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XC4VFX60-11FF1152I

产品描述Field Programmable Gate Array, 6320 CLBs, 1181MHz, 56880-Cell, CMOS, PBGA1152, FBGA-1152
产品类别可编程逻辑器件    可编程逻辑   
文件大小217KB,共9页
制造商XILINX(赛灵思)
官网地址https://www.xilinx.com/
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XC4VFX60-11FF1152I概述

Field Programmable Gate Array, 6320 CLBs, 1181MHz, 56880-Cell, CMOS, PBGA1152, FBGA-1152

XC4VFX60-11FF1152I规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
Objectid2032571965
零件包装代码BGA
包装说明FBGA-1152
针数1152
Reach Compliance Codenot_compliant
Country Of OriginTaiwan
ECCN代码3A991.D
Samacsys ManufacturerXILINX
Samacsys Modified On2022-05-21 21:31:52
YTEOL3.9
最大时钟频率1181 MHz
JESD-30 代码S-PBGA-B1152
JESD-609代码e0
长度35 mm
湿度敏感等级4
可配置逻辑块数量6320
输入次数576
逻辑单元数量56880
输出次数576
端子数量1152
组织6320 CLBS
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA1152,34X34,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)225
可编程逻辑类型FIELD PROGRAMMABLE GATE ARRAY
认证状态Not Qualified
座面最大高度3.4 mm
最大供电电压1.26 V
最小供电电压1.14 V
标称供电电压1.2 V
表面贴装YES
技术CMOS
端子面层TIN LEAD
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度35 mm

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0
R
Virtex-4 Family Overview
0
0
DS112 (v3.1) August 30, 2010
Product Specification
General Description
Combining Advanced Silicon Modular Block (ASMBL™) architecture with a wide variety of flexible features, the Virtex®-4
family from Xilinx greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC
technology. Virtex-4 FPGAs comprise three platform families—LX, FX, and SX—offering multiple feature choices and
combinations to address all complex applications. The wide array of Virtex-4 FPGA hard-IP core blocks includes the
PowerPC® processors (with a new APU interface), tri-mode Ethernet MACs, 622 Mb/s to 6.5 Gb/s serial transceivers,
dedicated DSP slices, high-speed clock management circuitry, and source-synchronous interface blocks. The basic Virtex-4
FPGA building blocks are enhancements of those found in the popular Virtex, Virtex-E, Virtex-II, Virtex-II Pro, and
Virtex-II Pro X product families, so previous-generation designs are upward compatible. Virtex-4 devices are produced on a
state-of-the-art 90 nm copper process using 300 mm (12-inch) wafer technology.
Summary of Virtex-4 Family Features
Three Families — LX/SX/FX
-
-
-
Virtex-4 LX: High-performance logic applications solution
Virtex-4 SX: High-performance solution for digital signal
processing (DSP) applications
Virtex-4 FX: High-performance, full-featured solution for
embedded platform applications
Digital clock manager (DCM) blocks
Additional phase-matched clock dividers (PMCD)
Differential global clocks
18 x 18, two’s complement, signed Multiplier
Optional pipeline stages
Built-in Accumulator (48-bit) and Adder/Subtracter
Distributed RAM
Dual-port 18-Kbit RAM blocks
·
Optional pipeline stages
·
Optional programmable FIFO logic automatically
remaps RAM signals as FIFO signals
High-speed memory interface supports DDR and DDR-2
SDRAM, QDR-II, and RLDRAM-II.
SelectIO™ Technology
-
-
-
-
1.5V to 3.3V I/O operation
Built-in ChipSync™ source-synchronous technology
Digitally controlled impedance (DCI) active termination
Fine grained I/O banking (configuration in one bank)
Xesium™ Clock Technology
-
-
-
XtremeDSP™ Slice
-
-
-
Smart RAM Memory Hierarchy
-
-
Flexible Logic Resources
Secure Chip AES Bitstream Encryption
90 nm Copper CMOS Process
1.2V Core Voltage
Flip-Chip Packaging including Pb-Free Package
Choices
RocketIO™ 622 Mb/s to 6.5 Gb/s Multi-Gigabit
Transceiver (MGT) [FX
only]
IBM PowerPC RISC Processor Core [FX
only]
-
-
PowerPC 405 (PPC405) Core
Auxiliary Processor Unit Interface (User Coprocessor)
Multiple Tri-Mode Ethernet MACs [FX
only]
-
Table 1:
Virtex-4 FPGA Family Members
Configurable Logic Blocks (CLBs)
(1)
Array
(3)
Row x Col
Logic
Cells
Block RAM
Ethernet
MACs
RocketIO
Transceiver
Blocks
Total Max
I/O
User
Banks I/O
Device
XC4VLX15
XC4VLX25
XC4VLX40
XC4VLX60
XC4VLX80
XC4VLX100
XC4VLX160
Slices
PowerPC
Max
Max
Processor
Distributed
XtremeDSP
18 Kb
Block
Slices
(2)
Blocks RAM (Kb)
DCMs PMCDs
Blocks
RAM (Kb)
64 x 24
96 x 28
128 x 36
128 x 52
160 x 56
192 x 64
192 x 88
13,824
24,192
41,472
59,904
80,640
6,144
10,752
18,432
26,624
35,840
96
168
288
416
560
768
1056
1392
32
48
64
64
80
96
96
96
48
72
96
160
200
240
288
336
864
1,296
1,728
2,880
3,600
4,320
5,184
6,048
4
8
8
8
12
12
12
12
0
4
4
4
8
8
8
8
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
9
11
13
13
15
17
17
17
320
448
640
640
768
960
960
960
110,592 49,152
152,064 67,584
XC4VLX200 192 x 116 200,448 89,088
© Copyright 2004–2010 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. The PowerPC name and logo are registered trademarks of IBM Corp. and used under license. All other trademarks are the property of their respective owners.
DS112 (v3.1) August 30, 2010
Product Specification
www.xilinx.com
1
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用GPIO模拟I2C来操作EEPROM(24C512)只能读不能写,EEPROM硬件未进行写保护,写的时候,每次的ACK都是正常的(低电平)。但是主程序中先写EEPROM,而后想要读出写进去的数值,但是每次读出来的 ......
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一、目的 麦克风阵列排成阵列聚焦拾取空间的声音信号,使拾取的声音增强,达到远距离拾音的效果。麦克风阵列与单只麦克风相比提高了灵明度、指向性,与信号处理系统组合,通过适当的算法可实 ......
bqgup 创意市集
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申请前了解的到CH5xx系列内核是51。开发板中CH554总共预留两张封装(TSSOP20和440E),实际开发板焊接的是CH554T(TSSOP20)。看到封装我首先想到的是同规格的2051。下面比较一下CH554和比较有 ......
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Recommended Power Solutions for the TMS320x28xx DSPs...
安_然 微控制器 MCU
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