IC F/FAST SERIES, DUAL 6-INPUT AND-OR-INVERT GATE, CDIP14, Gate
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 其他特性 | ASYMMETRICAL I/P\'S |
| 系列 | F/FAST |
| JESD-30 代码 | R-GDIP-T14 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | AND-OR-INVERT GATE |
| 功能数量 | 2 |
| 输入次数 | 6 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 最大电源电流（ICC） | 7.5 mA |
| 传播延迟（tpd） | 5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 54F51/BCA | N54F51/BDA | 54F51/BDA | 54F51/B2A | N54F51/B2A | |
|---|---|---|---|---|---|
| 描述 | IC F/FAST SERIES, DUAL 6-INPUT AND-OR-INVERT GATE, CDIP14, Gate | IC F/FAST SERIES, DUAL 6-INPUT AND-OR-INVERT GATE, CDFP14, CERAMIC, DFP-14, Gate | IC F/FAST SERIES, DUAL 6-INPUT AND-OR-INVERT GATE, CDFP14, Gate | IC F/FAST SERIES, DUAL 6-INPUT AND-OR-INVERT GATE, CQCC20, Gate | IC F/FAST SERIES, DUAL 6-INPUT AND-OR-INVERT GATE, CQCC20, CERAMIC, LLCC-20, Gate |
| 包装说明 | DIP, | DFP, | DFP, | QCCN, | QCCN, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | ASYMMETRICAL I/P\'S | ASYMMETRICAL I/P\'S | ASYMMETRICAL I/P\'S | ASYMMETRICAL I/P\'S | ASYMMETRICAL I/P\'S |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | R-GDIP-T14 | R-CDFP-F14 | R-CDFP-F14 | S-CQCC-N20 | S-CQCC-N20 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 输入次数 | 6 | 6 | 6 | 6 | 6 |
| 端子数量 | 14 | 14 | 14 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DFP | DFP | QCCN | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | IN-LINE | FLATPACK | FLATPACK | CHIP CARRIER | CHIP CARRIER |
| 最大电源电流（ICC） | 7.5 mA | 7.5 mA | 7.5 mA | 7.5 mA | 7.5 mA |
| 传播延迟（tpd） | 5 ns | 5 ns | 5 ns | 5 ns | 5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | FLAT | FLAT | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD |
| 厂商名称 | NXP(恩智浦) | - | - | NXP(恩智浦) | NXP(恩智浦) |
| 座面最大高度 | 5.08 mm | 2.159 mm | - | - | 1.905 mm |
| 端子节距 | 2.54 mm | 1.27 mm | - | - | 1.27 mm |
| 宽度 | 7.62 mm | 6.2865 mm | - | - | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 | - | - |
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