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D55342M07U21D0C-W

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.25W, 21ohm, 100V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 1206, CHIP
产品类别无源元件    电阻器   
文件大小100KB,共1页
制造商State of the Art Inc
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D55342M07U21D0C-W概述

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 21ohm, 100V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 1206, CHIP

D55342M07U21D0C-W规格参数

参数名称属性值
是否Rohs认证不符合
Objectid7024488487
包装说明CHIP
Reach Compliance Codenot_compliant
Country Of OriginUSA
ECCN代码EAR99
YTEOL7.55
构造Chip
JESD-609代码e4
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
最低工作温度-55 °C
封装高度0.46 mm
封装长度3.2 mm
封装形状RECTANGULAR PACKAGE
封装形式SMT
封装宽度1.55 mm
包装方法WAFFLE PACK
额定功率耗散 (P)0.25 W
额定温度70 °C
参考标准MIL-PRF-55342
电阻21 Ω
电阻器类型FIXED RESISTOR
尺寸代码1206
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数300 ppm/°C
端子面层Platinum/Gold (Pt/Au)
端子形状WRAPAROUND
容差1%
工作电压100 V

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State of the Art, Inc.
Thick Film Chip Resistor
D55342/07 RM1206
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
250 mW
100 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
D55342 K 07 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable
G: Gold wraparound
SIZE CODE: /07* = RM1206
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
*RM1206 is specified in MIL-PRF-55342 as D55342 /07 rather than M55342 /07.
MECHANICAL
INCHES
MILLIMETERS
.156
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.126 (.118 - .134)
.061 (.058 - .068)
.018 (.015 - .033)
.016 (.010 - .025)
.018 (.010 - .025)
.090 (.086 - .094)
.0084 grams
3.20
1.55
0.46
0.41
0.46
2.29
(3.00 - 3.40)
(1.47 - 1.73)
(0.38 - 0.84)
(0.25 - 0.64)
(0.25 - 0.64)
(2.18 - 2.39)
.067
.084
.036
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
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