IC DATACOM, INTERFACE CIRCUIT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14, Network Interface
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | SOIC |
包装说明 | 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14 |
针数 | 14 |
Reach Compliance Code | compliant |
JESD-30 代码 | R-PDSO-G14 |
JESD-609代码 | e4 |
长度 | 8.65 mm |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 14 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
标称供电电压 | 5 V |
表面贴装 | YES |
电信集成电路类型 | INTERFACE CIRCUIT |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 3.9 mm |
Base Number Matches | 1 |
935285398518 | 935285401512 | 935285401518 | 935280281518 | 935280281512 | 935285398512 | 935280277512 | 935280277518 | TJA1055T/C | TJA1055T/3/C | |
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描述 | IC DATACOM, INTERFACE CIRCUIT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14, Network Interface | IC DATACOM, INTERFACE CIRCUIT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14, Network Interface | IC DATACOM, INTERFACE CIRCUIT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14, Network Interface | IC DATACOM, INTERFACE CIRCUIT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14, Network Interface | IC DATACOM, INTERFACE CIRCUIT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14, Network Interface | IC DATACOM, INTERFACE CIRCUIT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14, Network Interface | IC DATACOM, INTERFACE CIRCUIT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14, Network Interface | IC DATACOM, INTERFACE CIRCUIT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14, Network Interface | IC DATACOM, INTERFACE CIRCUIT, PDSO14, 3.90 MM, ROHS COMPLIANT, PLASTIC, MS-012, SOT-108-1, SOP-14, Network Interface | IC DATACOM, INTERFACE CIRCUIT, PDSO14, 3.90 MM, ROHS COMPLIANT, PLASTIC, MS-012, SOT-108-1, SOP-14, Network Interface |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
包装说明 | 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14 | 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14 | 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14 | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, |
针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | compliant | compli | compli | unknow | unknow | compliant | unknown | unknown | compliant | compliant |
JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
长度 | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
电信集成电路类型 | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 40 | 40 | NOT SPECIFIED | NOT SPECIFIED | 40 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 |
宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | - | 不含铅 | - | - | 不含铅 | 不含铅 |
厂商名称 | NXP(恩智浦) | - | - | - | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
JESD-609代码 | e4 | e4 | e4 | - | - | e4 | - | - | e4 | e4 |
湿度敏感等级 | 3 | 3 | 3 | - | - | 3 | - | - | 3 | 3 |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
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