General Purpose Chip Resistors
( Lead-Free for RMG 04/06/10/12 series Standard )
Document No.
TRMG-XXRMG001A
Issued Date
page number
2008/12/23
1/11
1. Scope :
This specification applies for the RMG series chip resistors made by TA-I.
2. Construction:
Over Coat
Conductor
Sn Plating
Resistive Element
Ceramic Substrate
Ni Plating
3.
Type Designation:
RMG
Product Code
RMG : Chip Resistor
10
Size
Power Rating
J
Tolerance
T
Packaging
103
Nominal
Resistance
04-0402(1005) - 1/16W
06-0603(1608) - 1/10 W
10-0805(2012) - 1/8 W
12-1206(3216) - 1/4 W
J-±5%
G-±2%
F-±1%
G-±0.5%
T-Paper Tape
3 digits, e.g.,:
(E-24) 103 = 10KΩ
4 digits, e.g., :
(E-96) 1540 = 154Ω
TA-I TECHNOLOGY CO., LTD
General Purpose Chip Resistors
( Lead-Free for RMG 04/06/10/12 series Standard )
Document No.
TRMG-XXRMG001A
Issued Date
page number
2008/12/23
3/11
5. Ratings & Characteristics :
Type
Resistance Range(Ω)
Power
Max.
Max.
T.C.R
Rating
Rating
Working Over- Load
(PPM/℃)
Voltage
at 70℃
Voltage
Voltage
D(±0.5%),F(±1%)
G(±2%)
E-96&E-24
E-24
1/16W
Refer
5.2
Refer
5.2
Refer
5.2
Refer
5.2
50V
100V
±100
1
Ω-100KΩ
J(±5%)
E-24
RMG04
RMG06
1/10W
50V
100V
±100
1
Ω-390KΩ
RMG10
1/8W
150V
300V
±100
1
Ω-800KΩ
RMG12
1/4W
200V
400V
±100
1
Ω-1MΩ
5.1 Derating Curve :
For resistors operated at ambient temperature over 70℃ , power rating shall be derated in
accordance with figure 1.
P max.
100
Power ratio ( % )
50
0
-55
50
70
100
125
155
℃
Ambient
Temp. (
°C
)
Figure 1
TA-I TECHNOLOGY CO., LTD
General Purpose Chip Resistors
( Lead-Free for RMG 04/06/10/12 series Standard )
Document No.
TRMG-XXRMG001A
Issued Date
page number
2008/12/23
4/11
5.2 Rated Voltage:
The rated voltage is calculated by the following formula:
E=
P*R
E=
Rated Voltage(V)
P=
Rated Power(W)
R=
Resistance Value
(Ω)
E.G. : What is RMG06JT102 the rated voltage ?
RMG06JT102
E=
P:1/10W
;
R:102 = 1KΩ = 1000Ω
0.10(W) * 1000(Ω)
= 10.0 (V)
TA-I TECHNOLOGY CO., LTD
General Purpose Chip Resistors
( Lead-Free for RMG 04/06/10/12 series Standard )
Document No.
TRMG-XXRMG001A
Issued Date
page number
2008/12/23
5/11
6. Reliability Tests:
Test Items
Temperature Coefficient
of Resistance
Reference
standard
Condition of Test
Test Limits(△R / R)
±100
PPM/℃
D/F/G/J :
±
(1% + 0.1Ω )
Remark :
0402 Size :
D/F/G/J : (±2% + 0.1Ω )
Unpowered.
D/F /G/J:
±(2%
+ 0.1Ω )
MIL-STD-202F
Method 304 ;
+25〜 +125
℃
JIS-C5202-5.2
Short Time Overload
MIL-R-55342D
-Para. 4.7.5;
2.5 X rated voltage for 5 sec
JIS-C5202-5.5
1000
hrs.
@
T=125°C.
Measurement at 24±2 hours after
test conclusion.
High Temperature Exposure
MIL-STD-202
(Storage)
Method 108
Temperature Cycling
JESD22
1000 Cycles (-55°C to +125°C) Measurement
Method JA-104
at 24±2 hours after test conclusion.
D/F/G/J :
±(2%
+ 0.1Ω )
Moisture Resistance
MIL-STD-202
Method 106
1000 hrs , T=24 hours / Cycle
. Notes : Steps
D/F/G/J:
±(2%
+ 0.1Ω )
7a& 7b not required. Unpowered .
Biased Humidity
MIL-STD-202
Method 103
1000 hours 85°C/85%RH. Note: Specified
conditions:
10%
of
operating
power. D/F/G/J :
±(3%
+ 0.1Ω )
Measurement at 24±2 hours after test
conclusion.
1000 hours TA=125°C at rated power.
Measurement at 24±2 hours after test
conclusion.
D/F :
±(2%
+ 0.1Ω )
Remark :
G / J :
±(3%
+ 0.1Ω )
Specification of test PCB :By TA-I
Mounted Q’ty : Mounted 2 pcs on 1 PCB .
Condition B :
Immerse the specimens in and eutectic solder
at 260±5℃ for 10±1S .
Operational Life
MIL-STD-202
Method 108
Resistance to Soldering Heat
MIL-STD-202
Method 210
D/F :
±(0.5%
+ 0.05Ω )
G / J :
±(1%
+ 0.1Ω )
Solderability
J-STD-002
245±5℃ solder, 2±0.5 sec dwell.
Solder : Sn96.5 / Ag3.0 / Cu0.5
> 95% area covered with tin
Board Flex
( Bending )
AEC-Q200-005
3mm deflection
D/F :
±(0.5%
+ 0.05Ω )
G / J :
±(1%
+ 0.1Ω )
Terminal Strength (SMD)
AEC-Q200-006
Pressure X kgf a R0.5 pressure rod for 60 sec
Force :
D/F :
±(0.5%
+ 0.05Ω )
G / J :
±(1%
+ 0.1Ω )
0402 : 0.5Kg
0805 : 1.0Kg
0603 : 0.5Kg
1206 : 1.8Kg
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