Technical Data Sheet
TRA-BOND 2151
March-2012
PRODUCT DESCRIPTION
TRA-BOND 2151 provides the following product
characteristics:
Technology
Appearance
Components
Product Benefits
Epoxy
blue
Two component - requires mixing
● Thermally conductive
● Electrically Insulating
● High adhesion
● Room temperature cure
100 : 9.5
Staking transistors, Diodes, Resistors,
Integrated circuits and Heat sensitive
components
Room Temperature or Heat Cure
-70 to 115 °C
Conductive adhesive
Many metals, Silica, Steatite, Alumina,
Sapphire, Glass, Plastics and Ceramics
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion, ppm/ºC
Glass Transition Temperature (Tg), °C
Thermal Conductivity, W/(m-K)
Hardness, Shore D
Electrical Properties:
Volume Resistivity, ohms-cm:
@ 25 °C
@ 75 °C
26
60
0.95
90
2.10×10
15
2.10×10
15
Mix Ratio, by weight -
Resin : Hardener
Typical Assembly
Applications
Cure
Operating Temperature
Application
Surfaces
TYPICAL PERFORMANCE OF CURED MATERIAL
Lap Shear Strength :
Alum to Alum:
Cured @ 65 °C for 2 hours
Cured @ 25 °C for 24 hours
Gold to gold:
Cured @ 65 °C for 30 minutes
N/mm² 20
(psi)
(2,850)
N/mm² 15
(psi)
(2,150)
N/mm² 6
(psi)
(880)
N/mm² 50
(psi)
(7,500)
0.49
26
TRA-BOND 2151 is a thixotropic, two-part adhesive that
develops strong, durable high-impact bonds at room
temperature, improving heat transfer while maintaining
electrical insulation. TRA-BOND 2151 bonds offer resistance to
salts, mild acids and alkalis, petroleum products, lubricating
oils and alcohol.
TRA-BOND 2151 passes NASA outgassing standards.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Mixed Properties:
Viscosity @ 25 °C, mPa∙s (cP):
rv#7, 10 rpm
Thixotropic Index (5/5 rpm)
Specific Gravity, g/cm³
Reactive solids contents, %
Pot life , minutes:
@ 25 grams
@ 100 grams
Work Life, hours:
@ 25 grams
@ 100 grams
Flash Point - See MSDS
40,000
1.7
2,300
100
45
35
1.5
1.25
Tensile Strength, cured 30 min @ 65ºC
IZOD Impact Resistance :
Ft. lbs/inch of notch
J/m
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
DIRECTIONS FOR USE
1. Carefully clean and dry all surfaces to be bonded.
2. Remove clamp and thoroughly mix the TRA-BOND 2151
epoxy adhesive system components in the handy BIPAX
mixing-dispenser package until color is uniform
throughout.
3. Apply this completely mixed adhesive to the prepared
surfaces, and gently press these surfaces together.
Contact pressure is adequate for strong, reliable bonds;
however, maintain contact until adhesive is completely
cured.
4. Some separation of components is common during
shipping and storage. For this reason, it is recommended
that the contents of the shipping container be thoroughly
mixed prior to use.
Cure Schedule
24 hours @ 25°C or
2 to 4 hours @ 65°C
TYPICAL CURING PERFORMANCE
The above cure profile is a guideline recommendation. Cure conditions
(time and temperature) may vary based on customers' experience and
their application requirements, as well as customer curing equipment,
oven loading and actual oven temperatures.
5. Some ingredients in this formulation provided in BIPAX,
TRA-PAX and bulk packaging may crystallize when
subjected to low temperature storage. A gentle warming
cycle of 52ºC for 30 minutes prior to mixing components
may be necessary. Crystallized epoxy components do
not react as well as liquid components and should be
redissolved prior to use for best results.
Not for product specifications
The technical data contained herein are intended as reference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
product.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage : 27 °C
Material removed from containers may be contaminated during
use. Do not return product to the original container. Henkel
Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Customer Service Representative.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Note
The data contained herein are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In light of the foregoing,
Henkel Corporation and
its affiliates (“Henkel”) specifically disclaims all warranties
expressed
or
implied,
including
warranties
of
merchantability or fitness for a particular purpose, arising
from sale or use of Henkel products. Henkel specifically
disclaims any liability for consequential or incidental
damages of any kind, including lost profits.
The discussion
herein of various processes or compositions is not to be
interpreted as representation that they are free from
domination of patents owned by others or as a license under
any Henkel patents that may cover such processes or
compositions. We recommend that each prospective user test
his proposed application before repetitive use, using this data
as a guide. This product may be covered by one or more
United States or foreign patents or patent applications.
Americas
+1.888.943.6535
Trademark usage
All trademarks in this document are trademarks and/or
registered trademarks of Henkel in the US and elsewhere.
Reference 0.6
Europe
+44.1442.278.000
Asia
+86.21.3898.4800
For the most direct access to local sales and technical support visit:
www.henkel.com/electronics
PCB设计
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