Product Bulletin
Fail-Safe Floating Electrode MLCC with Flexible Termination
FF-CAP
/ X7R Dielectric
Floating (Cascading) Electrode Internal Design
Outline Drawing
Product Description
The FF-CAP incorporates two existing KEMET technologies; Floating Electrode (cascading electrode
design) and Flexible Termination. The floating electrode component of these capacitors yields improved
voltage and ESD performance over standard designs, and also mitigates the risk of low IR or short circuit
failures associated with mechanical flex cracks. The flexible termination component incorporates a meas-
ure of flexibility to the capacitor, shifting flex stress away from the ceramic body and into the termination
area.
The combination of these technologies ensures an increased measure of protection from board flex,
offering up to 5mm of flex-bend capability. This provides for an enhanced level of mechanical flex crack pro-
tection for low to mid capacitance part types.
Dimensions – Millimeters (Inches)
EIA Size Metric Size
Code
Code
0603
0805
1206
1210
1812
1608
2012
3216
3225
4532
L
Length
1.6 (.063) ± 0.20 (.008)
2.1 (.083) ± 0.30 (.012)
3.3 (.130) ± 0.30 (.012)
3.4 (.134) ± 0.40 (.016)
4.6 (.181) ± 0.40 (.016)
W
Width
0.8 (.031) ± 0.15 (.006)
1.6 (.063) ± 0.20 (.008)
2.5 (.098) ± 0.20 (.008)
3.2 (.126) ± 0.30 (.021)
B
Bandwidth
0.35 (.014) ± 0.15 (.006)
0.50 (.020) ± 0.25 (.010)
0.50 (.020) ± 0.25 (.010)
0.60 (.024) ± 0.35 (.014)
S
Separation
0.70 (.028)
0.75 (.030)
-
-
-
1.25 (.049) ± 0.20 (.008) 0.05 (.020) ± 0.25 (.010)
See “Capacitance Range” tables next page for capacitor chip thickness code specification. Capacitor chip thickness dimensions are detailed in the
“Thickness Code Reference Chart” on page 4.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F3282B 9/09
Qualification/Certification
Automotive Grade Available: AEC-Q200 Rev. C
RoHS-PRC (6/6) - 100% matte tin termination
Ordering Information
C
Style
C - Ceramic
Size Code
See dimension table
Specification
Y - Floating Electrode with Flexible Termination
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use “9” for 1.0 through 9.9 pF)
Capacitance Tolerance
K = ±10%; M = ±20%; J = ±5%
End Metallization
C = 100% Matte Tin Plated
Failure Rate Level
A = Not Applicable
Temperature Characteristic
Designated by Capacitance
Change over Temperature Range
R – X7R (±15%) (-55°C +125°C)
Voltage
9 = 6.3V, 8 = 10V, 4 = 16V, 3 = 25V,
5 = 50V, 1 = 100V, 2 = 200V
0805
Y
103
K
5
R
A
C
Electrical Parameters
As detailed in the KEMET Surface Mount Catalog F3102 for X7R, with following specific requirements based on room
temperature (25°C) parameters:
• Operating Range: -55°C to +125°C, with no-bias capacitance shift limited to ± 15% over that range.
• Insulation Resistance (IR) measured after 2 minutes at rated voltage @ 25°C: Limit is 1000
megohm microfarads or 100,000 MΩ, whichever of the two is smaller.
• Capacitance and Dissipation Factor (DF) measured under the following conditions:
1kHz and 1 Vrms if capacitance
≤
10μF
120Hz and 0.5 Vrms if capacitance > 10μF
•
DF Limits are:
50 - 200 Volts
16 - 25 Volts
6.3/10 Volts
2.5%
3.5%
5.0%
Soldering Process
All parts incorporate the standard KEMET barrier layer of pure nickel, with an overplate of pure tin to provide excellent sol-
derability as well as resistance to leaching. The recommended techniques are as follows:
•
1210 & 1812 case sizes - Solder Reflow Only
•
0603/0805/1206 case sizes – Solder Wave/Solder Reflow
Marking
These chips will be supplied unmarked. If required, they can be laser-marked as an extra option. Details on the marking
format are included in KEMET Surface Mount catalog F3102.
In general, the information in the KEMET Surface Mount catalog F3102 applies to these
capacitors. The information in this bulletin supplements that in the catalog.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
