QPL ESCC 3009 and CECC Surface Mount MLCC,
Type I & II
AVAILABLE TYPES
MLC CHIPS vs ESA ESCC & vs CECC 32101-002, 003 (established reliability) from 25V up to 500V.
AVAILABLE RELIABILITY LEVELS
ESA QUALIFIED
CECC + 100% Burn in /168H + Thermal shock
+ 85/85 humidity test + on 40 samples per batch + DPA
CECC + 100% Burn in /168H + DPA
CECC + 100% Burn in /48H + DPA
CECC + DPA
T6
T5
T3
T2
with or without LVT 1,2a,2b,3
X
Level T5 & T6: Reliability Level = MIL S
X
Level T3: Reliability Level = MIL R
AVAILABLE RELIABILITY LEVELS SUMMARY/TYPES
Types
MLC Chips
MLC Chips
ESA Qualified/3009
Products
AN, AC & AD
12, 13, 14, 15, 20
(NP0, X7R)
A...C NP0
A...Z X7R
A...G 2C1
CECC
T6 to T2
X
Reliability Level
ESA
ESA ESCC
X
RELEVANT STANDARDS
Type of Component
MLC Chips
Reliability Level
T2 / T3 / T5 / T6
ESA Level
CECC 32101-002
32101-003
ESA ESCC 3009
32101-801
IEC
60384-21/22
14
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or
available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
041519
QPL ESCC 3009 and CECC Surface Mount MLCC,
Type I & II
DIELECTRIC TYPES USED
Type I
XNP0
XAVX
Code: C
Type II
X
X7R
X
2C1
XAVX
Code: Z
XAVX
Code: G
ELECTRICAL MEASUREMENT CONDITIONS FOR CECC CHIPS: T2 / T3 / T5 / T6
Type
AVX code
Classification
IEC/CECC
EIA
DIN
MIL
Ubias = 0
Ubias = UR
1
C
1B
C0G
NP0
CG
±30ppm/°C
0
22°C ±3°C
C ≤ 1000 pF
F = 1MHz
C > 1000 pF
F = 1 kHz
Um ≤ 5 Vrms
C ≤ 50 pF DF < 1.5 (150/C + 7).10
-4
C>50 pF DF
< 15.10
-4
For C ≤ 10nF: Ri > 100 GΩ or
For C > 10nF: Ri x Cr > 1000s
For UR ≤ 100V : 2.5 x UR
For UR > 100V : 1.5 UR + 100V
2
Z
2R1
X7R
Capacitance change
With temperature & :
Typical ageing (%/dec.)
Reference temperature
Capacitance
and D.F.
measurement
Dissipation
Factor (DF)
Insulation Resistance
under UR /1 mn
Proof voltage
Frequency
Voltage
± 15%
N.A.
1.5
22°C ±3°C
C ≤ 100 pF
F = 1MHz
C > 100 pF
F = 1 kHz
Um ≤ 0.3 Vrms ± 0.2
DF < 250 .10
-4
For C ≤ 10nF: Ri > 100 GΩ or
For C > 10nF: Ri x C > 1000s
For UR ≤ 100V: 2.5 x UR
For UR >100V: 1.5 x UR + 100V
Note: ESA Chips are strictly measured vs ESA spec. 3009 + detail spec.
ELECTRICAL MEASUREMENT CONDITIONS FOR ESA CHIPS
Type
AVX code
Classification
IEC/CECC
EIA
DIN
MIL
Ubias = 0
Ubias = UR
1
C
1B
C0G
NP0
CG
±30ppm/°C
0
22°C ±3°C
F = 1MHz
F = 1 kHz
Um ≤ 5 Vrms
Z
2R1
X7R
2
G
2C1
BX
Capacitance change
With temperature & :
Typical ageing (%/dec.)
Reference temperature
Capacitance
and D.F.
measurement
Dissipation
Factor (DF)
Insulation Resistance
under UR /1 mn
Proof voltage
Frequency
Voltage
C ≤ 1000 pF
C > 1000 pF
± 20%
*-60/+20%
1.5
22°C ±3°C
± 20%
-30/+20%
1.5
22°C ±3°C
C ≤ 100 pF
F = 1MHz
C > 100 pF
F = 1 kHz
Um ≤ 1 Vrms
DF < 250 .10
-4
For C ≤ 10nF: Ri > 100 GΩ or
For C > 10nF: Ri x C > 1000s
For UR < 500V: 2.5 x UR
For UR = 500V: 2 x UR
C ≤ 50 pF DF < 1.5 (150/C + 7).10
-4
C>50 pF
DF < 15.10
-4
Ri > 100 GΩ
For UR < 500V : 2.5 x UR
*Typical value for this dielectric class
Note: ESA Chips are strictly measured vs ESA spec. 3009 + detail spec.
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or
available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
081120
15
QPL ESCC 3009 and CECC Surface Mount MLCC,
Type I & II
RELIABILITY LEVELS DESCRIPTION
CECC
T2
T3
CECC DESIGN
DPA
Capacitance / DF
IR
Voltage proof
100% control
Visual inspection
AQL sampling
Burn-in
125°C 48h
100% control
Capacitance / DF
IR
Voltage proof
AQL sampling
Solderability
Sampling 10 pieces
Capacitance / DF
IR
Voltage proof
100% control
Solderability
Sampling 10 pieces
Burn-in
125°C 168h
100% control
Capacitance / DF
IR
Voltage proof
100% control
Solderability
Sampling 10 pieces
Thermal Shock
Damp Heat
Electrical
Measurement*
Sampling 40 pieces
*EDX material analysis
ESA - ESCC
T5
T6
ESA Level
HIGH RELIABILITY DESIGN versus ESA
IN PROCESS CONTROL
following
ESA ESCC 3009 Chips
CHART II
following
ESA ESCC 3009
CHART III
following
ESA ESCC 3009
Lot acceptance sheet
Certi cate of
conformity
T2
Lot acceptance sheet
Certi cate of
conformity
T3
Lot acceptance sheet
Certi cate of
conformity
T5
Lot acceptance sheet
Certi cate of
conformity
T6
DOCUMENTATION
following ESA ESCC
16
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or
available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
041519
QPL ESCC 3009 and CECC Surface Mount MLCC,
Type I & II
AVAILABLE TERMINATIONS
Summary
Type
Ag - Pd - Pt
Nickel Barrier + Tin Lead Finish
(1)
Nickel Barrier + Tin Finish
(2)
(1)
(2)
CECC Level T2/T3/T5/T6
AC
AN
AD
ESA Level
A3..
A6...
Remark
–
Preferred Version
“No Pure Tin” terminations.
Lead Free terminations.
TERMINATION CODES FOR ESA MLC PARTS
AVX Code
e.g. A.12
A312C…
A312G…
A312Z…
A612C…
A612G…
A612Z….
Code
03
10
06
07
ESA Version
Termination
Silver Palladium Platinium
X7R Dielectric + Silver Palladium Platinium
ESA Preferred Termination
Nickel Barrier + Tin Lead Finish
X7R Dielctric + ESA Preferred Termination
Nickel Barrier + Tin Lead Finish
PACKAGING
• Plastic Tape – Minimum Order Quantity: 1000p for CECC and ESA products*
*Note
for smaller quantities contact plant
•
Waffle Pack – Anti-static material only ESA Products – Minimum Order Quantity: 50p for ESA products
• Vacuum Pack only CECC Products – Minimum Order Quantity: 1Kp for CECC products
MARKING
Chips:
CECC
ESA Level
T6/T5/T3/T2
On packaging label only - versus AVX code
On packaging label only - versus ESA code
AVAILABLE CLIMATIC AND ELECTRIC TESTS
Test P/N
XX00--5028---
MX00--5056---
MX00--5059---
MX00--5060---
XX00--5080-00
XX00--5079-00
XX00--5090-00
XX00--5100-00
XX00--5082-00
XX00--5091-00
XX00--5092-00
XX00--5093-00
XX00--5094-00
Test Description
DPA versus EIA RS469
85/85 Humidity test / ESA 3009 / 5.2.2
85°C / 85% HR / 1.5Vdc / 240h
85/85 Humidity test / MIL STD 202 Method 103
40°C / 95 HR / 100Vdc / 240h
85ºC/85º HR / 240h Humidity test
100% burn in (same as “5079” but limited to 48H)
100% burn in versus ESA 3009 (168H / 2x Ur)
Halt test (accelerated burn-in 140°C / 3Ur)
Life test 1000 or 2000H versus ESA 3009/9.10
Solderability test (bath method vs. ESA or CECC)
Electric test (Cr; DF; IR) 100%
Rapid change of temperature (-55° to 125°C)
Climatic test sequence
Visual insp. Versus ESA or customer spec.
Qty. of Parts
25/X + 25/Y
50
50
12
100%
100%
100pc
100pc
20pc
100%
50pc
50pc
100%
Average Lead Time
1 to 2 weeks
3 weeks
3 weeks
3 weeks
1 week
3 weeks
4 weeks
7 or 14 weeks
2 weeks
Tbd
Tbd
Tbd
Tbd
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or
available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
081120
17
QPL ESCC 3009 and CECC Surface Mount MLCC,
Type I & II
ESA QUALIFIED CHIPS TYPE I - NP0
Case Sizes
Cap Tolerance
ESA QPL
AVX CODE
Value
Code
4.7pf
4R7
5.6pf
5R6
6.8pf
6R8
8.2pf
8R2
10pf
100
12pf
120
15pf
150
18pf
180
22pf
220
27pf
270
33pf
330
390
39pf
47pf
470
56pf
560
68pf
680
82pf
820
100pf
101
120pf
121
150pf
151
180pf
181
220pf
221
270pf
271
330pf
331
390pf
391
470pf
471
560pf
561
680pf
681
820pf
821
1.0 nf
102
1.2nf
122
1.5nf
152
1.8 nf
182
2.2nf
222
2.7nf
272
3.3nf
332
3.9nf
392
4.7nf
472
5.6nf
562
6.8nf
682
8.2nf
822
10nf
103
12nf
123
15nf
153
18nf
183
22nf
223
27 nf
273
33 nf
333
Available Terminations:
A3.. Silver Palladium Platinum (ESA variant 03) and
A6.. Nickel Barrier with Tin Lead Finish (ESA variant 06)
0805
3009003..
A_12C..
50v
100v
1210
1812
1,2,5,10 % , +/- 0.5pf for C < 10pf
3009022..
3009004..
3009005..
A_20C..
A_13C..
A_14C..
50v
100v
50v
100v
50v
100v
1206
2220
3009006..
A_15C..
50v
100v
18
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or
available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
013120
NXP MCU
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