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LTC4217HFE#PBF

产品描述IC ctrlr hot swap 2A 20tssop
产品类别电源/电源管理    电源电路   
文件大小192KB,共6页
制造商Linear ( ADI )
官网地址http://www.analog.com/cn/index.html
标准
下载文档 详细参数 选型对比 全文预览

LTC4217HFE#PBF概述

IC ctrlr hot swap 2A 20tssop

LTC4217HFE#PBF规格参数

参数名称属性值
Brand NameLinear Technology
是否Rohs认证符合
厂商名称Linear ( ADI )
零件包装代码TSSOP
包装说明HTSSOP, TSSOP20,.25
针数20
制造商包装代码FE
Reach Compliance Codecompli
ECCN代码EAR99
可调阈值YES
模拟集成电路 - 其他类型POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 代码R-PDSO-G20
JESD-609代码e3
长度6.5 mm
湿度敏感等级1
信道数量1
功能数量1
端子数量20
最高工作温度125 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码HTSSOP
封装等效代码TSSOP20,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)NOT SPECIFIED
电源12 V
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电流 (Isup)3 mA
最大供电电压 (Vsup)26.5 V
最小供电电压 (Vsup)2.9 V
标称供电电压 (Vsup)12 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度4.4 mm

LTC4217HFE#PBF相似产品对比

LTC4217HFE#PBF LTC4217CDHC-12#TR LTC4217CDHC#PBF LTC4217CFE#PBF DC1051A LTC4217CFE#TR LTC4217CDHC#TR LTC4217IDHC#TR LTC4217IDHC-12#TR LTC4217IFE#TR
描述 IC ctrlr hot swap 2A 20tssop IC 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO16, 5 X 3 MM, PLASTIC, MO-229WJED-1, DFN-16, Power Management Circuit IC ctrlr hot swap 2A 16-dfn IC ctrlr hot swap 2A 20-tssop board demo for ltc4217 IC 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO20, 4.40 MM, PLASTIC, SSOP-20, Power Management Circuit IC 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO16, 5 X 3 MM, PLASTIC, MO-229WJED-1, DFN-16, Power Management Circuit IC 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO16, 5 X 3 MM, PLASTIC, MO-229WJED-1, DFN-16, Power Management Circuit IC 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO16, 5 X 3 MM, PLASTIC, MO-229WJED-1, DFN-16, Power Management Circuit IC 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO20, 4.40 MM, PLASTIC, SSOP-20, Power Management Circuit
是否Rohs认证 符合 不符合 符合 符合 - 不符合 不符合 不符合 不符合 不符合
厂商名称 Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) - Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI )
零件包装代码 TSSOP SON DFN TSSOP - SSOP SON SON SON SSOP
包装说明 HTSSOP, TSSOP20,.25 HVSON, SOLCC16,.12,20 HVSON, SOLCC16,.12,20 HTSSOP, TSSOP20,.25 - HTSSOP, TSSOP20,.25 HVSON, SOLCC16,.12,20 HVSON, SOLCC16,.12,20 HVSON, SOLCC16,.12,20 HTSSOP, TSSOP20,.25
针数 20 16 16 20 - 20 16 16 16 20
Reach Compliance Code compli not_compliant compliant compliant - not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99
可调阈值 YES YES YES YES - YES YES YES YES YES
模拟集成电路 - 其他类型 POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT - POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 代码 R-PDSO-G20 R-PDSO-N16 R-PDSO-N16 R-PDSO-G20 - R-PDSO-G20 R-PDSO-N16 R-PDSO-N16 R-PDSO-N16 R-PDSO-G20
JESD-609代码 e3 e0 e3 e3 - e0 e0 e0 e0 e0
长度 6.5 mm 5 mm 5 mm 6.5 mm - 6.5 mm 5 mm 5 mm 5 mm 6.5 mm
湿度敏感等级 1 1 1 1 - 1 1 1 1 1
信道数量 1 1 1 1 - 1 1 1 1 1
功能数量 1 1 1 1 - 1 1 1 1 1
端子数量 20 16 16 20 - 20 16 16 16 20
最高工作温度 125 °C 70 °C 70 °C 70 °C - 70 °C 70 °C 85 °C 85 °C 85 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HTSSOP HVSON HVSON HTSSOP - HTSSOP HVSON HVSON HVSON HTSSOP
封装等效代码 TSSOP20,.25 SOLCC16,.12,20 SOLCC16,.12,20 TSSOP20,.25 - TSSOP20,.25 SOLCC16,.12,20 SOLCC16,.12,20 SOLCC16,.12,20 TSSOP20,.25
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) NOT SPECIFIED 235 250 250 - 235 235 255 235 235
电源 12 V 12 V 12 V 12 V - 12 V 12 V 12 V 12 V 12 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 0.8 mm 0.8 mm 1.2 mm - 1.2 mm 0.8 mm 0.8 mm 0.8 mm 1.2 mm
最大供电电流 (Isup) 3 mA 3 mA 3 mA 3 mA - 3 mA 3 mA 3 mA 3 mA 3 mA
最大供电电压 (Vsup) 26.5 V 26.5 V 26.5 V 26.5 V - 26.5 V 26.5 V 26.5 V 26.5 V 26.5 V
最小供电电压 (Vsup) 2.9 V 2.9 V 2.9 V 2.9 V - 2.9 V 2.9 V 2.9 V 2.9 V 2.9 V
标称供电电压 (Vsup) 12 V 12 V 12 V 12 V - 12 V 12 V 12 V 12 V 12 V
表面贴装 YES YES YES YES - YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS - CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE COMMERCIAL COMMERCIAL COMMERCIAL - COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) Tin/Lead (Sn/Pb) Matte Tin (Sn) Matte Tin (Sn) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING NO LEAD NO LEAD GULL WING - GULL WING NO LEAD NO LEAD NO LEAD GULL WING
端子节距 0.65 mm 0.5 mm 0.5 mm 0.65 mm - 0.65 mm 0.5 mm 0.5 mm 0.5 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL - DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED 20 NOT SPECIFIED NOT SPECIFIED - 20 20 40 20 20
宽度 4.4 mm 3 mm 3 mm 4.4 mm - 4.4 mm 3 mm 3 mm 3 mm 4.4 mm
是否无铅 - 含铅 - - - 含铅 含铅 含铅 含铅 含铅

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