line card lcas 1chiple 32qfn
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microsemi |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, |
| 针数 | 32 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | S-XQCC-N32 |
| JESD-609代码 | e3 |
| 长度 | 8 mm |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 电信集成电路类型 | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | NO LEAD |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| 宽度 | 8 mm |
| Base Number Matches | 1 |
| LE75183DFQCT | LE75183DFQC | LE75183DDSC | LE75183DFSC | LE75183DFSCT | LE75183DDSCT | |
|---|---|---|---|---|---|---|
| 描述 | line card lcas 1chiple 32qfn | line card lcas 1chiple 32qfn | line card lcas 1chiple 20soic | line card lcas 1chiple 28soic | line card lcas 1chiple 28soic | line card lcas 1chiple 20soic |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
| 零件包装代码 | QFN | QFN | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | HVQCCN, | HVQCCN, | SOP, | SOP, SOP28,.4 | SOP, SOP28,.4 | SOP, |
| 针数 | 32 | 32 | 20 | 28 | 28 | 20 |
| Reach Compliance Code | compliant | compliant | compli | compliant | compliant | compliant |
| JESD-30 代码 | S-XQCC-N32 | S-XQCC-N32 | R-PDSO-G20 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G20 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 8 mm | 8 mm | 12.8 mm | 17.9 mm | 17.9 mm | 12.8 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 20 | 28 | 28 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | SOP | SOP | SOP | SOP |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 电信集成电路类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
| 端子形式 | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 8 mm | 8 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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