电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1206A130F2GAG7411

产品描述Ceramic Capacitor, Multilayer, Ceramic, 200V, 1% +Tol, 1% -Tol, BP, -/+30ppm/Cel TC, 0.000013uF, 1206,
产品类别无源元件    电容器   
文件大小160KB,共8页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 详细参数 全文预览

C1206A130F2GAG7411概述

Ceramic Capacitor, Multilayer, Ceramic, 200V, 1% +Tol, 1% -Tol, BP, -/+30ppm/Cel TC, 0.000013uF, 1206,

C1206A130F2GAG7411规格参数

参数名称属性值
是否Rohs认证不符合
Objectid926562036
包装说明, 1206
Reach Compliance Codenot_compliant
ECCN代码EAR99
YTEOL7.82
电容0.000013 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度1.6 mm
JESD-609代码e4
长度3.07 mm
多层Yes
负容差1%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形式SMT
包装方法TR, Paper, 13 Inch
正容差1%
额定(直流)电压(URdc)200 V
系列C1206(BP,200V)
尺寸代码1206
温度特性代码BP
温度系数30ppm/Cel ppm/°C
端子面层Gold (Au)
宽度1.52 mm

文档预览

下载PDF文档
CERAMIC HIGH RELIABILITY
GENERAL INFORMATION GR900 SERIES
HIGH RELIABILITY — GR900
GR900 capacitors are intended for use in any application where
the chance of failure must be reduced to the lowest possible
level. While any well-made multilayer ceramic capacitor is an
inherently reliable device, GR900 capacitors receive special
attention in all phases of manufacture including:
— Raw Materials Selection
— Special Designs
— Clean Room Production
— Individual Batch Testing
— C-SAM (when applicable)
— Singular Batch Identity is Maintained
— Destructive Physical Analysis
These parts are well worth the added investment in comparison
to the cost of a device or system failure.
Typical applications include:
Medical, Aerospace, Communication Satellites, Radar, Guidance
Systems.
SCREENING AND SAMPLE TESTS
Each batch receives the following testing/inspections:
Preliminary:
1. Destructive Physical Analysis: (DPA) - A sample is pulled from
each lot and examined per EIA-469 and KEMET’s strict internal
void and delamination criteria. Sampling plan is per MIL-PRF-123.
2. C-SAM - May be performed on batches failing to meet the
DPA criteria for removal of marginal product. Not required on
each lot.
Group A
1. Thermal Shock
— Materials used in the construction of mul-
tilayer ceramic capacitors possess various thermal coefficients of
expansion. To assure maximum uniformity, each part is temper-
ature cycled in accordance to MIL-STD-202, Method 107,
Condition A with Step 3 being 125°C. Number of cycles shall be
20 (100% of lot).
2. Voltage Conditioning
— One of the most strenuous environ-
ments for any capacitor is the high temperature/high voltage test.
All units are subject to twice-rated voltage to the units at the max-
imum rated temperature of 125°C for a minimum of 168 hours
and a maximum of 264 hours. The voltage conditioning may be
terminated at any time during 168 hours to 264 hours time inter-
val that confirmed failures meet the requirements of the PDA dur-
ing the last 48 hours of 1 unit or .4% (100% of lot).
Optional Voltage Conditioning (Accelerated Voltage
Conditioning)
— All conditions of the standard voltage condi-
tioning apply with the exception of increased voltage and
decreased test time. Refer to MIL-PRF-123 for the proper formula.
*Step 5 is performed on chips at this point (100% of lot).
3. Dielectric Withstanding Voltage
— 250% of the dc rated volt-
age at 25°C (100% of lot).
4. Insulation Resistance
— The 25°C measurement with rated
voltage applied shall be the lesser of 100 GΩ or 1000 megohm-
microfarads (100% of lot).
*5. Insulation Resistance
— The 125°C measurement with
rated voltage applied shall be the lesser of 10 GΩ or 100
megohm-microfarads (100% of lot). For chips, 125°C IR is per-
formed prior to Step 3 above.
6. Storage
at 150°C for 2 hours minimum without voltage applied
followed by a 12-hour minimum stabilization period (temperature
characteristic BX only).
7. Capacitance
— Shall be within specified tolerance at 25°C
(100% of lot). (Aging phenomenon is taken into account for BX
dielectric to obtain capacitance.)
8. Dissipation Factor
— Shall not exceed 2.5% for X7R (BX)
dielectric, 0.15% for C0G (BP) dielectric at 25°C. (100% of lot.)
9. Percent Defective Allowable (PDA)
— The overall PDA is 8%
for parts outside the MIL-PRF-123 values. The PDA is per MIL-
PRF-123 for all parts that are valid MIL-PRF-123 values. The PD
includes steps 1 through 8 above with the following exceptions.
Capacitance exclusion - capacitance values no more than 5% or
.5pF, whichever is greater for BX characteristic or 1% or .3pF,
whichever is greater for BP characteristic beyond specified toler-
ance limit, shall be removed from the lot but shall not be consid-
ered defective for determination of the PD.
Insulation Resistance at 25°C — Product which is not acceptable
for twice the military limit but is acceptable per the military limit,
is removed from the lot but shall not be considered defective for
determination of the PD.
10. Visual and Mechanical Examination
— Performed per MIL-
PRF-123 criteria.
11. Radiographic Examination (Leaded Devices Only)
Radial devices receive a one-plane X-ray.
12. Destructive Physical Analysis (DPA)
— A sample is exam-
ined on each lot per EIA-469. Sampling Plan is per MIL-PRF-123.
STANDARD PACKAGING
All products are packaged in trays except C512 capacitors which
are packaged 1 piece per bag.
DATA PACKAGE
A data package is sent with each shipment which contains:
1.
Final Destructive Physical Analysis (DPA) report.
2.
Certificate of Compliance stating that the parts meet all applic-
able requirements of the appropriate military specification to the
best failure level to which KEMET is approved.
3.
Summary of Group A Testing.
12
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
FM4学习笔记一:安装
安装已经老声音长谈了,但我觉得有再说明一下的必要。因为好的开始是成功的一半,好多都是安装不好。对以后的学习造成了很大损失。甚至不愿再涉及该种芯片。 首选安装IAR V6.10 ,这个再光盘 ......
ddllxxrr DIY/开源硬件专区
wince下如何进行驱动调试,一定要用串口么??如果程序修改的话还要重新编译内核?
1.现在刚准备做wince的,我现在有些不明白如何进行调试,每次定制内核要用到几十分钟,我在调试硬件驱动的时候,为了考虑稳定性需要不断得进行修改代码,每次修改代码之后都要重新编译内核,太耗时了, ......
282767310 嵌入式系统
幸运的收到了5969的开发板
在拿到这款开发板后,发现这次活动真的是意义重大。...
littleHi 微控制器 MCU
【i.MX6ULL】驱动开发2——新字符设备开发模板
上篇文章介绍了字符设备的开发模板,但那是一种旧版本的驱动开发模式,设备驱动需要手动分配设备号再使用 register_chrdev进行注册,加载成功以后还需要手动使用mknod命令创建设备节点,比较麻 ......
DDZZ669 ARM技术
搞定这5个RC振荡电路让你的模拟设计顺畅很多
采用RC振荡的方法非常多,如文氏桥振荡等。这里介绍几种笔者常用的方法: 1.最简单的振荡器 39375 最简单的振荡器 这种振荡器特点是:T≈(1.4~2.3)R*C 电源波动将使频率不稳定,适 ......
fish001 模拟电子
LMV358声音定位麦克风传感器v1.0测试板
# LMV358声音定位麦克风传感器v1.0测试板 ### 信标车上可以安装前后两块LMV358声音定位麦克风传感器v1.0测试板,总共四个麦克风。 **目录 (Table of Contents)** # LMV358原理设计与仿 ......
bqgup 创意市集

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2227  2423  701  437  485  45  49  15  9  10 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved