IC LS SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14, Gate
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 系列 | LS |
| JESD-30 代码 | R-GDIP-T14 |
| 长度 | 19.43 mm |
| 负载电容（CL） | 15 pF |
| 逻辑集成电路类型 | INVERTER |
| 最大I（ol） | 0.004 A |
| 功能数量 | 6 |
| 输入次数 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-COLLECTOR |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 最大电源电流（ICC） | 6.6 mA |
| Prop。Delay @ Nom-Sup | 45 ns |
| 传播延迟（tpd） | 15 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 54LS05DMQB | DM54LS05W/883 | 54LS05FMQB | DM54LS05J/883 | DM74LS05M | DM74LS05MX | DM74LS05N | |
|---|---|---|---|---|---|---|---|
| 描述 | IC LS SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14, Gate | LS SERIES, HEX 1-INPUT INVERT GATE, CDFP14, CERAMIC, FP-14 | IC LS SERIES, HEX 1-INPUT INVERT GATE, CDFP14, CERAMIC, FP-14, Gate | LS SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14 | IC LS SERIES, HEX 1-INPUT INVERT GATE, PDSO14, 0.150 INCH, PLASTIC, SOIC-14, Gate | LS SERIES, HEX 1-INPUT INVERT GATE, PDSO14, 0.150 INCH, PLASTIC, SOIC-14 | LS SERIES, HEX 1-INPUT INVERT GATE, PDIP14, PLASTIC, DIP-14 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP | DFP | DFP | DIP | SOIC | SOIC | DIP |
| 包装说明 | DIP, DIP14,.3 | DFP, FL14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, | DIP, DIP14,.3 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | LS | LS | LS | LS | LS | LS | LS |
| JESD-30 代码 | R-GDIP-T14 | R-GDFP-F14 | R-GDFP-F14 | R-GDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 |
| 长度 | 19.43 mm | 9.5885 mm | 9.5885 mm | 19.43 mm | 8.65 mm | 8.65 mm | 19.18 mm |
| 负载电容（CL） | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF |
| 逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
| 功能数量 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| 输入次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | - | - |
| 输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DFP | DFP | DIP | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | FLATPACK | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 最大电源电流（ICC） | 6.6 mA | 6.6 mA | 6.6 mA | 6.6 mA | 6.6 mA | 6.6 mA | 6.6 mA |
| 传播延迟（tpd） | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.032 mm | 2.032 mm | 5.08 mm | 1.75 mm | 1.75 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | YES | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 6.35 mm | 6.35 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 最大I（ol） | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.008 A | - | 0.008 A |
| 封装等效代码 | DIP14,.3 | FL14,.3 | FL14,.3 | DIP14,.3 | SOP14,.25 | - | DIP14,.3 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| Prop。Delay @ Nom-Sup | 45 ns | 20 ns | 45 ns | 20 ns | 45 ns | - | 45 ns |
| 施密特触发器 | NO | NO | NO | NO | NO | - | NO |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | - | - |
| 是否Rohs认证 | - | 不符合 | - | 不符合 | 不符合 | - | 不符合 |
| JESD-609代码 | - | e0 | - | e0 | e0 | - | e0 |
| 端子面层 | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
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