
°C
mg
www.irf.com
1
09/15/10
IRHLUB7970Z4, JANSR2N7626UB
Pre-Irradiation
Electrical Characteristics
@ Tj = 25°C (Unless Otherwise Specified)
Parameter
BVDSS
Drain-to-Source Breakdown Voltage
Min
-60
Typ Max Units
—
-0.055
—
—
3.1
—
—
—
—
—
—
—
—
—
—
—
—
8.4
167
43
10
56
—
—
1.40
-2.0
—
—
-1.0
-10
-100
100
3.6
1.5
1.8
22
22
27
27
—
—
—
—
V
V/°C
Ω
V
mV/°C
S
µA
nA
Test Conditions
VGS = 0V, ID = -250µA
Reference to 25°C, ID = -1.0mA
VGS = -4.5V, ID = -0.33A
Ã
VDS = VGS, ID = -250µA
VDS = -10V, IDS = 0.33A
Ã
VDS= -48V ,VGS=0V
VDS = -48V,
VGS = 0V, TJ = 125°C
VGS = -10V
VGS = 10V
VGS = -4.5V, ID = -0.53A
VDS = -30V
VDD = -30V, ID = -0.53A,
VGS = -5.0V, RG = 24Ω
∆BV
DSS /∆T J Temperature Coefficient of Breakdown —
Voltage
RDS(on)
Static Drain-to-Source On-State
—
Resistance
VGS(th)
Gate Threshold Voltage
-1.0
Gate Threshold Voltage Coefficient
—
∆V
GS(th)/∆TJ
gfs
Forward Transconductance
0.23
IDSS
Zero Gate Voltage Drain Current
—
—
IGSS
IGSS
Qg
Q gs
Q gd
td
(on)
tr
td
(off)
tf
LS + LD
Ciss
C oss
C rss
Rg
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
—
—
—
—
—
—
—
—
—
—
—
—
—
nC
ns
nH
pF
Ω
Measured from the center of
drain pad to center of source pad
VGS = 0V, VDS = -25V
f = 100KHz
f = 1.0MHz, open drain
Source-Drain Diode Ratings and Characteristics
Parameter
IS
ISM
VSD
trr
Q RR
ton
Continuous Source Current (Body Diode)
Pulse Source Current (Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Min Typ Max Units
—
—
—
—
—
—
—
—
—
—
-0.53
-2.12
-5.0
50
25
Test Conditions
A
V
ns
nC
T
j
= 25°C, IS = -0.53A, VGS = 0V
Tj = 25°C, IF = -0.53A, di/dt
≤
-100A/µs
VDD
≤
-25V
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter
RthJA
Junction-to-Ambient
Min Typ Max Units
—
—
220
°C/W
Test Conditions
Note: Corresponding Spice and Saber models are available on International Rectifier Web site.
For footnotes refer to the last page
2
www.irf.com
Pre-Irradiation
Radiation Characteristics
IRHLUB7970Z4, JANSR2N7626UB
International Rectifier Radiation Hardened MOSFETs are tested to verify their radiation hardness capabil-
ity. The hardness assurance program at International Rectifier is comprised of two radiation environments.
Every manufacturing lot is tested for total ionizing dose (per notes 5 and 6) using the TO-39 package. Both
pre- and post-irradiation performance are tested and specified using the same drive circuitry and test
conditions in order to provide a direct comparison.
Table 1. Electrical Characteristics @ Tj = 25°C, Post Total Dose Irradiation
Parameter
BV
DSS
V
GS(th)
I
GSS
I
GSS
I
DSS
R
DS(on)
R
DS(on)
V
SD
Drain-to-Source Breakdown Voltage
Gate Threshold Voltage
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Zero Gate Voltage Drain Current
Static Drain-to-Source
On-State Resistance (TO-39)
Static Drain-to-Source On-state
Resistance (UB)
Diode Forward Voltage
Up to 300K Rads (Si)
1
Min
-60
-1.0
—
—
—
—
—
—
Max
Units
V
nA
µA
Ω
Ω
V
Test Conditions
V
GS
= 0V, I
D
= -250µA
V
GS
= V
DS
, I
D
= -250µA
V
GS
= -10V
V
GS
= 10V
V
DS
= -48V, V
GS
= 0V
V
GS
= -4.5V, I
D
= -0.33A
V
GS
= -4.5V, I
D
= -0.33A
V
GS
= 0V, I
D
= -0.53A
—
-2.0
-100
100
-1.0
1.36
1.40
-5.0
1. Part Numbers IRHLUB7970Z4, IRHLUB7930Z4 and additional part numbers listed on page 11.
International Rectifier radiation hardened MOSFETs have been characterized in heavy ion environment for
Single Event Effects (SEE). Single Event Effects characterization is illustrated in Fig. a and Table 2.
Table 2. Typical Single Event Effect Safe Operating Area
LET
(MeV/(mg/cm ))
38 ± 5%
62 ± 5%
85 ± 5%
2
Energy
(MeV)
300 ± 7.5%
355 ± 7.5%
380 ± 7.5%
Range
(µm)
38 ± 7.5%
33 ± 7.5%
29 ± 7.5%
@VGS=
@VGS=
VDS (V)
@VGS=
@VGS=
@VGS=
@VGS=
0V
-60
-60
-60
2V
-60
-60
-60
4V
-60
-60
-60
5V
-60
-60
-60
6V
-60
-60
-
7V
-50
-
-
-70
-60
-50
-40
-30
-20
-10
0
0
1
2
3
4
5
6
7
Bias VGS (V)
Bias VDS (V)
LET=38 ± 5%
LET=62 ± 5%
LET=85 ± 5%
Fig a.
Typical Single Event Effect, Safe Operating Area
For footnotes refer to the last page
www.irf.com
3
IRHLUB7970Z4, JANSR2N7626UB
Pre-Irradiation
10
-I D, Drain-to-Source Current (A)
VGS
TOP
-10V
-5.0V
-4.5V
-3.5V
-3.0V
-2.75V
-2.50V
BOTTOM -2.25V
10
-I D, Drain-to-Source Current (A)
VGS
-10V
-5.0V
-4.5V
-3.5V
-3.0V
-2.75V
-2.50V
BOTTOM -2.25V
TOP
1
1
-
2.25V
-
2.25V
0.1
0.1
1
60µs PULSE WIDTH
Tj = 25°C
10
100
0.1
0.1
1
-V DS , Drain-to-Source Voltage (V)
60µs PULSE WIDTH
Tj = 150°C
10
100
-VDS , Drain-to-Source Voltage (V)
Fig 1.
Typical Output Characteristics
Fig 2.
Typical Output Characteristics
10
2.0
RDS(on) , Drain-to-Source On Resistance
(Normalized)
ID = -0.53A
1.6
-ID, Drain-to-Source Current (
Α)
1.2
1.0
TJ = 150°C
T J = 25°C
VDS = -25V
15
60µs PULSE WIDTH
0.8
0.4
VGS = -4.5V
0.0
-60 -40 -20
0
20
40
60
80 100 120 140 160
0.1
1.5
2.0
2.5
3.0
3.5
4.0
-VGS, Gate-to-Source Voltage (V)
TJ , Junction Temperature (°C)
Fig 3.
Typical Transfer Characteristics
Fig 4.
Normalized On-Resistance
Vs. Temperature
4
www.irf.com
Pre-Irradiation
IRHLUB7970Z4, JANSR2N7626UB
3.0
2.5
2.0
1.5
1.0
ID = -0.53A
RDS(on), Drain-to -Source On Resistance (
Ω)
RDS(on), Drain-to -Source On Resistance
(Ω)
3.5
3.0
TJ = 150°C
2.5
2.0
T J = 150°C
1.5
T J = 25°C
Vgs = -4.5V
0.5
0
0.5
1.0
1.5
2.0
2.5
-I D, Drain Current (A)
1.0
T J = 25°C
0.5
2
3
4
5
6
7
8
9
10 11 12
-VGS, Gate -to -Source Voltage (V)
Fig 5.
Typical On-Resistance Vs
Gate Voltage
Fig 6.
Typical On-Resistance Vs
Drain Current
-V(BR)DSS , Drain-to-Source Breakdown Voltage (V)
75
3.0
-V GS(th) Gate threshold Voltage (V)
ID = -1.0mA
70
2.5
2.0
65
1.5
1.0
60
0.5
ID = -50µA
ID = -250µA
ID = -1.0mA
ID = -150mA
-60 -40 -20
0
20
40
60
80 100 120 140 160
55
-60 -40 -20
0
20
40
60
80 100 120 140 160
0.0
T J , Temperature ( °C )
T J , Temperature ( °C )
Fig 7.
Typical Drain-to-Source
Breakdown Voltage Vs Temperature
Fig 8.
Typical Threshold Voltage Vs
Temperature
www.irf.com
5
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
