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R0202GG-02-1103-G

产品描述Fixed Resistor, Thin Film, 0.25W, 110000ohm, 100V, 2% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP
产品类别无源元件    电阻器   
文件大小381KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准  
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R0202GG-02-1103-G概述

Fixed Resistor, Thin Film, 0.25W, 110000ohm, 100V, 2% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP

R0202GG-02-1103-G规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid1579482169
包装说明CHIP
Reach Compliance Codecompliant
ECCN代码EAR99
JESD-609代码e3
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TRAY
额定功率耗散 (P)0.25 W
额定温度70 °C
电阻110000 Ω
电阻器类型FIXED RESISTOR
尺寸代码0202
表面贴装YES
技术THIN FILM
温度系数50 ppm/°C
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状ONE SURFACE
容差2%
工作电压100 V

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Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
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