IC controller hot swap 10-msop
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | MSOP |
| 包装说明 | TSSOP, TSSOP10,.19,20 |
| 针数 | 10 |
| 制造商包装代码 | MS |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PDSO-G10 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP10,.19,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 235 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电流 (Isup) | 1.5 mA |
| 最大供电电压 (Vsup) | 16.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 3 mm |
| Base Number Matches | 1 |
| LTC4211CMS#TR | LTC4211CS8#PBF | LTC4211CS8#TR | LTC4211CMS8#TR | LTC4211IMS8#TR | LTC4211IS8#TR | LTC4211IMS#TR | DC536A-A | DC536A-B | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC controller hot swap 10-msop | IC controller hot swap 8-soic | IC controller hot swap 8-soic | IC controller hot swap 8-msop | IC controller hot swap 8-msop | IC controller hot swap 8-soic | IC controller hot swap 10-msop | demo board for ltc4211 7A | demo board for ltc4211 20a |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | - | - |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | - |
| 零件包装代码 | MSOP | SOIC | SOIC | MSOP | MSOP | SOIC | MSOP | - | - |
| 包装说明 | TSSOP, TSSOP10,.19,20 | SOP, SOP8,.25 | SOP, SOP8,.25 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 | PLASTIC, MSOP-10 | - | - |
| 针数 | 10 | 8 | 8 | 8 | 8 | 8 | 10 | - | - |
| 制造商包装代码 | MS | S8 | S8 | MS8 | MS8 | S8 | MS | - | - |
| Reach Compliance Code | _compli | compli | _compli | _compli | _compli | _compli | _compli | - | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - |
| 可调阈值 | YES | YES | YES | YES | YES | YES | YES | - | - |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - | - |
| JESD-30 代码 | S-PDSO-G10 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | S-PDSO-G10 | - | - |
| JESD-609代码 | e0 | e3 | e0 | e0 | e0 | e0 | e0 | - | - |
| 长度 | 3 mm | 4.9025 mm | 4.9025 mm | 3 mm | 3 mm | 4.9025 mm | 3 mm | - | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 端子数量 | 10 | 8 | 8 | 8 | 8 | 8 | 10 | - | - |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | TSSOP | SOP | SOP | TSSOP | TSSOP | SOP | TSSOP | - | - |
| 封装等效代码 | TSSOP10,.19,20 | SOP8,.25 | SOP8,.25 | TSSOP8,.19 | TSSOP8,.19 | SOP8,.25 | TSSOP10,.19,20 | - | - |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | - | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - |
| 峰值回流温度（摄氏度） | 235 | 260 | 235 | 235 | 235 | 235 | 235 | - | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 座面最大高度 | 1.1 mm | 1.752 mm | 1.752 mm | 1.1 mm | 1.1 mm | 1.752 mm | 1.1 mm | - | - |
| 最大供电电流 (Isup) | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | - | - |
| 最大供电电压 (Vsup) | 16.5 V | 16.5 V | 16.5 V | 16.5 V | 16.5 V | 16.5 V | 16.5 V | - | - |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - | - |
| 端子节距 | 0.5 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.5 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | 20 | 30 | 20 | 20 | 20 | 20 | 20 | - | - |
| 宽度 | 3 mm | 3.899 mm | 3.899 mm | 3 mm | 3 mm | 3.899 mm | 3 mm | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
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