REV
K
DESCRIPTION
CO-14428
DATE
4/30/09
PREP
DF/LT
APPD
LT
DATE
PREPARED BY
QUALITY
ENGINEERING
VECTRON INTERNATIONAL
MOUNT HOLLY SPRINGS, PA 17065
Stan Carpenter
SWP
S. Carpenter
10/26/00
11/1/00
10/30/00
Oscillator Specification, Hybrid Clock
Hi-Rel Standard
CODE IDENT NO
SIZE
DWG. NO.
REV
00136
A
OS-68338
K
UNSPECIFIED TOLERANCES: N/A
SHEET 1 0F 20
1.
1.1
SCOPE
General. This specification defines the design, assembly and functional evaluation of high
reliability, hybrid clock oscillators produced by Vectron International. Devices delivered to
this specification represent the standardized Parts, Materials and Processes (PMP) Program
developed, implemented and certified for advanced applications and extended environments.
Applications Overview. The designs represented by these products were primarily developed
for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options
imbedded within OS-68338 bridge the gap between Space and COTS hardware by providing
custom hardware with measures of mechanical, assembly and reliability assurance needed for
Military or Ruggedized COTS environments.
1.2
2.
2.1
APPLICABLE DOCUMENTS
Specifications and Standards. The following specifications and standards form a part of this
document to the extent specified herein. The issue currently in effect on the date of quotation
will be the product baseline, unless otherwise specified. In the event of conflict between the
texts of any references cited herein, the text of this document shall take precedence.
Military
MIL-PRF-55310
MIL-PRF-38534
Standards
MIL-STD-202
MIL-STD-883
MIL-STD-1686
Oscillators, Crystal Controlled, General Specification For
Hybrid Microcircuits, General Specification For
Test Method Standard, Electronic and Electrical Component Parts
Test Methods and Procedures for Microelectronics
Electrostatic Discharge Control Program for Protection of Electrical and
Electronic Parts, Assemblies and Equipment
Other
HT-67849
QSP-90100
VL-65339
Test Specification, OS-68338 Hybrids, Hi-Rel Standard
Quality Systems Manual, Vectron International
Identification Common Documents, Materials and Processes, Hi-Rel XO
3.
3.1
GENERAL REQUIREMENTS
Classification. All devices delivered to this specification are of hybrid technology conforming
to Type 1, Class 2 of MIL-PRF-55310. Primarily developed as a Class S equivalent
specification, options are imbedded within it to also produce Class B, Engineering Model and
Ruggedized COTS devices. Devices carry a Class 2 ESDS classification.
SIZE
CODE IDENT NO.
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
A
00136
N/A
OS-68338
K
2
3.2
Item Identification. External packaging choices are of metal flatpacks, DIP’s and ceramic J-
lead 9x14mm and LCC’s with either TTL or ACMOS logic output. Unique Model Number
Series’ are utilized to identify device package configurations and output logic as listed in Table
1.
Absolute Maximum Ratings.
a. Supply Voltage Range (V
CC
):
b. Storage Temperature Range (T
STG
):
c. Junction Temperature (T
J
):
d. Lead Temperature (soldering, 10 seconds):
e. Output Source/Sink Current
3.3
-0.5Vdc to +7.0Vdc
-65°C to +125°C
+175°C
+300°C
±70 mA
3.4
3.4.1
Design, Parts, Materials and Processes, Assembly, Inspection and Test.
Design. The ruggedized designs implemented for these devices are proven in military and
space applications under extreme environments. Designs utilize 4-point crystal mounting in
compliment with Established Reliability (MIL-ER) componentry. When specified, radiation
hardening up to 100krad(Si) (RHA level R) can be included without altering the device’s
internal topography.
3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by reselecting
passive chip component values to offset component tolerances, there will not be fundamental
changes to the design or assembly or parts, materials and processes after first product delivery
of that item without written approval from the procuring activity.
3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of MIL-
PRF-55310. These designs have also passed extended dynamic levels of at least:
Sine Vibration: MIL-STD-202, Method 204, Condition G (30g pk.)
Random Vibration: MIL-STD-202, Method 214, Condition II-J (43.92g rms)
Mechanical Shock: MIL-STD-202, Method 213, Condition F (1500g, 0.5ms)
3.4.2
Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high
reliability devices produced to this specification.
a. Gold metallization of package elements without a barrier metal.
b. Zinc chromate as a finish.
c. Cadmium, zinc, or pure tin external or internal to the device.
d. Plastic encapsulated semiconductor devices.
e. Ultrasonically cleaned electronic parts.
f. Heterojunction Bipolar Transistor (HBT) technology.
g. ‘getter’ materials
Assembly. Manufacturing utilizes standardized procedures, processes and verification
methods to produce MIL-PRF-55310 Class S / MIL-PRF-38534 Class K equivalent devices.
MIL-PRF-38534 Group B Option 1 in-line inspection is included on radiation hardened part
numbers to further verify lot pedigree. Traceability of all components and production lots are
UNSPECIFIED TOLERANCES
3.4.3
SIZE
CODE IDENT NO.
DWG NO.
REV.
SHEET
A
00136
N/A
OS-68338
K
3
in accordance with MIL-PRF-38534, as a minimum. Tabulated records are provided as a part
of the deliverable data package. Devices are handled in accordance with MIL-STD-1686 for
Class 1 devices.
3.4.4
Inspection. The inspection requirements of MIL-PRF-55310 apply to all devices delivered to
this document. Inspection conditions and standards are documented in accordance with the
Quality Assurance, ISO-9001 derived, System of QSP-90100.
Test. The Screening test matrix of Table 5 is tailored for selectable-combination testing to
eliminate costs associated with the development/maintenance of device-specific documentation
packages while maintaining performance integrity.
Marking. Device marking shall be in accordance with the requirements of MIL-PRF-55310.
Ruggedized COTS Design Implementation. Design Pedigree “D” devices (see ¶ 5.2) use the
same robust designs found in the other device pedigrees. They do not include the provisions of
traceability or the Class-qualified componentry noted in paragraphs 3.4.3 and 4.1.
3.4.5
3.4.6
3.4.7
4.
4.1
4.1.1
DETAIL REQUIREMENTS
Components
Crystals. Cultured quartz crystal resonators are used to provide the selected frequency for the
devices. The optional use of Premium Q swept quartz can, because of its processing to remove
impurities, be specified for better frequency aging characteristics. In accordance with MIL-
PRF-55310, the manufacturer has a documented crystal element evaluation program.
Passive Components. Established Reliability (ER) failure level R minimum passive
components are procured from QPL suppliers. Lot evaluations are in accordance with MIL-
PRF-55310 or Enhanced Element Evaluation as specified in Table 7.
Class S Microcircuits. Microcircuits are procured from wafer lots that have passed MIL-PRF-
55310 Lot Acceptance Tests for Class S devices. The prescribed die carries a Class 2 ESDS
classification in accordance with MIL-PRF-38535. When optionally specified, further testing
in accordance with MIL-PRF-55310 and MIL-PRF-38534 is performed for radiation hardness
assurance and for Enhanced Element Evaluation as specified in Table 6. Those microcircuits,
identified by a unique part number, are certified for 100krad(Si) total ionizing dose (TID),
RHA level R (2X minimum margin). NSC, as the original 54ACT designer, rates the SEU
LET at >40 MeV and SEL at >120MeV for the FACT™ family (AN-932). Vectron has
conducted additional SEE testing in 2008 to verify this performance since our lot wafer testing
does not include these parameters and determinations.
4.1.2
4.1.3
SIZE
CODE IDENT NO.
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
A
00136
N/A
OS-68338
K
4
4.1.3.1 Class B Microcircuits. When specified, microcircuits assembled into OS-68338 Design
Pedigree letters “B” and “C” devices (¶ 5.2a) are procured from wafer lots that have passed
MIL-PRF-55310 element evaluations for Class B devices.
4.1.4
Packages. Packages are procured that meet the construction, lead materials and finishes as
specified in MIL-PRF-55310. Package lots are upscreened in accordance with the
requirements of MIL-PRF-38534 as applicable.
Traceability. Class S active device lots are homogenous and traceable to the manufacturer’s
individual wafer. Swept Quartz Crystals are traceable to the quartz bar and the processing
details of the autoclave lot, as applicable. All other elements and materials are traceable to
their manufacturer and incoming inspection lots.
Enhanced Element Evaluation. When Design Pedigree Option “E” is specified, active and
passive devices with Enhanced Element Evaluation as listed in Table 6 and 7 shall be
implemented for the highest reliability preference.
Mechanical.
Package Outline. Table 1 links each Hi-Rel Standard Model Number of this specification to a
corresponding package style. Mechanical Outline information of each package style is found
in the referenced Figure.
Thermal Characteristics. The worst case thermal characteristics of each package style are
found in Table 4.
Electrical.
Input Power. Devices are designed for standard 5.0 volt dc operation, ±10%. Optional 3.3
Vdc (±10%) input performance for ACMOS output conditions. Current is measured, no load,
at maximum rated operating voltage.
Temperature Range. Operating range is -55°C to +125°C.
Frequency Tolerance. Initial accuracy at +23°C is ±15 ppm maximum. Frequency-
Temperature Stability is ±50 ppm maximum from +23°C reference. Frequency-Voltage
Tolerance is ±4 ppm maximum.
Frequency Aging. Aging limits, and when tested in accordance with MIL-PRF-55310 Group B
inspection, shall not exceed ±1 ppm the first 30 days, ±5 ppm Year 1 and ±2 ppm per year
thereafter. When screening Option F is selected, aging is performed on 100% of the lot and
Vectron does not apply the PDA as specified in MIL-PRF-55310. Data will be presented for
each individual unit to show compliance to the aging limit.
4.1.5
4.1.6
4.2
4.2.1
4.2.2
4.3
4.3.1
4.3.2
4.3.3
4.3.4
SIZE
CODE IDENT NO.
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
A
00136
N/A
OS-68338
K
5
NXP MCU
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