D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24
| 参数名称 | 属性值 |
| 厂商名称 | Data Device Corporation |
| 零件包装代码 | DIP |
| 包装说明 | CERAMIC, DIP-24 |
| 针数 | 24 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.2.C |
| 最大模拟输出电压 | 5 V |
| 最小模拟输出电压 | |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
| 输入格式 | PARALLEL, WORD |
| JESD-30 代码 | R-CDIP-P24 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.0125% |
| 标称负供电电压 | -15 V |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | -1.3,+-15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38534 |
| 座面最大高度 | 5.08 mm |
| 最大稳定时间 | 0.05 µs |
| 最大压摆率 | 97 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | NO |
| 技术 | HYBRID |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| Base Number Matches | 1 |
| 5962-9063401HXA | 5962-9063401HXC | 5962-9063401HXX | ADH-030II-10-1-3B | ADH-030II-12-3-B | ADH-030II-10-3-B | |
|---|---|---|---|---|---|---|
| 描述 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 |
| 厂商名称 | Data Device Corporation | Data Device Corporation | Data Device Corporation | Data Device Corporation | Data Device Corporation | Data Device Corporation |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | CERAMIC, DIP-24 | CERAMIC, DIP-24 | CERAMIC, DIP-24 | 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 | 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 | 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 |
| 针数 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | compliant | compliant | unknown | compliant | compliant |
| 最大模拟输出电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
| 输入格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 代码 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 |
| 最大线性误差 (EL) | 0.0125% | 0.0125% | 0.0125% | 0.05% | 0.0125% | 0.05% |
| 标称负供电电压 | -15 V | -15 V | -15 V | -10 V | -10 V | -10 V |
| 位数 | 12 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | - |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 标称供电电压 | 15 V | 15 V | 15 V | 10 V | 10 V | 10 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - | - |
| JESD-609代码 | e0 | e4 | - | - | e0 | e0 |
| 封装等效代码 | DIP24,.6 | DIP24,.6 | - | - | DIP24,.6 | DIP24,.6 |
| 电源 | -1.3,+-15 V | -1.3,+-15 V | - | - | -1.3,+-15 V | -1.3,+-15 V |
| 筛选级别 | MIL-PRF-38534 | MIL-PRF-38534 | - | - | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) |
| 最大压摆率 | 97 mA | 97 mA | - | 60 mA | 60 mA | 60 mA |
| 技术 | HYBRID | HYBRID | HYBRID | - | HYBRID | HYBRID |
| 端子面层 | TIN LEAD | GOLD | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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