电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1210Q240J2GAL

产品描述Ceramic Capacitor, Multilayer, Ceramic, 200V, 5% +Tol, 5% -Tol, BP, -/+30ppm/Cel TC, 0.000024uF, 1210,
产品类别无源元件    电容器   
文件大小160KB,共8页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 详细参数 全文预览

C1210Q240J2GAL概述

Ceramic Capacitor, Multilayer, Ceramic, 200V, 5% +Tol, 5% -Tol, BP, -/+30ppm/Cel TC, 0.000024uF, 1210,

C1210Q240J2GAL规格参数

参数名称属性值
是否Rohs认证不符合
Objectid926602105
包装说明, 1210
Reach Compliance Codenot_compliant
ECCN代码EAR99
YTEOL7.8
电容0.000024 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度1.6 mm
JESD-609代码e0
长度3.07 mm
多层Yes
负容差5%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形式SMT
包装方法Bulk
正容差5%
额定(直流)电压(URdc)200 V
尺寸代码1210
温度特性代码BP
温度系数30ppm/Cel ppm/°C
端子面层Tin/Lead (Sn70Pb30) - with Nickel (Ni) barrier
宽度2.56 mm

文档预览

下载PDF文档
CERAMIC HIGH RELIABILITY
GENERAL INFORMATION GR900 SERIES
HIGH RELIABILITY — GR900
GR900 capacitors are intended for use in any application where
the chance of failure must be reduced to the lowest possible
level. While any well-made multilayer ceramic capacitor is an
inherently reliable device, GR900 capacitors receive special
attention in all phases of manufacture including:
— Raw Materials Selection
— Special Designs
— Clean Room Production
— Individual Batch Testing
— C-SAM (when applicable)
— Singular Batch Identity is Maintained
— Destructive Physical Analysis
These parts are well worth the added investment in comparison
to the cost of a device or system failure.
Typical applications include:
Medical, Aerospace, Communication Satellites, Radar, Guidance
Systems.
SCREENING AND SAMPLE TESTS
Each batch receives the following testing/inspections:
Preliminary:
1. Destructive Physical Analysis: (DPA) - A sample is pulled from
each lot and examined per EIA-469 and KEMET’s strict internal
void and delamination criteria. Sampling plan is per MIL-PRF-123.
2. C-SAM - May be performed on batches failing to meet the
DPA criteria for removal of marginal product. Not required on
each lot.
Group A
1. Thermal Shock
— Materials used in the construction of mul-
tilayer ceramic capacitors possess various thermal coefficients of
expansion. To assure maximum uniformity, each part is temper-
ature cycled in accordance to MIL-STD-202, Method 107,
Condition A with Step 3 being 125°C. Number of cycles shall be
20 (100% of lot).
2. Voltage Conditioning
— One of the most strenuous environ-
ments for any capacitor is the high temperature/high voltage test.
All units are subject to twice-rated voltage to the units at the max-
imum rated temperature of 125°C for a minimum of 168 hours
and a maximum of 264 hours. The voltage conditioning may be
terminated at any time during 168 hours to 264 hours time inter-
val that confirmed failures meet the requirements of the PDA dur-
ing the last 48 hours of 1 unit or .4% (100% of lot).
Optional Voltage Conditioning (Accelerated Voltage
Conditioning)
— All conditions of the standard voltage condi-
tioning apply with the exception of increased voltage and
decreased test time. Refer to MIL-PRF-123 for the proper formula.
*Step 5 is performed on chips at this point (100% of lot).
3. Dielectric Withstanding Voltage
— 250% of the dc rated volt-
age at 25°C (100% of lot).
4. Insulation Resistance
— The 25°C measurement with rated
voltage applied shall be the lesser of 100 GΩ or 1000 megohm-
microfarads (100% of lot).
*5. Insulation Resistance
— The 125°C measurement with
rated voltage applied shall be the lesser of 10 GΩ or 100
megohm-microfarads (100% of lot). For chips, 125°C IR is per-
formed prior to Step 3 above.
6. Storage
at 150°C for 2 hours minimum without voltage applied
followed by a 12-hour minimum stabilization period (temperature
characteristic BX only).
7. Capacitance
— Shall be within specified tolerance at 25°C
(100% of lot). (Aging phenomenon is taken into account for BX
dielectric to obtain capacitance.)
8. Dissipation Factor
— Shall not exceed 2.5% for X7R (BX)
dielectric, 0.15% for C0G (BP) dielectric at 25°C. (100% of lot.)
9. Percent Defective Allowable (PDA)
— The overall PDA is 8%
for parts outside the MIL-PRF-123 values. The PDA is per MIL-
PRF-123 for all parts that are valid MIL-PRF-123 values. The PD
includes steps 1 through 8 above with the following exceptions.
Capacitance exclusion - capacitance values no more than 5% or
.5pF, whichever is greater for BX characteristic or 1% or .3pF,
whichever is greater for BP characteristic beyond specified toler-
ance limit, shall be removed from the lot but shall not be consid-
ered defective for determination of the PD.
Insulation Resistance at 25°C — Product which is not acceptable
for twice the military limit but is acceptable per the military limit,
is removed from the lot but shall not be considered defective for
determination of the PD.
10. Visual and Mechanical Examination
— Performed per MIL-
PRF-123 criteria.
11. Radiographic Examination (Leaded Devices Only)
Radial devices receive a one-plane X-ray.
12. Destructive Physical Analysis (DPA)
— A sample is exam-
ined on each lot per EIA-469. Sampling Plan is per MIL-PRF-123.
STANDARD PACKAGING
All products are packaged in trays except C512 capacitors which
are packaged 1 piece per bag.
DATA PACKAGE
A data package is sent with each shipment which contains:
1.
Final Destructive Physical Analysis (DPA) report.
2.
Certificate of Compliance stating that the parts meet all applic-
able requirements of the appropriate military specification to the
best failure level to which KEMET is approved.
3.
Summary of Group A Testing.
12
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
4x4矩阵键盘有错误
#include typedef unsigned char uchar; typedef unsigned int uint; void delay(); void Key_Event(void); /***************全局变量***************/ uchar key_Pressed; //按键是否被 ......
宛然若惜 微控制器 MCU
单片机没法下载
求:ISP下载接口电路...
8444574 嵌入式系统
老司机与你聊手机:手机快充到底好不好
作者:刘洋 近年来,手机快充技术越来越多的被手机厂商们使用和青睐,甚至在魅族之前发布的魅蓝E上面都应用上了mcharge快充技术。 在没有办法解决电池续航问题的时候,为用户提供更快的充电 ......
木犯001号 电源技术
求推荐一款射频功率分配芯片(power spliter)
将天线下来的射频信号等分成多路。射频范围为800M-1GHz之间哪些公司有这样的芯片?市场上又比较容易买到的。...
dsp_comm 无线连接
PADS无故多出元件
191048 不知道为什么就多出一个J6,怎么也找不到,也没有办法删除, 有人遇到过这种情况么 ...
OSerHuang PCB设计
FPGA问题集锦
本帖最后由 paulhyde 于 2014-9-15 09:28 编辑 为学习FPGA的提供帮助 ...
凳子 电子竞赛

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 597  883  2725  1434  1994  13  18  55  29  41 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved