Datasheet> 器件分类 > 无源元件> 电容器> C1210Q561M2XAG7210

文档预览

C1210Q561M2XAG7210: 产品描述Ceramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, BX, -/+15ppm/Cel TC, 0.00056uF, 1210,; 产品类别无源元件电容器; 文件大小160KB，共8页; 制造商KEMET(基美); 官网地址http://www.kemet.com

下载文档详细参数全文预览

C1210Q561M2XAG7210概述

Ceramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, BX, -/+15ppm/Cel TC, 0.00056uF, 1210,

C1210Q561M2XAG7210规格参数

参数名称	属性值
是否Rohs认证	不符合
Objectid	926492862
包装说明	, 1210
Reach Compliance Code	not_compliant
ECCN代码	EAR99
YTEOL	7.88
电容	0.00056 µF
电容器类型	CERAMIC CAPACITOR
介电材料	CERAMIC
高度	1.6 mm
JESD-609代码	e4
长度	3.07 mm
多层	Yes
负容差	20%
端子数量	2
最高工作温度	125 °C
最低工作温度	-55 °C
封装形式	SMT
包装方法	TR, Plastic, 13 Inch
正容差	20%
额定（直流）电压（URdc）	200 V
系列	C1210(BX,200V)
尺寸代码	1210
温度特性代码	BX
温度系数	15% ppm/°C
端子面层	Gold (Au)
宽度	2.56 mm

文档预览

下载PDF文档

全文
预览

CERAMIC HIGH RELIABILITY

GENERAL INFORMATION GR900 SERIES

HIGH RELIABILITY — GR900

GR900 capacitors are intended for use in any application where

the chance of failure must be reduced to the lowest possible

level. While any well-made multilayer ceramic capacitor is an

inherently reliable device, GR900 capacitors receive special

attention in all phases of manufacture including:

— Raw Materials Selection

— Special Designs

— Clean Room Production

— Individual Batch Testing

— C-SAM (when applicable)

— Singular Batch Identity is Maintained

— Destructive Physical Analysis

These parts are well worth the added investment in comparison

to the cost of a device or system failure.

Typical applications include:

Medical, Aerospace, Communication Satellites, Radar, Guidance

Systems.

SCREENING AND SAMPLE TESTS

Each batch receives the following testing/inspections:

Preliminary:

1. Destructive Physical Analysis: (DPA) - A sample is pulled from

each lot and examined per EIA-469 and KEMET’s strict internal

void and delamination criteria. Sampling plan is per MIL-PRF-123.

2. C-SAM - May be performed on batches failing to meet the

DPA criteria for removal of marginal product. Not required on

each lot.

Group A

1. Thermal Shock

— Materials used in the construction of mul-

tilayer ceramic capacitors possess various thermal coefficients of

expansion. To assure maximum uniformity, each part is temper-

ature cycled in accordance to MIL-STD-202, Method 107,

Condition A with Step 3 being 125°C. Number of cycles shall be

20 (100% of lot).

2. Voltage Conditioning

— One of the most strenuous environ-

ments for any capacitor is the high temperature/high voltage test.

All units are subject to twice-rated voltage to the units at the max-

imum rated temperature of 125°C for a minimum of 168 hours

and a maximum of 264 hours. The voltage conditioning may be

terminated at any time during 168 hours to 264 hours time inter-

val that confirmed failures meet the requirements of the PDA dur-

ing the last 48 hours of 1 unit or .4% (100% of lot).

Optional Voltage Conditioning (Accelerated Voltage

Conditioning)

— All conditions of the standard voltage condi-

tioning apply with the exception of increased voltage and

decreased test time. Refer to MIL-PRF-123 for the proper formula.

*Step 5 is performed on chips at this point (100% of lot).

3. Dielectric Withstanding Voltage

— 250% of the dc rated volt-

age at 25°C (100% of lot).

4. Insulation Resistance

— The 25°C measurement with rated

voltage applied shall be the lesser of 100 GΩ or 1000 megohm-

microfarads (100% of lot).

*5. Insulation Resistance

— The 125°C measurement with

rated voltage applied shall be the lesser of 10 GΩ or 100

megohm-microfarads (100% of lot). For chips, 125°C IR is per-

formed prior to Step 3 above.

6. Storage

at 150°C for 2 hours minimum without voltage applied

followed by a 12-hour minimum stabilization period (temperature

characteristic BX only).

7. Capacitance

— Shall be within specified tolerance at 25°C

(100% of lot). (Aging phenomenon is taken into account for BX

dielectric to obtain capacitance.)

8. Dissipation Factor

— Shall not exceed 2.5% for X7R (BX)

dielectric, 0.15% for C0G (BP) dielectric at 25°C. (100% of lot.)

9. Percent Defective Allowable (PDA)

— The overall PDA is 8%

for parts outside the MIL-PRF-123 values. The PDA is per MIL-

PRF-123 for all parts that are valid MIL-PRF-123 values. The PD

includes steps 1 through 8 above with the following exceptions.

Capacitance exclusion - capacitance values no more than 5% or

.5pF, whichever is greater for BX characteristic or 1% or .3pF,

whichever is greater for BP characteristic beyond specified toler-

ance limit, shall be removed from the lot but shall not be consid-

ered defective for determination of the PD.

Insulation Resistance at 25°C — Product which is not acceptable

for twice the military limit but is acceptable per the military limit,

is removed from the lot but shall not be considered defective for

determination of the PD.

10. Visual and Mechanical Examination

— Performed per MIL-

PRF-123 criteria.

11. Radiographic Examination (Leaded Devices Only)

—

Radial devices receive a one-plane X-ray.

12. Destructive Physical Analysis (DPA)

— A sample is exam-

ined on each lot per EIA-469. Sampling Plan is per MIL-PRF-123.

STANDARD PACKAGING

All products are packaged in trays except C512 capacitors which

are packaged 1 piece per bag.

DATA PACKAGE

A data package is sent with each shipment which contains:

Final Destructive Physical Analysis (DPA) report.

Certificate of Compliance stating that the parts meet all applic-

able requirements of the appropriate military specification to the

best failure level to which KEMET is approved.

Summary of Group A Testing.

推荐资源

低功耗CMOS集成运算放大器的研究与设计: 低功耗CMOS集成运算放大器的研究与设计...; linda_xia 模拟电子

求旋转LED程序: 结合电路图给个程序能流动显示汉字（什么字无所谓）。谢谢 ...; chenmoni 51单片机

ep-9npaj-3pr的主板集成网卡的驱动程序如何安装: ep-9npaj-3pr的主板集成网卡的驱动程序如何安装，请各位高手多多指教！谢谢了！...; mati1111 嵌入式系统

请教一下ISE调用Modelsim后仿跟Modelsim单独后仿有差异，该以哪个为准？: 最近做测试偶然发现用ISE10.1调用Modelsim SE 6.5进行时序仿真（Post-Route Simulation）的结果，跟用同样的网表文件和sdf文件放到Modelsim SE 6.5单独跑的结果不一样，想问一下这差异是来自哪 ......; cook246 FPGA/CPLD

TinyOS在MSP430F2618+CC2520以及CC2530平台上移植交流: 目前TinyOS还仅支持MSP430低端的MCU比如f1611，以及CC2420等射频芯片。针对MSP430高端系列单片机，以及TI推出的第二代射频芯片CC2520还未能支持前段时间把TinyOS移植到了上述平台上，基本功 ......; hwwr 无线连接

高效能人士的9种性格: 晚间读书读到美国人查尔斯·德兰诺（Charles Dreson）所著《高效能人士的9种性格》，觉得很受用；于是提炼和整理出主要思想，聊以自勉，并与朋友们共享。一、善思的性格：绝不掉进自我设限的怪 ......; wangqingtao 聊聊、笑笑、闹闹

器件捷径: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

热门器件

开源项目推荐更多

热门活动更多

热门文章更多

技术资料推荐更多