IC reg ctrlr buck pwm CM 24-ssop
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | SSOP |
| 包装说明 | 0.150 INCH, PLASTIC, SSOP-24 |
| 针数 | 24 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION |
| 最大输入电压 | 30 V |
| 最小输入电压 | 3.5 V |
| 标称输入电压 | 15 V |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e0 |
| 长度 | 8.65 mm |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 2 A |
| 标称输出电压 | 1.19 V |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP24,.24 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 表面贴装 | YES |
| 切换器配置 | PUSH-PULL |
| 最大切换频率 | 400 kHz |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 宽度 | 3.9116 mm |
| LTC1436IGN | LTC1436CGN-PLL | LTC1436CGN | LTC1437CG | LTC1437CG#TR | 106RN54S-3C6-18.0 | P-2208H4223FGWP | LTC1437CG#PBF | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC reg ctrlr buck pwm CM 24-ssop | IC reg ctrlr buck pwm CM 24-ssop | IC reg ctrlr buck pwm CM 24-ssop | IC reg ctrlr buck pwm CM 28-ssop | IC reg ctrlr buck pwm CM 28-ssop | D Type Connector, 54 Contact(s), Female, Crimp Terminal, Receptacle | Fixed Resistor, Thin Film, 0.8W, 422000ohm, 150V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 2208, CHIP | IC REG CTRLR BUCK 28SSOP |
| Reach Compliance Code | _compli | _compli | _compli | _compli | compli | unknown | compliant | compliant |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e4 | e4 | e3 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 符合 | 符合 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | - | - | Linear ( ADI ) |
| 零件包装代码 | SSOP | SSOP | SSOP | SSOP | SSOP | - | - | SSOP |
| 包装说明 | 0.150 INCH, PLASTIC, SSOP-24 | 0.150 INCH, PLASTIC, SSOP-24 | 0.150 INCH, PLASTIC, SSOP-24 | SSOP, SSOP28,.3 | SSOP, | - | SMT, 2208 | SSOP, |
| 针数 | 24 | 24 | 24 | 28 | 28 | - | - | 28 |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | - | - | SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | - | - | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | - | - | PULSE WIDTH MODULATION |
| 最大输入电压 | 30 V | 30 V | 30 V | 30 V | 30 V | - | - | 30 V |
| 最小输入电压 | 3.5 V | 3.5 V | 3.5 V | 3.5 V | 3.5 V | - | - | 3.5 V |
| 标称输入电压 | 15 V | 15 V | 15 V | 15 V | 15 V | - | - | 15 V |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G28 | R-PDSO-G28 | - | - | R-PDSO-G28 |
| 长度 | 8.65 mm | 8.65 mm | 8.65 mm | 10.2 mm | 10.2 mm | - | - | 10.2 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | - | 1 |
| 端子数量 | 24 | 24 | 24 | 28 | 28 | - | 2 | 28 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | - | 155 °C | 70 °C |
| 最大输出电流 | 2 A | 2 A | 2 A | 2 A | 2 A | - | - | 2 A |
| 标称输出电压 | 1.19 V | 1.19 V | 1.19 V | 1.19 V | 1.19 V | - | - | 1.19 V |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY |
| 封装代码 | SSOP | SSOP | SSOP | SSOP | SSOP | - | - | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | SMT | SMALL OUTLINE, SHRINK PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 2 mm | 2 mm | - | - | 2 mm |
| 表面贴装 | YES | YES | YES | YES | YES | - | YES | YES |
| 切换器配置 | PUSH-PULL | PUSH-PULL | PUSH-PULL | PUSH-PULL | PUSH-PULL | - | - | PUSH-PULL |
| 最大切换频率 | 400 kHz | 400 kHz | 400 kHz | 400 kHz | 400 kHz | - | - | 400 kHz |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | THIN FILM | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | - | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Gold (Au) - with Nickel (Ni) barrier | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - | - | GULL WING |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.65 mm | 0.65 mm | - | - | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | - | DUAL |
| 宽度 | 3.9116 mm | 3.9116 mm | 3.9116 mm | 5.3 mm | 5.3 mm | - | - | 5.3 mm |
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