State of the Art, Inc.
Thin Film Chip Resistor
M55342/10 RM1010
PROTECTIVE
ENCAPSULANT
PRECISION
THIN FILM
RESISTOR
99.6% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
PRETINNED
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
100
W
- 1M
W
0.1%, 1%, 2%, 5%
500 mW
75 Volts
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours (qualification)
High Temperature Exposure
CHARACTERISTICS*
H
E
±25
±0.1%
±0.1%
±0.1%
±0.2%
±0.2%
±0.5%
±0.1%
±50
±0.25%
±0.25%
±0.1%
±0.25%
±0.4%
±0.5%
±0.2%
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 H 10 B 100D R - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
TERMINATION MATERIALS:
SIZE CODE: /10 = RM1010
TEMPERATURE CHARACTERISTIC: E: ± 25ppm H: ± 50ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
B: Solderable wraparound
A: 0.1%
W
D: 1%
W
G: 2%
W
J: 5%
W
B: 0.1% K
W
E: 1% K
W
H: 2% K
W
K: 5% K
W
C: 0.1% M
W
F: 1% M
W
T: 2% M
W
L: 5% M
W
W: Gold wire bondable
MECHANICAL
INCHES
MILLIMETERS
.131
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.101 (.098 - .112)
.095 (.095 - .105)
.018 (.015 - .033)
.015 (.010 - .020)
.015 (.010 - .020)
.071 (.067 - .075)
.0105 grams
2.57
2.41
0.46
0.38
0.38
1.80
(2.49 - 2.84)
(2.41 - 2.67)
(0.38 - 0.84)
(0.25 - 0.51)
(0.25 - 0.51)
(1.70 - 1.91)
.101
.065
.033
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
NXP MCU
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