Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System

(FF-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial & Automotive Grade)

Overview

KEMET’s Floating Electrode with Flexible Termination capacitor

(FF-CAP) combines two existing KEMET technologies–

Floating Electrode and Flexible Termination. The floating

electrode component utilizes a cascading internal electrode

design configured to form multiple capacitors in series within

a single monolithic structure. This unique configuration results

in enhanced voltage and ESD performance over standard

capacitor designs while allowing for a fail-open condition if

mechanically damaged (cracked). The flexible termination

component utilizes a conductive silver epoxy between the base

metal and nickel barrier layers of KEMET’s standard termination

system in order to establish pliability while maintaining terminal

strength, solderability and electrical performance. Both

technologies address the primary failure mode of MLCCs– flex

cracks, which are typically the result of excessive tensile and

shear stresses produced during board flexure and thermal

cycling.

Although neither technology can eliminate the potential for

mechanical damage that may propagate during extreme

environmental and/or handling conditions, the combination of

these two technologies provide the ultimate level of protection

against a low IR or short circuit condition. The FF-CAP

complements KEMET’s Open Mode, Floating Electrode (FE-CAP),

Flexible Termination (FT-CAP) and KEMET Power Solutions (KPS)

product lines by providing an ultimate fail-safe design optimized

for low to mid range capacitance values. These devices exhibit a

predictable change in capacitance with respect to time and voltage

and boast a minimal change in capacitance with reference to

ambient temperature. Capacitance change is limited to ±15% from

-55°C to +125°C.

In addition to Commercial Grade, Automotive Grade devices

are available which meet the demanding Automotive Electronics

Council's AEC–Q200 qualification requirements.

Ordering Information

C

Ceramic

0805

Y

104

Capacitance

Code (pF)

2 Significant

Digits + Number

of Zeros

K

Capacitance

Tolerance

J = ±5%

K = ±10%

M = ±20%

5

Voltage

9 = 6.3 V

8 = 10 V

4 = 16 V

3 = 25 V

5 = 50 V

1 = 100 V

2 = 200 V

A = 250 V

R

Dielectric

R = X7R

A

C

TU

Packaging/Grade

(C-Spec)

2

Blank = Bulk

TU = 7" Reel

Unmarked

TM = 7" Reel Marked

Case Size

Specification/

(L" x W")

Series

0603

0805

1206

1210

1812

Y = Floating

Electrode

with Flexible

Termination

Failure Rate/

Termination Finish

1

Design

A = N/A

C = 100% Matte Sn

L = SnPb (5%

minimum)

Additional termination finish options may be available. Contact KEMET for details.

SnPb termination finish option is not available on automotive grade product.

2

Additional reeling or packaging options may be available. Contact KEMET for details.

1

1,2

One world. One KEMET

C1015_X7R_FF-CAP_SMD • 4/17/2014

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches)

W

T

S

L

B

EIA

Size

Code

0603

0805

1206

1210

1812

Metric

Size

Code

1608

2012

3216

3225

4532

L

Length

1.60 (.064) ± 0.17 (.007)

2.00 (.079) ± 0.20 (.008)

3.30 (.130) ± 0.40 (.016)

4.50 (.178) ± 0.40 (.016)

W

Width

0.80 (.032) ± 0.15 (.006)

1.25 (.049) ± 0.20 (.008)

1.60 (.063) ± 0.20 (.008)

2.50 (.098) ± 0.20 (.008)

3.20 (.126) ± 0.30 (.012)

T

Thickness

B

Bandwidth

0.45 (.018) ± 0.15 (.006)

0.50 (0.02) ± 0.25 (.010)

S

Separation

Minimum

0.58 (.023)

0.75 (.030)

Mounting

Technique

Solder Wave or

Solder Reflow

Only

See Table 2 for

0.60 (.024) ± 0.25 (.010)

Thickness

0.60 (.024) ± 0.25 (.010)

N/A

Benefits

•

-55°C to +125°C operating temperature range

Superior flex performance (up to 5 mm)

Floating Electrode/fail open design

Low to mid capacitance flex mitigation

Lead (Pb)-Free, RoHS and REACH compliant

EIA 0603, 0805, 1206, 1210, and 1812 case sizes

DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,

200 V, and 250 V

•

Capacitance offerings ranging from 180 pF to 0.22 μF

Available capacitance tolerances of ±5%, ±10%, and ±20%

Commercial & Automotive (AEC–Q200) grades available

Non-polar device, minimizing installation concerns

100% pure matte tin-plated termination finish allowing for

excellent solderability

• SnPb termination finish option available upon request (5%

minimum)

Applications

Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits without

(integrated) current limitation and any application that is subject to high levels of board flexure or temperature cycling. Examples

include raw power input side filtering (power plane/bus), high current applications (automobile battery line) and circuits that cannot be

fused to open. Markets include consumer, medical, industrial (power supply), automotive, aerospace and telecom.

Ceramic Surface Mount

0.70 (.028) ± 0.35 (.014)

C1015_X7R_FF-CAP_SMD • 4/17/2014

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Qualification/Certification

Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in

Table 4, Performance & Reliability.

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test

methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional

information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.

Environmental Compliance

Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).

Electrical Parameters/Characteristics

Item

Operating Temperature Range

Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)

Aging Rate (Maximum % Capacitance Loss/Decade Hour)

Dielectric Withstanding Voltage

Dissipation Factor (DF) Maximum Limit @ 25ºC

Insulation Resistance (IR) Limit @ 25°C

-55°C to +125°C

±15%

3.0%

250% of rated voltage

(5 ±1 seconds and charge/discharge not exceeding 50 mA)

5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V)

See Insulation Resistance Limit Table

(Rated voltage applied for 120 ±5 seconds @ 25°C)

Parameters/Characteristics

Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and dissipation factor (DF) measured under the following conditions:

1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF

120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

C1015_X7R_FF-CAP_SMD • 4/17/2014

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Dielectric

Rated DC

Voltage

> 25

X7R

16/25

< 16

All

Capacitance

Value

Dissipation Factor

(Maximum %)

3.0

5.0

7.5

±20%

10% of Initial Limit

Capacitance

Shift

Insulation

Resistance

Insulation Resistance Limit Table (X7R Dielectric)

EIA Case Size

0201

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

1,000 Megohm

Microfarads or 100 GΩ

N/A

< 0.012 µF

< 0.047 µF

< 0.15 µF

< 0.47 µF

< 0.39 µF

ALL

< 2.2 µF

ALL

< 10 µF

ALL

500 Megohm

Microfarads or 10 GΩ

ALL

≥ 0.012 µF

≥ 0.047 µF

≥ 0.15 µF

≥ 0.47 µF

≥ 0.39 µF

N/A

≥ 2.2 µF

N/A

≥ 10 µF

N/A

C1015_X7R_FF-CAP_SMD • 4/17/2014

4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 0805 Case Sizes)

Cap

Code

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

Case Size/

Series

Voltage Code

Rated Voltage

(VDC)

C0603Y

9

6.3

8

10

4

16

3

25

5

50

1

100

2

200

9

6.3

8

10

4

16

C0805Y

3

25

5

50

1

100

2

200

DC

200

2

A

250

DC

250

A

Capacitance

180 pF

220 pF

270 pF

330 pF

390 pF

470 pF

560 pF

680 pF

820 pF

1,000 pF

1,200 pF

1,500 pF

1,800 pF

2,200 pF

2,700 pF

3,300 pF

3,900 pF

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 µF

J

Capacitance

Tolerance

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

K

M

Rated Voltage

(VDC)

Voltage Code

CB

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

CB

CF

CB

CF

CB

CF

CB

CF

CB

CF

CB

DC

DD

DG

DC

DD

DG

DC

DD

DG

DC

DD

DG

DC

DD

DG

50

5

DC

DD

200

100

Capacitance

Cap Code

9

8

4

3

5

1

2

9

8

4

3

Case Size/Series

C0603Y

C0805Y

C1015_X7R_FF-CAP_SMD • 4/17/2014

100

1

6.3

50

25

10

16

10

16

5

参数名称	属性值
Objectid	8058326216
包装说明	, 1206
Reach Compliance Code	compliant
YTEOL	7.85
电容	0.0056 µF
电容器类型	CERAMIC CAPACITOR
介电材料	CERAMIC
高度	0.78 mm
JESD-609代码	e3
长度	3.3 mm
安装特点	SURFACE MOUNT
多层	Yes
负容差	20%
端子数量	2
最高工作温度	125 °C
最低工作温度	-55 °C
封装形式	SMT
包装方法	TR, PUNCHED PAPER, 13 INCH
正容差	20%
额定（直流）电压（URdc）	100 V
参考标准	AEC-Q200
尺寸代码	1206
表面贴装	YES
温度特性代码	X7R
温度系数	15% ppm/°C
端子面层	Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状	WRAPAROUND
宽度	1.6 mm

C1206Y562M1RACAUTO

C1206Y562M1RACAUTO概述

C1206Y562M1RACAUTO规格参数

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