电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1206Q510J2GAL7025

产品描述Ceramic Capacitor, Multilayer, Ceramic, 200V, 5% +Tol, 5% -Tol, BP, -/+30ppm/Cel TC, 0.000051uF, 1206,
产品类别无源元件    电容器   
文件大小160KB,共8页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 详细参数 全文预览

C1206Q510J2GAL7025概述

Ceramic Capacitor, Multilayer, Ceramic, 200V, 5% +Tol, 5% -Tol, BP, -/+30ppm/Cel TC, 0.000051uF, 1206,

C1206Q510J2GAL7025规格参数

参数名称属性值
是否Rohs认证不符合
Objectid926578367
包装说明, 1206
Reach Compliance Codenot_compliant
ECCN代码EAR99
YTEOL7.82
电容0.000051 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度1.6 mm
JESD-609代码e0
长度3.07 mm
多层Yes
负容差5%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形式SMT
包装方法TR, Plastic, 7 Inch
正容差5%
额定(直流)电压(URdc)200 V
尺寸代码1206
温度特性代码BP
温度系数30ppm/Cel ppm/°C
端子面层Tin/Lead (Sn70Pb30) - with Nickel (Ni) barrier
宽度1.52 mm

文档预览

下载PDF文档
CERAMIC HIGH RELIABILITY
GENERAL INFORMATION GR900 SERIES
HIGH RELIABILITY — GR900
GR900 capacitors are intended for use in any application where
the chance of failure must be reduced to the lowest possible
level. While any well-made multilayer ceramic capacitor is an
inherently reliable device, GR900 capacitors receive special
attention in all phases of manufacture including:
— Raw Materials Selection
— Special Designs
— Clean Room Production
— Individual Batch Testing
— C-SAM (when applicable)
— Singular Batch Identity is Maintained
— Destructive Physical Analysis
These parts are well worth the added investment in comparison
to the cost of a device or system failure.
Typical applications include:
Medical, Aerospace, Communication Satellites, Radar, Guidance
Systems.
SCREENING AND SAMPLE TESTS
Each batch receives the following testing/inspections:
Preliminary:
1. Destructive Physical Analysis: (DPA) - A sample is pulled from
each lot and examined per EIA-469 and KEMET’s strict internal
void and delamination criteria. Sampling plan is per MIL-PRF-123.
2. C-SAM - May be performed on batches failing to meet the
DPA criteria for removal of marginal product. Not required on
each lot.
Group A
1. Thermal Shock
— Materials used in the construction of mul-
tilayer ceramic capacitors possess various thermal coefficients of
expansion. To assure maximum uniformity, each part is temper-
ature cycled in accordance to MIL-STD-202, Method 107,
Condition A with Step 3 being 125°C. Number of cycles shall be
20 (100% of lot).
2. Voltage Conditioning
— One of the most strenuous environ-
ments for any capacitor is the high temperature/high voltage test.
All units are subject to twice-rated voltage to the units at the max-
imum rated temperature of 125°C for a minimum of 168 hours
and a maximum of 264 hours. The voltage conditioning may be
terminated at any time during 168 hours to 264 hours time inter-
val that confirmed failures meet the requirements of the PDA dur-
ing the last 48 hours of 1 unit or .4% (100% of lot).
Optional Voltage Conditioning (Accelerated Voltage
Conditioning)
— All conditions of the standard voltage condi-
tioning apply with the exception of increased voltage and
decreased test time. Refer to MIL-PRF-123 for the proper formula.
*Step 5 is performed on chips at this point (100% of lot).
3. Dielectric Withstanding Voltage
— 250% of the dc rated volt-
age at 25°C (100% of lot).
4. Insulation Resistance
— The 25°C measurement with rated
voltage applied shall be the lesser of 100 GΩ or 1000 megohm-
microfarads (100% of lot).
*5. Insulation Resistance
— The 125°C measurement with
rated voltage applied shall be the lesser of 10 GΩ or 100
megohm-microfarads (100% of lot). For chips, 125°C IR is per-
formed prior to Step 3 above.
6. Storage
at 150°C for 2 hours minimum without voltage applied
followed by a 12-hour minimum stabilization period (temperature
characteristic BX only).
7. Capacitance
— Shall be within specified tolerance at 25°C
(100% of lot). (Aging phenomenon is taken into account for BX
dielectric to obtain capacitance.)
8. Dissipation Factor
— Shall not exceed 2.5% for X7R (BX)
dielectric, 0.15% for C0G (BP) dielectric at 25°C. (100% of lot.)
9. Percent Defective Allowable (PDA)
— The overall PDA is 8%
for parts outside the MIL-PRF-123 values. The PDA is per MIL-
PRF-123 for all parts that are valid MIL-PRF-123 values. The PD
includes steps 1 through 8 above with the following exceptions.
Capacitance exclusion - capacitance values no more than 5% or
.5pF, whichever is greater for BX characteristic or 1% or .3pF,
whichever is greater for BP characteristic beyond specified toler-
ance limit, shall be removed from the lot but shall not be consid-
ered defective for determination of the PD.
Insulation Resistance at 25°C — Product which is not acceptable
for twice the military limit but is acceptable per the military limit,
is removed from the lot but shall not be considered defective for
determination of the PD.
10. Visual and Mechanical Examination
— Performed per MIL-
PRF-123 criteria.
11. Radiographic Examination (Leaded Devices Only)
Radial devices receive a one-plane X-ray.
12. Destructive Physical Analysis (DPA)
— A sample is exam-
ined on each lot per EIA-469. Sampling Plan is per MIL-PRF-123.
STANDARD PACKAGING
All products are packaged in trays except C512 capacitors which
are packaged 1 piece per bag.
DATA PACKAGE
A data package is sent with each shipment which contains:
1.
Final Destructive Physical Analysis (DPA) report.
2.
Certificate of Compliance stating that the parts meet all applic-
able requirements of the appropriate military specification to the
best failure level to which KEMET is approved.
3.
Summary of Group A Testing.
12
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
请教,如何将带dm9000网络芯片的BSP修改为CS8900网络芯片的?
我觉得大概修改的步骤如下: 将CS8900的驱动复制到Drivers目录下,并修改Drivers目录下的dirs文件 修改Files下的platform.bib文件将CS8900的驱动添加,修改platform.reg文件将CS8900的驱动添 ......
snailsun 嵌入式系统
收到论坛的礼物,谢谢EE。
281958281959 不得不说,真的很好看,灯光也很舒服。 ...
RCSN 聊聊、笑笑、闹闹
通信高手指点
本人要做硕士论文,关于FPGA和WCDMA方面的,哪位高手指点,哪个方向比较好呢?感谢!...
870027359 无线连接
求Quick jack IOS源代码
之前还看到lpc的网站上是可以下的,现在需要申请了。 填了那个单子几次都没有音讯,麻烦哪位好心人共享一份。我的邮箱law2raul@163.com,多谢 ...
ahalice 工作这点儿事
S.E.T放电管,用于DVR中的浪涌和静电保护
坚持以“只为您的电路更安全”为宗旨的瞬雷电子,日前推出SPE06xx系列产品,作为其保护系列产品中的最新成员。 随着后级芯片集成化的程度越来越高,线径越来越细,其对防护器件反应速度的要求 ......
spsemi 工业自动化与控制
EEWORLD大学堂----信息安全概论(密码学)
信息安全概论(密码学):https://training.eeworld.com.cn/course/4080 本套信息安全概论视频教程由西安电子科技大学李晖老师主讲。参考教材有清华大学出版社出版杨波主编的《现代密码学》、 ......
老白菜 DIY/开源硬件专区

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1021  1757  1755  2442  1994  21  36  50  41  20 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved