电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

06032250P560CCB

产品描述Ceramic Capacitor, Multilayer, Ceramic, 250V, 44.64% +Tol, 44.64% -Tol, C0G, 30ppm/Cel TC, 0.00000056uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小197KB,共2页
制造商Syfer
标准  
下载文档 详细参数 全文预览

06032250P560CCB概述

Ceramic Capacitor, Multilayer, Ceramic, 250V, 44.64% +Tol, 44.64% -Tol, C0G, 30ppm/Cel TC, 0.00000056uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT

06032250P560CCB规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid1673945023
包装说明, 0603
Reach Compliance Codecompliant
Country Of OriginMainland China
ECCN代码EAR99
YTEOL8.08
电容5.6e-7 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
JESD-609代码e3
制造商序列号0603
安装特点SURFACE MOUNT
多层Yes
负容差44.64%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法BULK
正容差44.64%
额定(直流)电压(URdc)250 V
尺寸代码0603
表面贴装YES
温度特性代码C0G
温度系数30ppm/Cel ppm/°C
端子面层Matte Tin (Sn)
端子形状WRAPAROUND

文档预览

下载PDF文档
MLCCs
for Non-
magnetic
applications
C0G/NP0, High Q and X7R
Copper Barrier MLCCs
Multilayer ceramic capacitors
with silver/palladium (Ag/Pd)
terminations have often been
used in medical applications
where non-magnetic
components are required, for
example in MRI equipment.
The use of conventional nickel
barrier terminations is not
suitable due to nickel exhibiting
magnetic properties.
However, RoHS requirements
have dictated the use of
lead-free solders, and the
composition of these solders
has resulted in an increase in
soldering temperatures. This
has caused solder leaching
problems for the Ag/Pd
termination, and meant
alternative terminations have
had to be found.
Specification
Capacitance Values
C0G/NP0 & High Q
0.1pF - 15nF
X7R
47pF - 6.8µF
See overleaf for full list of values
Mechanical
Termination Material
See ordering information below
Solderability
IEC 60068-2-58. Passed 3 times reflow
profile defined in J-STD-020
Printing
Consult sales office
Lead Free Soldering
Termination codes 2 and 3 ranges are
fully compliant with the RoHS and WEEE
directives and parts are compatible with lead
free solders.
Climatic Category
55/125/56
Reeled Quantities
See Capacitance tables overleaf
Electrical
C0G/NP0
-55°C to
+125°C
High Q
-55°C to
+125°C
X7R
-55°C to
+125°C
Operating Temperature
Temperature Coefficient
(Typical)
0 ± 30
ppm/°C
0 ± 30
ppm/°C
±15%
Insulation Resistance
Time constant (Ri xCr) (whichever is the least)
100GΩ or
1000s
Ageing Rate
None
None
Typical 1% per
time decade
100GΩ or
1000s
100GΩ or
1000s
Ordering Information
1210
Chip
size
0402
0603
0505
0805
1206
1111
1210
1808
1812
2220
2225
3
Termination
2
(for C0G/NP0
& High Q only)
= Sintered
silver base with
copper barrier
(100% matte tin
plating). RoHS
compliant.
100
Voltage
0103
Capacitance in
picofarads (pF)
J
Capacitance
tolerance
X
Dielectric
T
Packaging
___
Suffix
As copper is non-magnetic,
one solution is to use a copper
barrier instead of a nickel
barrier, with a tin finish on top,
and this is the solution Syfer
has developed.
This copper barrier termination
is offered with selected non-
magnetic C0G/NP0, High Q
and X7R dielectrics, providing a
fully non-magnetic component.
To meet high temperature
260ºC soldering reflow profiles
as detailed in J-STD-020, C0G/
NP0 dielectrics are supplied
with sintered termination and
X7R dielectrics are supplied
with Syfer’s award winning
FlexiCap™ termination.
41/09
016 = 16V <10pF Insert a P for
C
= C0G/
T
= 178mm Used for
<4.7pF
the decimal point, H = ±0.05pF NP0 (1B)
025 = 25V
(7”) reel
specific
050 = 50V
eg P300 = 0.3pF,
customer
B = ±0.1pF
X
= X7R
R
= 330mm
8P20 = 8.2pF.
063 = 63V
C = ±0.25pF
(2R1)
(13”) reel requirements
100 = 100V
D = ±0.5pF
10pF 1st digit
Q
= High Q
B
= Bulk
150 = 150V
is 0. 2nd and
4.7pF &
pack - tubs
200 = 200V
3rd digits are
<10pF
250 = 250V significant figures
B = ±0.1pF
3
= FlexiCap™ 500 = 500V
of capacitance
C = ±0.25pF
630 = 630V code. The 4th digit D = ±0.5pF
base with
1K0 = 1000V is number of 0’s
copper barrier
10pF
(100% matte 1K2 = 1200V
following
F = ±1%
1K5 = 1500V
tin plating).
eg. 0103 =
G = ±2%
RoHS compliant. 2K0 = 2000V
10000pF
J = ±5%
3K0 = 3000V
K = ±10%
Values <1pF in
0.1pF steps, above
this values are E24
series
ucos学习之OSSemCreate()函数分析
小弟初学ucos,如下是这个函数的源代码,小弟有些不懂,恳请大神指教~~~ OS_EVENT *OSSemCreate (INT16U cnt) { OS_EVENT *pevent; #if OS_CRITICAL_METHOD == 3 ......
liuchang--- 实时操作系统RTOS
自动调零放大器在应变测试仪中的应用
引言应变片式传感器应用十分广泛,它采用电桥式电路结构,以提高输出灵敏度。但一个微应变桥路输出只有2 mV左右,即使在满载情况下,应变片的最大输出也只有数十mV,这就要求前置测量放大电路具 ......
rain 模拟电子
状态机的编程经验谈
在中大型设计中,状态机的使用也越来越频繁,我们要如何编写一个让人容易读懂的状态机就是眼前最重要的事情。下面我们先来回顾一下状态机的分类。状态机共分为两大类一类是Moore状态机,一类是M ......
eeleader FPGA/CPLD
12864液晶为什么要测忙?
看到资料上面在每次读写之前都要进行读写,1602也是,这是为什么,是因为他们内部结构的问题还是指令转换?? ...
毛毛159 51单片机
请问怎样用ramdisk虚拟启动软盘?(在VMWare上安装vxworks)
我的系统是XP SP2, ramdisk2.0,在VMWare上安装vxworks...
haxinglong 实时操作系统RTOS
求助: 两MCU 通过I2C 通讯?
我想用两个IO口,一个做SCL,一个做SDA, 实现两个MCU通讯, 一个MCU做主机,一个做从机,主机的很好实现,因为SCL信号由主机控制。但是从机的话,很难实现跟主机同步,从机这部分,要如何处理 ......
lefantian 单片机

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1141  149  2210  2593  2854  23  3  45  53  58 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved