电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1206F823M5RACAUTO7411

产品描述Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.082uF, 1206,
产品类别无源元件    电容器   
文件大小3MB,共23页
制造商KEMET(基美)
官网地址http://www.kemet.com
标准
下载文档 详细参数 全文预览

C1206F823M5RACAUTO7411概述

Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.082uF, 1206,

C1206F823M5RACAUTO7411规格参数

参数名称属性值
是否Rohs认证符合
Objectid274794006
包装说明, 1206
Reach Compliance Codecompliant
ECCN代码EAR99
YTEOL7.75
电容0.082 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度0.9 mm
JESD-609代码e3
长度3.2 mm
多层Yes
负容差20%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形式SMT
包装方法TR, Plastic, 13 Inch
正容差20%
额定(直流)电压(URdc)50 V
参考标准AEC-Q200
系列C(SIZE)F
尺寸代码1206
温度特性代码X7R
温度系数15% ppm/°C
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
宽度1.6 mm

文档预览

下载PDF文档
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC
(Commercial & Automotive Grade)
Overview
KEMET’s Ceramic Open Mode capacitor in X7R dielectric is
designed to significantly minimize the probability of a low IR or
short circuit condition when forced to failure in a board stress
flex situation, thus reducing the potential for catastrophic failure.
The Open Mode capacitor may experience a drop in capaci-
tance; however, a short is unlikely because a crack will not
typically propagate across counter electrodes within the device’s
“active area.” Since there will not be any current leakage associ-
ated with a typical Open Mode flex crack, there is no localized
heating and therefore little chance for a catastrophic and poten-
tially costly failure event.
Driven by the demand for a more robust and reliable com-
ponent, the Open Mode capacitor was designed for critical
applications where higher operating temperatures and mechani-
cal stress are a concern. These capacitors are widely used in
automotive circuits as well as power supplies (input and output
filters) and general electronic applications.
Concerned with flex cracks resulting from excessive tensile
and shear stresses produced during board flexure and thermal
cycling? These devices are available with KEMET's Flexible
termination technology which inhibits the transfer of board
stress to the rigid ceramic body, therefore mitigating flex cracks
which can result in low IR or short circuit failures. Although flex-
ible termination technology does not eliminate the potential for
mechanical damage that may propagate during extreme envi-
ronmental and handling conditions, it does provide superior flex
performance over standard termination systems. When combined
with flexible termination technology these devices offer the ultimate
level of protection against a low IR or short circuit condition. Open
Mode devices compliment KEMET's Floating Electrode (FE-
CAP) and Floating Electrode with Flexible Termination (FF-CAP)
product lines by providing a fail-safe design optimized for mid to
high range capacitance values. These devices exhibit a predict-
able change in capacitance with respect to time and voltage and
boast a minimal change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±15% from -55°C
to +125°C.
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
Ordering Information
C
Ceramic
1210
Case Size
(L" x W")
0805
1206
1210
1812
J
Specification/
Series
685
Capacitance
Code (pF)
K
Capacitance
Tolerance
K = ±10%
M = ±20%
3
Voltage
4 = 16 V
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
R
Dielectric
R = X7R
A
Failure Rate/
Design
A = N/A
C
Termination
Finish
1
C = 100%
Matte Sn
L = SnPb
(5% minimum)
TU
Packaging/Grade
(C-Spec)
2
See "Packaging
C-Spec
Ordering
Options Table"
below
F = Open Mode Two significant
J = Open Mode digits + number of
with Flexible
zeros
Termination
Additional termination finish options may be available. Contact KEMET for details.
1, 2
SnPb termination finish option is not available on automotive grade product.
2
Additional reeling or packaging options may be available. Contact KEMET for details.
1
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
1
请问要100K左右的RAM这个需求选STM32F4合适吗?
最近 要做个小东西 对单片机性能 要求不怎么高但内存要比较多 目测要60K到120K左右 的RAM 然后我看了下 STM32 F4系列的带128K内存的大概是几十块到一百左右. 其他的要求内存太少 要么太贵. ......
vd33 stm32/stm8
高价收购现有手持嵌入式或单片机RFID数据采集产品的方案
高价收购现有手持嵌入式或单片机RFID数据采集产品的方案 我现在有个项目要用手持的数据采集产品,现高价收购 要求如下: 1.提供原理图,PCB Layout 2.提供系统软件原代码 3.使用单片机或嵌 ......
healthfly 嵌入式系统
上海灵动微电子MM32使用笔记
项目上使用了STM32F031F6P6这一款单片机,ST的芯片疯涨所以换了国产灵动微电子的MM32F031F6P6, 随笔分享一下使用该芯片的一些注意事项。 以MM32F031系列单片机为例,说一下使用情况 ......
火辣西米秀 国产芯片交流
TI公司原厂的MSP430F5529
先上图http://g.search1.alicdn.com/img/bao/uploaded/i4/i4/14587029968278902/T1x2kcFnNbXXXXXXXX_%21%210-item_pic.jpg_210x210.jpg,参加竞赛时候,TI公司赞助的,自己拆开包装看了看,还没 ......
brett1753 淘e淘
这个里面的VBAT是什么啊??
146910 这个里面的VBAT是什么啊?? ...
1157421908 汽车电子
请问第六批LaunchPad寄送名单什么时候出来
请问第六批LaunchPad寄送名单什么时候出来,是不是和第七批结果一起出来?...
shengqun 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2406  1596  1557  259  1863  49  33  32  6  38 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved