Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, 0.300 INCH, LEAD FREE, SOJ-32
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Integrated Silicon Solution ( ISSI ) |
零件包装代码 | SOJ |
包装说明 | SOJ, SOJ32,.34 |
针数 | 32 |
Reach Compliance Code | compli |
ECCN代码 | 3A991.B.2.B |
Factory Lead Time | 8 weeks |
最长访问时间 | 10 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-J32 |
JESD-609代码 | e3 |
长度 | 20.955 mm |
内存密度 | 1048576 bi |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 32 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 128KX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOJ |
封装等效代码 | SOJ32,.34 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 260 |
电源 | 2.5/3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 3.405 mm |
最大待机电流 | 0.000055 A |
最小待机电流 | 2 V |
最大压摆率 | 0.055 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.4 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | MATTE TIN |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 7.62 mm |
Base Number Matches | 1 |
IS63WV1288DBLL-10JLI | IS63WV1288DBLL-10JLI-TR | IS63WV1288DBLL-10TLI | IS63WV1288DBLL-10TLI-TR | IS63WV1288DBLL-10HLI-TR | IS63WV1288DBLL-10KLI | IS63WV1288DBLL-10KLI-TR | |
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描述 | Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, 0.300 INCH, LEAD FREE, SOJ-32 | Standard SRAM, 128KX8, 10ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, 0.400 INCH, LEAD FREE, TSOP2-32 | Standard SRAM, 128KX8, 10ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 10ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, SOJ-32 | IC SRAM 1MBIT 10NS 32SOIC |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compliant | compliant |
最长访问时间 | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns |
JESD-30 代码 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-J32 | R-PDSO-J32 |
内存密度 | 1048576 bi | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOJ | SOJ | TSOP2 | TSOP | TSSOP | SOJ | SOJ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | J BEND | J BEND | GULL WING | GULL WING | GULL WING | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.5 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
包装说明 | SOJ, SOJ32,.34 | - | TSOP2, TSOP32,.46 | - | - | SOJ, SOJ32,.44 | SOJ, |
Factory Lead Time | 8 weeks | 8 weeks | 8 weeks | 8 weeks | - | - | 8 weeks |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | - |
长度 | 20.955 mm | - | 20.95 mm | - | - | 20.95 mm | 20.95 mm |
功能数量 | 1 | - | 1 | - | - | 1 | 1 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
封装等效代码 | SOJ32,.34 | SOJ32,.34 | TSOP32,.46 | TSOP32,.46 | TSSOP32,.56,20 | SOJ32,.44 | - |
峰值回流温度(摄氏度) | 260 | - | 260 | - | - | NOT SPECIFIED | NOT SPECIFIED |
电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | 3.405 mm | - | 1.2 mm | - | - | 3.76 mm | 3.76 mm |
最大待机电流 | 0.000055 A | 0.000055 A | 0.000055 A | 0.000055 A | 0.000055 A | 0.000055 A | - |
最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | - |
最大压摆率 | 0.055 mA | 0.055 mA | 0.055 mA | 0.055 mA | 0.055 mA | 0.055 mA | - |
最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | - | - | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.4 V | - | 2.4 V | - | - | 2.4 V | 2.4 V |
处于峰值回流温度下的最长时间 | 40 | - | 40 | - | - | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | - | 10.16 mm | - | - | 10.16 mm | 10.16 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
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