OT PLD, 17ns, CMOS, PDIP28, PLASTIC, DIP-28
参数名称 | 属性值 |
厂商名称 | Altera (Intel) |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 28 |
Reach Compliance Code | unknown |
其他特性 | 32 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS |
最大时钟频率 | 71.4 MHz |
JESD-30 代码 | R-PDIP-T28 |
长度 | 34.29 mm |
专用输入次数 | 7 |
I/O 线路数量 | 16 |
端子数量 | 28 |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 7 DEDICATED INPUTS, 16 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
可编程逻辑类型 | OT PLD |
传播延迟 | 17 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.318 mm |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
Base Number Matches | 1 |
EPM5032PC28-17 | EPM5032JC28-17 | EPM5032DC28-17 | EPM5032JM28-25 | EPM5032LC28-17 | EPM5032JC28-25 | EPM5032LM28-25 | EPM5032JI28-25 | EPM5032DM28-25 | EPM5032PM28-25 | |
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描述 | OT PLD, 17ns, CMOS, PDIP28, PLASTIC, DIP-28 | UV PLD, 17ns, CMOS, CQCC28, WINDOWED, CERAMIC, JLCC-28 | UV PLD, 17ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | UV PLD, 25ns, CMOS, CQCC28, WINDOWED, CERAMIC, JLCC-28 | OT PLD, 17ns, CMOS, PQCC28, PLASTIC, LCC-28 | UV PLD, 25ns, CMOS, CQCC28, WINDOWED, CERAMIC, JLCC-28 | OT PLD, 25ns, CMOS, PQCC28, PLASTIC, LCC-28 | UV PLD, 25ns, CMOS, CQCC28, WINDOWED, CERAMIC, JLCC-28 | UV PLD, 25ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | OT PLD, 25ns, CMOS, PDIP28, PLASTIC, DIP-28 |
厂商名称 | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
零件包装代码 | DIP | QLCC | DIP | QLCC | QLCC | QLCC | QLCC | QLCC | DIP | DIP |
包装说明 | DIP, | WQCCJ, | WDIP, | WQCCJ, | QCCJ, | WQCCJ, | QCCJ, | WQCCJ, | WDIP, | DIP, |
针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
其他特性 | 32 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS | 32 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS | 32 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS | 32 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS | 32 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS | 32 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS | 32 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS | 32 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS | 32 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS | 32 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS |
最大时钟频率 | 71.4 MHz | 71.4 MHz | 71.4 MHz | 50 MHz | 71.4 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
JESD-30 代码 | R-PDIP-T28 | S-CQCC-J28 | R-GDIP-T28 | S-CQCC-J28 | S-PQCC-J28 | S-CQCC-J28 | S-PQCC-J28 | S-CQCC-J28 | R-GDIP-T28 | R-PDIP-T28 |
长度 | 34.29 mm | 11.43 mm | 36.83 mm | 11.43 mm | 11.5062 mm | 11.43 mm | 11.5062 mm | 11.43 mm | 36.83 mm | 34.29 mm |
专用输入次数 | 7 | 7 | 7 | 7 | 7 | 7 | 7 | 7 | 7 | 7 |
I/O 线路数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 85 °C | 125 °C | 125 °C |
组织 | 7 DEDICATED INPUTS, 16 I/O | 7 DEDICATED INPUTS, 16 I/O | 7 DEDICATED INPUTS, 16 I/O | 7 DEDICATED INPUTS, 16 I/O | 7 DEDICATED INPUTS, 16 I/O | 7 DEDICATED INPUTS, 16 I/O | 7 DEDICATED INPUTS, 16 I/O | 7 DEDICATED INPUTS, 16 I/O | 7 DEDICATED INPUTS, 16 I/O | 7 DEDICATED INPUTS, 16 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | DIP | WQCCJ | WDIP | WQCCJ | QCCJ | WQCCJ | QCCJ | WQCCJ | WDIP | DIP |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | CHIP CARRIER, WINDOW | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER | CHIP CARRIER, WINDOW | CHIP CARRIER | CHIP CARRIER, WINDOW | IN-LINE, WINDOW | IN-LINE |
可编程逻辑类型 | OT PLD | UV PLD | UV PLD | UV PLD | OT PLD | UV PLD | OT PLD | UV PLD | UV PLD | OT PLD |
传播延迟 | 17 ns | 17 ns | 17 ns | 25 ns | 17 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.318 mm | 4.57 mm | 5.08 mm | 4.57 mm | 4.572 mm | 4.57 mm | 4.572 mm | 4.57 mm | 5.08 mm | 4.318 mm |
最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | YES | YES | YES | YES | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | INDUSTRIAL | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | J BEND | J BEND | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | QUAD | DUAL | QUAD | QUAD | QUAD | QUAD | QUAD | DUAL | DUAL |
宽度 | 7.62 mm | 11.43 mm | 7.62 mm | 11.43 mm | 11.5062 mm | 11.43 mm | 11.5062 mm | 11.43 mm | 7.62 mm | 7.62 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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