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XC6SLX150T-3CSG484I

产品描述IC fpga 296 I/O 484cspbga
产品类别可编程逻辑器件    可编程逻辑   
文件大小359KB,共11页
制造商XILINX(赛灵思)
官网地址https://www.xilinx.com/
标准
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XC6SLX150T-3CSG484I概述

IC fpga 296 I/O 484cspbga

XC6SLX150T-3CSG484I规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码BGA
包装说明FBGA, BGA484,22X22,32
针数484
Reach Compliance Codecompli
ECCN代码3A991.D
Factory Lead Time12 weeks
最大时钟频率862 MHz
CLB-Max的组合延迟0.21 ns
JESD-30 代码S-PBGA-B484
JESD-609代码e1
长度19 mm
湿度敏感等级3
可配置逻辑块数量11519
输入次数296
逻辑单元数量147443
输出次数296
端子数量484
最高工作温度100 °C
最低工作温度-40 °C
组织11519 CLBS
封装主体材料PLASTIC/EPOXY
封装代码FBGA
封装等效代码BGA484,22X22,32
封装形状SQUARE
封装形式GRID ARRAY, FINE PITCH
峰值回流温度(摄氏度)260
电源1.2,2.5/3.3 V
可编程逻辑类型FIELD PROGRAMMABLE GATE ARRAY
认证状态Not Qualified
座面最大高度1.8 mm
最大供电电压1.26 V
最小供电电压1.14 V
标称供电电压1.2 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度19 mm
Base Number Matches1

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11
Spartan-6 Family Overview
DS160 (v2.0) October 25, 2011
Product Specification
General Description
The Spartan®-6 family provides leading system integration capabilities with the lowest total cost for high-volume applications. The
thirteen-member family delivers expanded densities ranging from 3,840 to 147,443 logic cells, with half the power consumption of previous
Spartan families, and faster, more comprehensive connectivity. Built on a mature 45 nm low-power copper process technology that
delivers the optimal balance of cost, power, and performance, the Spartan-6 family offers a new, more efficient, dual-register 6-input look-
up table (LUT) logic and a rich selection of built-in system-level blocks. These include 18 Kb (2 x 9 Kb) block RAMs, second generation
DSP48A1 slices, SDRAM memory controllers, enhanced mixed-mode clock management blocks, SelectIO™ technology, power-
optimized high-speed serial transceiver blocks, PCI Express® compatible Endpoint blocks, advanced system-level power management
modes, auto-detect configuration options, and enhanced IP security with AES and Device DNA protection. These features provide a low-
cost programmable alternative to custom ASIC products with unprecedented ease of use. Spartan-6 FPGAs offer the best solution for
high-volume logic designs, consumer-oriented DSP designs, and cost-sensitive embedded applications. Spartan-6 FPGAs are the
programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components that enable
designers to focus on innovation as soon as their development cycle begins.
Summary of Spartan-6 FPGA Features
Spartan-6 Family:
Spartan-6 LX FPGA: Logic optimized
Spartan-6 LXT FPGA: High-speed serial connectivity
Designed for low cost
Multiple efficient integrated blocks
Optimized selection of I/O standards
Staggered pads
High-volume plastic wire-bonded packages
Low static and dynamic power
45 nm process optimized for cost and low power
Hibernate power-down mode for zero power
Suspend mode maintains state and configuration with
multi-pin wake-up, control enhancement
Lower-power 1.0V core voltage (LX FPGAs, -1L only)
High performance 1.2V core voltage (LX and LXT
FPGAs, -2, -3, and -3N speed grades)
Multi-voltage, multi-standard SelectIO™ interface banks
Up to 1,080 Mb/s data transfer rate per differential I/O
Selectable output drive, up to 24 mA per pin
3.3V to 1.2V I/O standards and protocols
Low-cost HSTL and SSTL memory interfaces
Hot swap compliance
Adjustable I/O slew rates to improve signal integrity
High-speed GTP serial transceivers in the LXT FPGAs
Up to 3.2 Gb/s
High-speed interfaces including: Serial ATA, Aurora,
1G Ethernet, PCI Express, OBSAI, CPRI, EPON,
GPON, DisplayPort, and XAUI
Integrated Endpoint block for PCI Express designs (LXT)
Low-cost PCI® technology support compatible with the
33 MHz, 32- and 64-bit specification.
Efficient DSP48A1 slices
High-performance arithmetic and signal processing
Fast 18 x 18 multiplier and 48-bit accumulator
Pipelining and cascading capability
Pre-adder to assist filter applications
Integrated Memory Controller blocks
DDR, DDR2, DDR3, and LPDDR support
Data rates up to
800 Mb/s (12.8
Gb/s peak bandwidth)
Multi-port bus structure with independent FIFO to reduce
design timing issues
Abundant logic resources with increased logic capacity
Optional shift register or distributed RAM support
Efficient 6-input LUTs improve performance and
minimize power
LUT with dual flip-flops for pipeline centric applications
Block RAM with a wide range of granularity
Fast block RAM with byte write enable
18 Kb blocks that can be optionally programmed as two
independent 9 Kb block RAMs
Clock Management Tile (CMT) for enhanced performance
Low noise, flexible clocking
Digital Clock Managers (DCMs) eliminate clock skew
and duty cycle distortion
Phase-Locked Loops (PLLs) for low-jitter clocking
Frequency synthesis with simultaneous multiplication,
division, and phase shifting
Sixteen low-skew global clock networks
Simplified configuration, supports low-cost standards
2-pin auto-detect configuration
Broad third-party SPI (up to x4) and NOR flash support
Feature rich Xilinx Platform Flash with JTAG
MultiBoot support for remote upgrade with multiple
bitstreams, using watchdog protection
Enhanced security for design protection
Unique Device DNA identifier for design authentication
AES bitstream encryption in the larger devices
Faster embedded processing with enhanced, low cost,
MicroBlaze™ soft processor
Industry-leading IP and reference designs
© 2009–2011 Xilinx, Inc. Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States
and other countries. PCI, PCIe and PCI Express are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
DS160 (v2.0) October 25, 2011
Product Specification
www.xilinx.com
1

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