Ultra Small
μClamp
®
1-Line ESD Protection
PROTECTION PRODUCTS - Z-Pak
TM
Description
μClamp
®
TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. It is
designed to replace 0201 size multilayer varistors (MLVs)
in portable applications such as cell phones, notebook
computers, and other portable electronics. It features
large cross-sectional area junctions for conducting high
transient currents. This device offers desirable charac-
teristics for board level protection including fast response
time, low operating and clamping voltage, and no device
degradation.
μClamp
®
0541Z is in a 2-pin SLP0603P2X3 package. It
measures 0.6 x 0.3 mm with a nominal height of only
0.25mm. Leads are finished with lead-free NiAu. Each
device will protect one line operating at 5 volts. It
gives the designer the flexibility to protect single lines in
applications where arrays are not practical. The
combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and MP3 players.
uClamp0541Z
Features
High ESD withstand Voltage:
+/-17kV
(Contact/Air)
per
IEC 61000-4-2
Able to withstand over 1000 ESD strikes per IEC
61000-4-2 Level 4
Ultra-small 0201 package
0201 package
Protects one data or power line
Low reverse current: <10nA typical (VR=5V)
Working voltage: +/- 5V
Low capacitance: 6.5pF typical
Solid-state silicon-avalanche technology
SLP0603P2X3 package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking : Marking code + dot matrix date code
Packaging : Tape and Reel
Mechanical Characteristics
Applications
Cellular Handsets & Accessories
Keypads, Side Keys, Audio Ports
Portable Instrumentation
Digital Lines
Tablet PC
Nominal Dimensions
0.62
Schematic
0.22
0.32
1
2
0.16
0.355 BSC
0.25
SLP0603P2X3 (Bottom View)
2/6/2015
1
www.semtech.com
uClamp0541Z
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Peak Pulse Power (tp = 8/20
μ
s)
Maximum Peak Pulse Current (tp = 8/20
μ
s)
ESD p er IEC 61000-4-2 (Air)
1
ESD p er IEC 61000-4-2 (Contact)
1
Op erating Temp erature
Storage Temp erature
Symbol
P
p k
I
p p
V
ESD
T
J
T
STG
Value
25
2
+/- 17
+/- 17
-55 to +125
-55 to +150
Units
Watts
Amps
kV
°C
°C
Electrical Characteristics (T=25
o
C)
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamp ing Voltage
Clamp ing Voltage
Dynamic Resistance
2, 3
Junction Cap acitance
Symbol
V
RWM
V
BR
I
R
V
C
V
C
R
DYN
C
j
Conditions
Pin 1 to 2 or 2 to 1
I
t
= 1mA
Pin 1 to 2 or 2 to 1
V
RWM
= 5V, T=25°C
Pin 1 to 2 or 2 to 1
I
PP
= 1A, tp = 8/20
μ
s
Pin 1 to 2 or 2 to 1
I
PP
= 2A, tp = 8/20
μ
s
Pin 1 to 2 or 2 to 1
tlp = 0.2 / 100ns
V
R
= 0V, f = 1MHz
0.78
6.5
9
6
8.2
3
Minimum
Typical
Maximum
5
9.5
50
12
15
Units
V
V
nA
V
V
Ohms
pF
Notes
1)ESD gun return path connected to ESD ground reference plane.
2)Transmission Line Pulse Test (TLP) Settings: t
p
= 100ns, t
r
= 0.2ns, I
TLP
and V
TLP
averaging window: t
1
= 70ns to t
2
= 90ns.
3) Dynamic resistance calculated from I
TLP
= 4A to I
TLP
= 16A
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2015 Semtech Corporation
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uClamp0541Z
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
1
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
15
Peak Pulse Power - P
PP
(kW)
Clamping Voltage - V
C
(V)
0.1
10
0.01
5
Waveform
Parameters:
tr = 8μs
td = 20μs
0.001
0.1
1
10
Pulse Duration - tp (µs)
100
0
0
0.5
1
1.5
Peak Pulse Current - I
PP
(A)
2
2.5
Junction Capacitance vs. Reverse Voltage
1.2
1
0.8
0.6
0.4
0.2
0
0
1
2
3
Reverse Voltage - V
R
(V)
4
5
f = 1 MHz
TLP Characteristic
25
Transmission Line Pulse Test (TLP)
Settings:
t
p
= 100ns, t
r
= 0.2ns,
I
TLP
and V
TLP
averaging window:
t
1
= 70ns to t
2
= 90ns
20
TLP Current (A)
C
J
(V
R
) / C
J
(V
R
=0)
15
10
5
0
0
5
10
15
TLP Voltage (V)
20
25
ESD Clamping (+8kV Contact per IEC 61000-4-2)
40
ESD Clamping (-8kV Contact per IEC 61000-4-2)
10
30
0
Voltage (V)
Voltage (V)
20
-10
10
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
-20
Measured with 50 Ohm scope
input impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
0
-30
-10
-10
0
10
20
30
40
50
60
70
80
Time (ns)
-40
-10
0
10
20
30
40
Time (ns)
50
60
70
80
©
2015 Semtech Corporation
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uClamp0541Z
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21
CH1 S21
LOG
6 dB / REF 0 dB
1: -2.0678 dB
800 MHz
2: -2.2545 dB
900 MHz
12
0 dB
-6 dB
3
3: -6.6417 dB
1.8 GHz
5
4
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
1
MHz
START . 030 MHz
10
MHz
100
MHz
4: -12.722 dB
2.5 GHz
3
1
GHz GHz
STOP 3000. 000000 MHz
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufactur-
ing parameters will require some experimentation to
get the desired solder application.
Assembly Parameter
Solder Stencil Design
Aper ture shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
©
2015 Semtech Corporation
Stencil Aperture
Mounting Pad
Package
0.175
0.272
0.250
R ecommendation
Laser cut, Electro-polished
Rectangular with rounded
corners
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
N on-Solder mask defined
OSP OR N iAu
4
0.298
0.270
Recommended Mounting Pattern
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uClamp0541Z
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3
A
D
B
DIMENSIONS
MILLIMETERS
DIM
MIN NOM MAX
A
A1
b
D
E
e
L
N
aaa
bbb
E
TOP VIEW
0.235 0.25 0.265
0.00
0.02 0.025
0.22 0.24
0.20
0.585 0.62 0.655
0.285 0.32 0.355
0.355 BSC
0.14
0.16 0.18
2
0.08
0.10
A
aaa C
A1
C
SEATING
PLANE
bbb
bxN
C A B
2xL
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3
DIMENSIONS
DIM
C
G
X
Y
Z
MILLIMETERS
(0.425)
0.175
0.270
0.250
0.675
(C)
G
Z
Y
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
©
2015 Semtech Corporation
5
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