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2198230-2

产品描述SFP+ Enhanced 1x2, SAN Heatsink
产品类别连接器   
文件大小2MB,共4页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
标准
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2198230-2概述

SFP+ Enhanced 1x2, SAN Heatsink

2198230-2规格参数

参数名称属性值
外形尺寸SFP+
笼子类型联动
包括的散热器
Connector System缆到板
Sealable
连接器和端子端接到印刷电路板
端口矩阵配置1 x 2
端口数量2
数据速率(最大值) (Gb/s)16
散热器种类插针
散热器高度类SAN
散热器高度6.5 mm [ .256 in ]
PCB 端接方法通孔 - 免焊连接
PCB 安装方式通孔免焊连接
连接器安装类型板安装
笼子材料镍银
PCB 厚度(建议)2.25 mm [ .089 in ]
尾部长度2.05 mm [ .081 in ]
工组温度范围-55 – 105 °C [ -67 – 221 °F ]
适用于插拔式 I/O 产品SFP+ SMT 连接器
插拔式 I/O 应用SFP+ 增强型
Circuit ApplicationSignal
兼容的散热器
封装方法托盘, 盒和托盘
EMI 遏制特性类型外部弹簧
包括的光管

文档预览

下载PDF文档
8
THIS DRAWING IS UNPUBLISHED.
RELEASED FOR PUBLICATION
BY -
ALL RIGHTS RESERVED.
7
20
6
5
4
1
3
LOC
2
DIST
1
REVISIONS
P
LTR
DESCRIPTION
DATE
DWN
APVD
C
COPYRIGHT
20
MATERIAL:
CAGE ASSEMBLY:
0.25mm THICK NICKEL SILVER ALLOY
EMI SPRINGS: COPPER ALLOY
HEAT SINK: ALUMINUM
HEAT SINK CLIP: STAINLESS STEEL.
GP
00
B
REVISED PER ECR-18-002882
27FEB2018
IT
SH
2
FINISH:
HEAT SINK: ELECTROLESS NICKEL
HEAT SINK CLIP: PASSIVATE.
EMI SPRINGS: 0.8µm MIN MATTE TIN OVER
0.8µm MIN NICKEL, NON-PLATED EDGES PERMISSIBLE.
DATUM AND BASIC DIMENSIONS ESTABLISHED BY CUSTOMER.
PADS AND VIAS CHASSIS GROUND.
D
3
D
5
2198230-1,2,3,4
FINISHED ASSEMBLY WITH
PIN TYPE HEAT SINK
5. MATES WITH SFP MSA COMPLIANT RECIEVERS.
6. INTERPRETATION OF DATUM REFERENCE FRAME IN ACCORDANCE
WITH SECT 4.4.1.1 OR ASME Y14.5M-1994.
7
MINIMUM PC BOARD THICKNESS:
SINGLE SIDED: 1.5mm
DOUBLE SIDED: 2.25mm
HOLE PATTERN REPEATS FOR EACH PORT, SPACING BETWEEN
PORTS IS 14.25mm.
REFERENCE APPLICATION SPEC. 114-13120, HOLE A, FOR RECOMMENDED
DRILL HOLE DIAMETER AND PLATING THICKNESS.
REFERENCE APPLICATION SPEC. 114-13120, HOLE B, FOR RECOMMENDED
DRILL HOLE DIAMETER AND PLATING THICKNESS.
8
9
10
PCB GASKET
2198230-5,6,7,8
FINISHED ASSEMBLY WITH
FIN TYPE HEAT SINK
C
11. CERTAIN MATING TRANCEIVERS MAY REQUIRE ADDITIONAL PCB THICKNESS
THAT WOULD NEED TO BE DETERMINED BY THE CUSTOMER.
1-2198230-4
FINISHED ASSEMBLY WITH
PIN TYPE HEAT SINK, WITH BELLY GASKET
12. PRODUCT COMPLIES WITH SPECIFICATION SFF-8433 IMPROVED PLUGGABLE
FORM FACTOR FOR SFP+ GANGED CAGES.
13
14
14
C
DIMENSION APPLIES PRIOR TO INSERTION OF SFP MODULE.
WITH BELLY GASKET: RF ABSORBER
2X 14 0.1
PORT OPENING
2X 8.95 0.15
PORT OPENING
A
MAX
( 9.7 )
13
B
B
( 7.125 )
( 14.25 )
( 28.75 )
APPROXIMATE LOCATION
OF DATE CODE
11X ( 2.05 )
( 48.7 )
FIN TYPE
FIN TYPE
FIN TYPE
14
22.5
18.1
15.5
13.2
22.5
18.1
15.5
13.2
NETWORKING, SHORT
PCI
SAN
NETWORKING, TALL
2198230-8
2198230-7
2198230-5
2198230-6
PIN TYPE
FIN TYPE
PIN TYPE
PIN TYPE
PIN TYPE
22.5
NETWORKING, TALL
NETWORKING, SHORT
SAN
PCI
13
06OCT2011
06OCT2011
06OCT2011
NAME
NETWORKING, TALL
1-2198230-4
2198230-3
2198230-2
2198230-1
PART
NUMBER
A
2198230-4
A
PC BOARD
PIN TYPE
HEAT SINK
THIS DRAWING IS A CONTROLLED DOCUMENT.
DIMENSIONS:
TOLERANCES UNLESS
OTHERWISE SPECIFIED:
A
DESCRIPTION
DWN
CHK
C. VALENTINE
M. SCHMITT
M. SCHMITT
108-2364
TE Connectivity
2198230-1
MOUNTED BELLY TO BELLY
SCALE
3:1
MATERIAL
mm
APVD
0 PLC
1 PLC
2 PLC
3 PLC
4 PLC
ANGLES
FINISH
0.13
0.1
0.08
.05
.05
PRODUCT SPEC
APPLICATION SPEC
1
WEIGHT
114-13120
1
4805 (3/11)
2
-
Customer Drawing
A1
00779
SIZE
SFP+ ENHANCED 1X2 CAGE ASSEMBLY,
PRESS-FIT, EMI SPRINGS,
HEAT SINK
CAGE CODE
DRAWING NO
RESTRICTED TO
2198230
SCALE
2:1
SHEET
1
OF
4
REV
-
B

2198230-2相似产品对比

2198230-2 VS-5011-EFX-205X-2104M658326 VS-5012-DCE-205X-2104M658326 2198230-4
描述 SFP+ Enhanced 1x2, SAN Heatsink SAW Oscillator SAW Oscillator SFP+ Enhanced 1x2, Networking Heatsink

 
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