5.0x7.0mm
Surface Mount CMOS
Clock Oscillator Series
Models CWX813 and CWX823 in Stock at Digi-Key
Description
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630- 851- 4722
Fax: 630- 851- 5040
www.conwin.com
Features
Model CWX8xx - Series
5.0 x7.0mm Surface Mount Package
3.3V or 5.0V Operation
CMOS Output Logic
Frequency Stabilities Available:
+/-25ppm or +/-50ppm
Temperature Range: -20 to 70°C
Low Jitter <1pS RMS
Tri-State Enable/Disable
Tape and Reel Packaging
US Headquarters:
630-851-4722
European Headquarters:
+353-61-472221
The Connor-Winfield CWX8xx -
series is a RoHS compliant
5.0x7.0mm Surface Mount, Fixed
Frequency Crystal Controlled
Oscillator (XO). Designed for use
in applications requiring tight frequency
stability and low jitter. The surface mount
package is designed for high-density
mounting and is optimum for mass
production.
Absolute Maximum Rating
Parameter
Storage Temperature
Supply Voltage
Supply Voltage
Input Voltage
(Vcc=3.3Vdc)
(Vcc=5.0Vdc)
(Vcc)
(Vcc)
Units
Minimum
-55
-0.5
-0.5
-0.5
Nominal
-
-
-
-
Maximum
125
5.0
7.0
Vcc+0.5
Units
°C
Vdc
Vdc
Vdc
Note
Operating Specifications
Parameter
Frequenc y Range
Total Frequency Tolerance
Models CWX813-CWX815
Models CWX823-CWX825
Operating Temperature Range
Supply Voltage
Models CWX813-CWX823
Models CWX815-CWX825
Supply Current
Models CWX813-CWX823 (Vcc = 3.3Vdc)
Models CWX815-CWX825 (Vcc = 5.0Vdc)
(Icc)
-
-
-
-
30
45
mA
mA
(Vcc)
3.135
4.5
3.3
5.0
3.465
5.5
Vdc
Vdc
-25
-50
-20
-
-
-
25
50
70
ppm
ppm
°C
1
1
Units
(Fo)
Minimum
1.0
Nominal
-
Maximum
156.25
Units
MHz
Note
Input Characteristics
Parameter
Enable Voltage
Disable Voltage
(High)
(Low)
Units
(Vih)
(Vil)
Minimum
>70%Vcc
-
Nominal
-
-
Maximum
-
<30%Vcc
Units
Vdc
Vdc
Note
2
2
Output Characteristics
Parameter
Load
Models CWX813-CWX823
Models CWX815-CWX825
Voltage
(High)
(Low)
Duty Cycle at 50% of Vcc
Rise / Fall Time 10% to 90%
Start-Up Time
Period Jitter
Integrated Phase Jitter (BW=12kHz to 20MHz)
SSB Phase Noise at 10Hz offset
SSB Phase Noise at 100Hz offset
SSB Phase Noise at 1KHz offset
SSB Phase Noise at 10KHz offset
SSB Phase Noise at 100KHz offset
(LVCMOS)
(HCMOS)
(Voh)
(Vol)
-
-
Vcc-0.4
-
40
-
-
-
-
-
-
-
-
-
15
-
-
-
50
2
-
3
0.5
-60
-90
-125
-140
-145
-
50
-
0.4
60
6
10
5
1
-
-
-
-
-
pF
pF
Vdc
Vdc
%
ns
ms
ps RMS
ps RMS
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Units
Minimum
Nominal
Maximum
Units
Note
Package Characteristics
Bulletin
Page
Revision
Date
Sm126
1 of 2
02
07 Sep 2011
Package
Soldering Process
Hermetically sealed ceramic package
RoHS compliant, lead free. See solder profile on page 2.
Notes
1)
2)
Inclusive of calibration @ 25°C, frequency vs. temperature stability, supply voltage change, load change, shock and vibration,
10 years aging.
When the oscillator is disabled, the outputs are at high impedance. Output is enabled with no connection on pad 1.
Specifications subject to change without notice. All dimensions in inches. © Copyright 2008 The Connor-Winfield Corporation
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630-851-4722
Fax: 630-851-5040
www.conwin.com
Ordering Information
Test Circuit
CWX
Type:
Clock Series
5x7mm
8
Temperature Range:
8 = -20 to 70° C
1
Frequency Stability:
1 = +/-25 ppm
2 = +/-50 ppm
3
Supply Voltage:
3 = 3.3Vdc.
5 = 5.0Vdc.
-
16.384M
Output Frequency:
Frequency Format
-xxx.xM Min.*
-xxx.xxxxxxM Max.*
*Amount of numbers
after the decimal point.
M = MHz
Vcc
POWER
SUPPL
Y
A
PROBE
V
.01uf
1
4
3
OSCILLOSCOPE
OSC
2
CL
Example: CWX813-016.384M = LVCMOS Clock, -20 to 70°C, ±25ppm, 3.3V @ 16.384 MHz
INPUT for E/D
FREQ
COUNTER
Environmental Characteristics
Vibration:
Shock:
Soldering:
Solderability
Vibration per Mil Std 883E Method 2007.3 Test Condition A
Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B.
SMD product suitable for Convection Reflow soldering. Peak
temperature 260°C. Maximum time above 220°C, 60 seconds.
Solderability per Mil Std 883E Method 2003
Output Waveform
90%
50%
Pad Connections and Enable / Disable Function
Pad
1
2
3
4
Connection
Enable/Disable
Ground
Output
Vcc
Enable / Disable
Function (Pad 1)
High or Open
Low
Output
Enable
Disable (High Impedance)
10%
Package Outline
0.197
(5.0mm)
0.102
(2.60mm)
0.053
(1.30mm)
Suggested Pad Layout
.200
(5.08mm)
Vcc
.165
(4.2mm)
4
3
OUTPUT
CW 0810
CWX813
16.384MHZ
2
3
0.200
(5.08mm)
C-by
0.275
(7.0mm)
0.055
(1.40mm)
1
4
1
E/D
.078 TYP
(2.0mm)
2
GROUND
.070 TYP
(1.8mm)
Dimensional T
olerance: ± .008" (±0.2mm)
Bypass capacitor. C–by should be
,
ceramic capacitor
≥.01uf.
Tape and Reel Dimensions
Solder Profile
Temperature
260°C
260°C
.69
(17.5mm)
PIN 1
220°C
180°C
150°C
120°C
.31
.08
(2.0mm)
.21
(5.4mm)
(7.9mm)
8.46 DIA
(216mm DIA)
.08
(2.0mm)
9.84 DIA
(250mm DIA)
.157
(4.0mm)
0
120 S
Max.
Time
10 S
60 S
Max.
360 Sec. Max.
.08
(2.0mm)
3.15
(80mm)
.315
(8.0mm)
.06 DIA
(1.5mm DIA)
1.00 DIA
(25mm DIA)
.295 (7.5mm)
MEETS EIA-481A and EIAJ-1009B
2,000 PCS/REEL
SMMECH09
.07 (1.75mm)
.83 (16.0mm)
US Headquarters:
630-851-4722
European Headquarters:
+353-61-472221
Bulletin
Page
Revision
Date
SM126
2 of 2
02
07 Sep 2011
Specifications subject to change without notice. All dimensions in inches. © Copyright 2008 The Connor-Winfield Corporation
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
