AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDIP14
参数名称 | 属性值 |
厂商名称 | Harris |
包装说明 | , |
Reach Compliance Code | unknown |
系列 | HC/UH |
JESD-30 代码 | R-CDIP-T14 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | AND GATE |
功能数量 | 2 |
输入次数 | 4 |
端子数量 | 14 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
传播延迟(tpd) | 20 ns |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
Base Number Matches | 1 |
HCS21D/SAMPLE | HCS21DMSR | 5962R9577901V9A | 5962R9577901VXC | 5962R9577901VCC | HCS21K/SAMPLE | HCS21KMSR | HCS21HMSR | |
---|---|---|---|---|---|---|---|---|
描述 | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDIP14 | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDIP14 | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDFP14 | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDIP14 | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDFP14 | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS, CDFP14 | AND Gate, HC/UH Series, 2-Func, 4-Input, CMOS |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 代码 | R-CDIP-T14 | R-CDIP-T14 | X-XUUC-N14 | R-CDFP-F14 | R-CDIP-T14 | R-CDFP-F14 | R-CDFP-F14 | X-XUUC-N14 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
输入次数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
封装形式 | IN-LINE | IN-LINE | UNCASED CHIP | FLATPACK | IN-LINE | FLATPACK | FLATPACK | UNCASED CHIP |
传播延迟(tpd) | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | FLAT | THROUGH-HOLE | FLAT | FLAT | NO LEAD |
端子位置 | DUAL | DUAL | UPPER | DUAL | DUAL | DUAL | DUAL | UPPER |
厂商名称 | Harris | Harris | - | - | Harris | Harris | Harris | Harris |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - |
JESD-609代码 | - | e0 | e0 | e4 | e4 | - | e0 | - |
最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C |
最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C |
温度等级 | - | MILITARY | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY |
端子面层 | - | Tin/Lead (Sn/Pb) | TIN LEAD | GOLD | GOLD | - | Tin/Lead (Sn/Pb) | - |
总剂量 | - | 200k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | - | 200k Rad(Si) V | - |
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