heatsink TO-263 12.70x26.20mm
| 参数名称 | 属性值 |
| Datasheets | |
| V-1100-SMD/A(-L) Drawing | |
| Product Photos | |
| V-1100-SMD/A-L | |
| Product Training Modules | |
| WSW Components Line of Board-Level Transistor Heat Sink Overview | |
| Standard Package | 500 |
| Category | Fans, Thermal Manageme |
| Family | Thermal - Heat Sinks |
| 类型 Type | Top Mou |
| Package Cooled | TO-263 |
| Attachment Method | SMD Pad |
| Shape | Rectangul |
| 长度 Length | 0.500" (12.70mm) |
| 宽度 Width | 1.031" (26.20mm) |
| Height Off Base (Height of Fin) | 0.390" (9.91mm) |
| Thermal Resistance @ Natural | 23°C/W |
| Material | Coppe |
| Material Finish | Ti |
| Dynamic Catalog | Heat Sink |
| Other Names | A10760V1100SMDAL |

| V-1100-SMD/A-L | V-1100-SMD/A | |
|---|---|---|
| 描述 | heatsink TO-263 12.70x26.20mm | heatsink TO-263 12.70x26.20mm |
| Standard Package | 500 | 1 |
| Category | Fans, Thermal Manageme | Fans, Thermal Manageme |
| Family | Thermal - Heat Sinks | Thermal - Heat Sinks |
| 类型 Type |
Top Mou | Top Mou |
| Package Cooled | TO-263 | TO-263 |
| Attachment Method | SMD Pad | SMD Pad |
| Shape | Rectangul | Rectangul |
| 长度 Length |
0.500" (12.70mm) | 0.500" (12.70mm) |
| 宽度 Width |
1.031" (26.20mm) | 1.031" (26.20mm) |
| Height Off Base (Height of Fin) | 0.390" (9.91mm) | 0.390" (9.91mm) |
| Thermal Resistance @ Natural | 23°C/W | 23°C/W |
| Material | Coppe | Coppe |
| Material Finish | Ti | Ti |
| Dynamic Catalog | Heat Sink | Heat Sink |
| Other Names | A10760V1100SMDAL | A10752DKR |
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