Bus Driver, 2-Func, 4-Bit, True Output, CMOS, CQCC20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 包装说明 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | not_compliant |
| 控制类型 | ENABLE LOW/HIGH |
| JESD-30 代码 | S-XQCC-N20 |
| JESD-609代码 | e0 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I(ol) | 0.048 A |
| 位数 | 4 |
| 功能数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度(摄氏度) | 225 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 4.6 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| Base Number Matches | 1 |
| 54FCT241CTLB | MFP-12PRA26-407R | 54FCT241TDB | 74FCT241CTP | 74FCT241CTSO | 74FCT241DTP | |
|---|---|---|---|---|---|---|
| 描述 | Bus Driver, 2-Func, 4-Bit, True Output, CMOS, CQCC20 | Fixed Resistor, Metal Film, 0.1666W, 407ohm, 150V, 0.02% +/-Tol, -5,5ppm/Cel, | CDIP-20, Tube | PDIP-20, Tube | SOIC-20, Tube | Bus Driver, 2-Func, 4-Bit, True Output, CMOS, PDIP20 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | compliant | not_compliant | _compli | _compli | _compli |
| JESD-609代码 | e0 | e3 | e0 | e0 | e0 | e0 |
| 端子数量 | 20 | 2 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 155 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| 封装形状 | SQUARE | CYLINDRICAL PACKAGE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | Axial | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 表面贴装 | YES | NO | NO | NO | YES | NO |
| 技术 | CMOS | METAL FILM | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 |
| 厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 包装说明 | QCCN, LCC20,.35SQ | - | CERDIP-20 | DIP, DIP20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 |
| 控制类型 | ENABLE LOW/HIGH | - | ENABLE LOW/HIGH | ENABLE LOW/HIGH | ENABLE LOW/HIGH | ENABLE LOW/HIGH |
| JESD-30 代码 | S-XQCC-N20 | - | R-GDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-PDIP-T20 |
| 负载电容(CL) | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I(ol) | 0.048 A | - | 0.048 A | 0.064 A | 0.064 A | 0.064 A |
| 位数 | 4 | - | 4 | 4 | 4 | 4 |
| 功能数量 | 2 | - | 2 | 2 | 2 | 2 |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | - | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCN | - | DIP | DIP | SOP | DIP |
| 封装等效代码 | LCC20,.35SQ | - | DIP20,.3 | DIP20,.3 | SOP20,.4 | DIP20,.3 |
| 峰值回流温度(摄氏度) | 225 | - | 240 | 245 | 225 | 225 |
| 电源 | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 温度等级 | MILITARY | - | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | - | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | - | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 |
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