电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

RC1206AG1K30FKTB

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.3W, 1300ohm, 100V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP
产品类别无源元件    电阻器   
文件大小77KB,共3页
制造商Vishay(威世)
官网地址http://www.vishay.com
下载文档 详细参数 全文预览

RC1206AG1K30FKTB概述

Fixed Resistor, Metal Glaze/thick Film, 0.3W, 1300ohm, 100V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

RC1206AG1K30FKTB规格参数

参数名称属性值
是否Rohs认证不符合
Objectid145091818206
包装说明CHIP
Reach Compliance Codeunknown
ECCN代码EAR99
构造Rectangular
JESD-609代码e0
安装特点SURFACE MOUNT
端子数量2
最高工作温度155 °C
最低工作温度-55 °C
封装高度0.635 mm
封装长度3.18 mm
封装形式SMT
封装宽度1.57 mm
包装方法BULK
额定功率耗散 (P)0.3 W
额定温度70 °C
电阻1300 Ω
电阻器类型FIXED RESISTOR
尺寸代码1206
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子面层Tin/Lead (Sn90Pb10)
端子形状WRAPAROUND
容差1%
工作电压100 V

文档预览

下载PDF文档
End of Life February-2021
RC
www.vishay.com
Vishay Techno
Thick Film Chip Resistors, Alternate Terminations
FEATURES
• Suitable for solderable, epoxy bondable, or
wire bondable applications
Available
• Termination material: gold, platinum silver,
platinum palladium gold or solder coated
Available
non-magnetic terminations available
• Multiple styles, termination materials and
configurations, allow wide design flexibility
• Epoxy
bondable
or
wire
bondable
non-magnetic terminations available
• Flow solderable
• Custom sizes available
• Burn-in data available
• Automatic placement capability
• Termination style: 3-sided wraparound termination or
single termination flip chip standard; 5-sided wraparound
termination available
• Tape and reel packaging available
• Internationally standardized sizes
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts
with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details
STANDARD ELECTRICAL SPECIFICATIONS
GLOBAL
MODEL
CASE SIZE
POWER RATING
P
70 °C
W
MAXIMUM
WORKING
VOLTAGE
(1)
V
40
50
70
100
100
100
125
200
200
RESISTANCE
RANGE
(2)
Ω
TOLERANCE
±%
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
TEMPERATURE
COEFFICIENT
(3)
(-55 °C to +155 °C)
± ppm/°C
100
100
100
100
100
100
100
100
100
RC0540
0504
0.100
10 to 500K
RC0550
0505
0.100
10 to 500K
RC0575
0705
(4)
0.200
10 to 1M
RC5100
1005
0.250
10 to 1M
RC1100
1010
0.450
10 to 1M
RC1206
1206
0.300
10 to 1M
RC5150
1505
0.325
10 to 1M
RC7225
2208
0.525
10 to 1M
RC2010
2010
0.575
10 to 1M
Notes
(1)
Continuous working voltage shall be
P
x
R
or maximum working voltage, whichever is less.
(2)
Higher values available. Please consult factory.
(3)
± 100 ppm/°C standard thru 1 MΩ, ± 200 ppm/°C offered from 1.1 MΩ to 10 MΩ.
(4)
MIL case size 0705 and EIA case size 0805 are dimensionally the same.
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: RC0540AA1K00FKSB (preferred part number format)
R
GLOBAL
MODEL
RC
C
SIZE
0540
0550
0575
5100
1100
1206
5150
7225
2010
0
TERM
STYLE
5
4
0
A
A
1
K
0
0
TCR
F
K
S
B
TERM MATERIAL
G
= Non-magnetic
A
= Palladium silver
B
= Platinum gold
C
= Gold
D
= Platinum silver
E
= Platinum
palladium gold
RESISTANCE
VALUE
R=
Ω
K = kΩ
M = MΩ
100R
= 100
Ω
1K00
= 1 kΩ
1M00
= 1 MΩ
TOLERANCE
F
=±1%
G
=±2%
J
=±5%
K
= ± 10 %
M
= ± 20 %
SOLDER
TERMINATION PACKAGING
E
= Sn100
F
= Sn95/Ag5,
HSD
S
=
Sn62/Pb36/Ag2,
HSD
T
= Sn90/Pb10
N
= No solder
B
= Bulk
F
= T/R
(full reel)
1
= T/R
(1000 pcs)
5
= T/R
(500 pcs)
T
= T/R
(250 pcs
min.)
W
= Waffle
tray
A
= 3-sided
B
= Top only
C
= 5-sided
K
= 100 ppm
L
= 150 ppm
N
= 200 ppm
W
= 350 ppm
Historical Part Numbering: CR1AA1001F100S2 (will continue to be accepted)
CR
1
A
A
1001
F
100
S2
HISTORICAL
TERM
TERM
RESISTANCE
SOLDER
SIZE
TOLERANCE
TCR
MODEL
STYLE
MATERIAL
VALUE
TERMINATION
Note
• For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543).
Revision: 08-Feb-2021
Document Number: 68013
1
For technical questions, contact:
te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
vxworks中如何实现文件解压缩
我想将几个文件进行打包后下载到板子,然后进行解压缩,但不知道怎么做?各位可曾这样做过? ...
arkin 实时操作系统RTOS
请教一个循环流水灯的设计
比如有10个灯,连续点亮3个灯,从第1个开始亮,1,12,123,234,345,456,567,678,789,89 10,9 10 1,10 1 2,123……这样 原来是通过循环数组实现的,后来觉得那种方法有点二,多少个点就需要多 ......
littleshrimp 单片机
请问x264移植到arm7平台上怎么实现和优化,大致过程如何?(十万火急)
大家救救命吧,这个问题都困扰我好多天了,一直都没法解决,若是分还不够的话,在继续加昂...
fs3328787 ARM技术
想玩2500模块的可以看一下 这个是TI的列子 我之前测试CC2500模块用过
TI的列子 可以用 无线的东西不好搞 我调了很久才能收发 共享给大家...
clogord TI技术论坛
一起玩树莓派3+Win 10 IoT的痛苦体验
本帖最后由 shenlan1986 于 2016-11-10 22:58 编辑 微软针对树莓派推出的Win10IoT系统,在树莓派3的评测计划中就规划Win10 IoT系统的评测,收到了树莓派3后一直想好好体验下,按照评 ......
shenlan1986 嵌入式系统
构成虚地也要满足一定的条件?是什么?为什么?
(1)在同相放大电路中,输出通过反馈的作用,使得U(+)自动的跟踪U(-),这样U(+)-U(-)就会接近于0。好像两端短路,所以称“虚短”。 (2)由于虚短现象和运放的输入电阻很高,因而流经运放两个输入 ......
fish001 模拟与混合信号

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1646  1455  765  2889  2630  34  30  16  59  53 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved