DRAM Module, 1MX9, 120ns, CMOS, SIMM-30
参数名称 | 属性值 |
厂商名称 | Hitachi (Renesas ) |
零件包装代码 | SIMM |
包装说明 | SIMM, SIM30 |
针数 | 30 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | PAGE |
最长访问时间 | 120 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON |
JESD-30 代码 | R-XSMA-N30 |
内存密度 | 9437184 bit |
内存集成电路类型 | DRAM MODULE |
内存宽度 | 9 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 30 |
字数 | 1048576 words |
字数代码 | 1000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1MX9 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装代码 | SIMM |
封装等效代码 | SIM30 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
电源 | 5 V |
认证状态 | Not Qualified |
刷新周期 | 1024 |
座面最大高度 | 20.447 mm |
最大待机电流 | 0.009 A |
最大压摆率 | 0.45 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子节距 | 2.54 mm |
端子位置 | SINGLE |
Base Number Matches | 1 |
HB56A19B-12 | HB56A19A-12 | HB56A19A-10 | HB56A19B-10 | HB56A19A-15 | HB56A19B-15 | |
---|---|---|---|---|---|---|
描述 | DRAM Module, 1MX9, 120ns, CMOS, SIMM-30 | DRAM Module, 1MX9, 120ns, CMOS, SIMM-30 | DRAM Module, 1MX9, 100ns, CMOS, SIMM-30 | DRAM Module, 1MX9, 100ns, CMOS, SIMM-30 | DRAM Module, 1MX9, 150ns, CMOS, SIMM-30 | DRAM Module, 1MX9, 150ns, CMOS, SIMM-30 |
厂商名称 | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
零件包装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
包装说明 | SIMM, SIM30 | , SIP30,.2 | , SIP30,.2 | SIMM, SIM30 | , SIP30,.2 | SIMM, SIM30 |
针数 | 30 | 30 | 30 | 30 | 30 | 30 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | PAGE | PAGE | PAGE | PAGE | PAGE | PAGE |
最长访问时间 | 120 ns | 120 ns | 100 ns | 100 ns | 150 ns | 150 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XSMA-N30 | R-XSMA-T30 | R-XSMA-T30 | R-XSMA-N30 | R-XSMA-T30 | R-XSMA-N30 |
内存密度 | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bi |
内存集成电路类型 | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE |
内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 30 | 30 | 30 | 30 | 30 | 30 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装等效代码 | SIM30 | SIP30,.2 | SIP30,.2 | SIM30 | SIP30,.2 | SIM30 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
座面最大高度 | 20.447 mm | 20.574 mm | 20.574 mm | 20.447 mm | 20.574 mm | 20.447 mm |
最大待机电流 | 0.009 A | 0.009 A | 0.009 A | 0.009 A | 0.009 A | 0.009 A |
最大压摆率 | 0.45 mA | 0.45 mA | 0.54 mA | 0.54 mA | 0.36 mA | 0.36 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
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